• The monthly packaging world
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• s.12
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• pp.73-80
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• 1994

`94 국제 포장재 생산 및 포장공정기술전(International Exhibition of Machinery and Materials for Package Processing and Production : IPP '94)이 월간 $\lceil$포장산업$\rfloor$과 ㈜경영전람 주최로 오는 26일부터 29일까지 나흘간 한국종합전시장 별관에서 열린다. 92년에 이어 두번째로 열리는 이번 IPP는 제품의 생산단계에

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2002.05a
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• pp.12-16
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• 2002

Soil, ground water and sea bed are exposed to continuous accumulation of polluted materials causing serious environmental damage. It has been reported that such pollution causes a massive mortality of fish stock in rivers by the resuspension of toxic chemicals during strong wind conditions. Therefore, it becomes apparent that there is an immediate demand for the restoration treatment of polluted river bed (or sea bed) sediment layers. Pollution levels of major rivers and ports such as Pal-dang, Kyung-an rivers, Ma-san port are becoming public concern and are posing a serious environmental threat. In particular, the pollution of Shi-hwa river has become a nation wide issue for last few years. In spite of such public concern, the pollution level of such rivers or port are getting worse everyday. In this study, an environmentally sound engineering package is introduced which helps to restore the polluted river bed or sea bed sediments. This engineering package is consisted of a suction facility followed by a series of mechanical, chemical as well as biological treatment units. The suction facility is designed to minimize the secondary pollution due to the resuspension of toxic materials during suction. The sea bed cleaning engineering package is designed to be installed on the top of a floating barge. Such combination of environmental plant and shipbuilding technology provides a cost-effective solution, minimizing the cost involved in the transportation between suction and treatment facilities.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.10
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• pp.1049-1056
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• 2014

Microelectronics components contain various materials with different coefficients of thermal expansion (CTE). Although a large amount of published data on the CTE of standard materials is available, it occasionally becomes necessary to measure this property for a specific actual material over a particular temperature range. A change in the temperature of a material causes a corresponding change in the output of the strain gage installed on the specimen because of not only the mechanical load but also the temperature change. In this paper, a detailed technique for CTE measurement based on these thermal characteristics of strain gages is proposed and its reliability is evaluated. A steel specimen, aluminum specimen, and copper specimen, whose CTE values are well known, were used in this evaluation. The proposed technique was successfully applied to the measurement of the CTE of a coreless package substrate composing of electronics packages.

• Korean Journal of Materials Research
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• v.1 no.4
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• pp.206-213
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• 1991

The crystallized solder glasses with the low melting temperature for electronic package were prepared with the compositions of 77-80wt% PbO, 4.5-6wt% ZnO, 7.5-8.5wt% $B_2O_3$, 1-2wt% CaO, and 0.5-2.0wt% $P_2O_5$ containing 3-7wt% $TiO_2$. The Characterization of the solder glasses were studied using DTA, SEM and XRD. Frit containing 3wt% $TiO_2$ had crytallzation temperature range of $420-440^{\circ}C$. The major crystalline phase was identified as $2PbO{\cdot}ZnO{\cdot}B_2O_3$ by X-ray diffraction. Frits containing 4 wt% $TiO_2$ consisted of crysalline Phases of $PbTiO_3$ and $2PbO{\cdot}ZnO{\cdot}B_2O_3$ in the temperature range of $420-440^{\circ}C$, When g1ass frit containing 5wt% $TiO_2$ were heat-treated in the temperature range of $440-460^{\circ}C$, major crytalline phase was perovskite lead titanate.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.45-50
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• 2006

Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.41-45
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• 2018

We have simulated the process induced warpage for panel level package using finite element method. Silicon chips of $5{\times}5mm^2$ were redistributed on $122.4{\times}93.6mm^2$ size panel and the total number of redistributed chips was 221. The warpage at each process step, for example, (1) EMC molding, (2) attachment of detach core, (3) heating, (4) removal of a carrier, and (5) cooling was simulated using ANSYS and the effects of detach core and carrier materials on the warpage were investigated. The warpage behaved complexly depending on the materials for the detach core and carrier. However, glass carrier showed the lower warpage than FR4 carrier regardless of detach core material, and the minimum warpage was observed when the glass was used for the detach core and carrier at the same time.

• Culinary science and hospitality research
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• v.9 no.4
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• pp.1-12
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• 2003

This study was conducted to evaluating the antioxidative activities of waffle by natural antioxidants combination (tocopherol, rosemary extract and tea polyphenol) and packaging. Waffle stored at $25^{\circ}C$ and 35$^{\circ}C$ for 70 days were evaluated for acid value, peroxide value and Q$_{10}$ value. Tocopherol, either alone or with rosemary and tea polyphenol, was highly effective in inhibiting lipid oxidation of waffle at $25^{\circ}C$ and 35$^{\circ}C$. Especially among them, rosemary extract exhibited the best synergistic effect, as determined by peroxide value measurement. Waffle was then packaged under the following packing materials (OPP/DL/VMCPP, PET/DL/VMCCP). As the temperature condition, the modified atmosphere decrease in waffle package and increase peroxide value. This result indicated that the PET package was more effective in reducing oxidation than the OPP package.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.21 no.10
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• pp.883-889
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• 2011

The brand sound of vehicle diesel engine is recently one of the important advantage strategies in the automotive company. Because various noise components masked under high frequency level can be audible in quieter driving situation. Many researches have been carried out for subjective and objective assessments on vehicle sounds and noises. In particular, the interior sound quality has been one of research fields that can give high quality feature to vehicle products. Vehicle interior noise above 500 Hz is usually controlled by sound package parts. The materials and geometries of sound package parts directly affect on this high frequency noise. This paper describes the sound quality evaluation method for the vehicle diesel engine noise to establish objective criteria for sound quality assessment. Considering the sensitivity of human hearing to impulsive sounds such as diesel noise, the human auditory mechanism was simulated by introducing temporal masking in the time domain. Furthermore, each of the human auditory organs was simulated by computer codes, providing reasonable analytical explanations of typical human hearing responses to diesel noise. This method finally provides the sound quality index of vehicle diesel engine noise that includes high frequency intermittent offensive sounds caused by impacting excitations of combustion and piston slap.

• Journal of the Semiconductor & Display Technology
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• v.19 no.1
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• pp.29-35
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• 2020

The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.5
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• pp.353-357
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• 1998

Cracking problem of Epoxy Molding Compound(EMC) is critical for the reliability of the plastic package during temperature cycling and IR-reflow condition. Fracture toughness of EMC, which is defined as the resistance of EMC to the crack propagation, is a useful factor in ht estimation of EMC against package crack. Thus, development of EMC having high fracture toughness at a given loading condition would be important for confirming the integrity of package. In this study, toughness of several EMC was measured by varying the test conditions such as temperature, loading speeds, and weight percent of filler in order to quantify the variation of toughness of EMC under various applicable conditions. It was found from the experiments that toughness of all EMC has following trends, i.e., it rapidly decreases over the glass transition temperature, remains almost same or little decreases below $0^{\circ}C$. It decreases with the growth of cross head speed in EMC and the weight percent of filler as the degree of brittleness of EMC increases with the amount of filler content.