• Journal of Advanced Research in Ocean Engineering
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• 제1권4호
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• pp.211-226
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• 2015

Membrane type Mark III cargo containment system (CCS) is considered in this study to investigate its strength capability under applied loads due to liquefied natural gas (LNG) cargo. A rectangular plated structure supported by inner hull structure is exemplified from Mark III CCS according to classification society's guidance and it is assumed as multi-layered structure by stacking plywood, triplex, reinforced polyurethane (PU) foam and series of mastic upon inner hull structure. Commercially available general purpose finite element analysis package is used to have reliable FE models of Mark III CCS plate. The FE models and anisotropic failure criteria such as maximum stress, Hoffman, Hill, Tsai-Wu and Hashin taking into account the direction dependent material properties of Mark III CCS plate components and their material properties considering a wide variation of temperature due to the nature of LNG together form the strength analysis procedure of Mark III CCS plate. Strength capability of Mark III CCS plate is understood by its initial failure and post-initial failure states. Results are represented in terms of failure loads and locations when initial failure and post-initial failures are occurred respectively. From the results the basic design information of Mark III CCS plate is given.

• Composites Research
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• 제16권4호
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• pp.59-65
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• 2003

샌드위치 구조물의 응용된 형태인 스마트 스킨 구조물을 ABAQUS로 유탄요소 해석하였다. 심재로 쓰이는 하니컴은 일반적으로 두께 방향 강성 및 전단 강성만 제작회사에 의하여 제공된다. 이를 바탕으로 하니컴 재료의 물성을 추정하여 다른 방향의 제공되지 않는 물성을 계산하였고, 이를 유탄요소 해석시 물성 자료로 적용하였다. 또한, 스마트 스킨 구조물의 좌굴 및 3점 굽힘 거동을 유한요소 해석하였으며, 기존의 실험결과 및 이론값과 비교 분석하였다. 비교적 결과가 잘 일치하였다. 본 연구를 통하여서 하니컴의 물성을 상용 패키지에 적용하는 방법 및 타당한 근거를 제시하였고, 이 결과를 바탕으로 스마트 스킨 구조물을 상용패키지로 유한요소 해석시 지침을 제시할 수 있다

• 한국전기전자재료학회논문지
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• 제26권10호
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• pp.778-784
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• 2013

In order to develop a LED luminaire for naval-submarines which can replace a conventional one with two-compact fluorescent lamp (CFL) of 18 W, we analyzed the electrical and optical performance of the conventional luminaire. A LED luminaire was fabricated as compact as possible based on the analyzed data. The weight of the prototype LED luminaire is 1.8 kg, reducing up to 58% of the conventional one. The use of LED package for the submarine luminaire could reduce the power consumption from 38 W to 14.5 W with the same optical performance. The reason is that the optical efficacy of the LED luminaire improved by 2.47 times as 61.9 lm/W, compared to 25.1 lm/W for the conventional one.

• 한국전기전자재료학회논문지
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• 제18권7호
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• pp.589-593
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• 2005

The electronic states of ZnO doped with Al, Ga and In, which belong to III family elements in periodic table, were calculated using the density functional theory. In this study, the calculation was performed by two Programs; the discrete variational Xa (DV-Xa) method, which is a sort of molecular orbital full potential method; Vienna Ab-initio Simulation Package (VASP), which is a sort of pseudo potential method. The fundamental mixed orbital structure in each energy level near the Fermi level was investigated with simple model using DV-Xa. The optimized crystal structures calculated by VASP were compared to the measured structures. The density of state and the energy levels of dopant elements were shown and discussed in association with properties.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.271-271
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• 2010

$BaTiO_3$(BT) has high permittivity so that has been applied to dielectric and insulator materials in 3D system-level package integration. In order to achieve excellent performance of device, the BT layer should be highly dense. In this study, BT thick films were prepared by the inkjet printing method. And these films were cured at $280^{\circ}C$ after infiltration of polymer resin. As a result, we have successfully fabricated not only the inkjet-printed hybrid BT film but also metal-insulator-metal(MIM) capacitor without sintering process. Changes in the dielectric constant of BT hybrid film with particle size and packing density were investigated. The dielectric constant was increased with increasing packing density and particle size. Further, the BT hybrid film using two different size particles had even higher packing density and dielectric constant.

• 대한기계학회논문집A
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• 제25권11호
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• pp.1785-1795
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• 2001

A multi-layered brick element fur the finite element method is developed for analyzing the three-dim-ensionally layered composite structures subjected to both thermal and mechanical boundary conditions. The element has eight nodes with one degree of freedom for the temperature and three for the display-ements at each node, and can contain arbitrary number of layers with different material properties with-in the element; the conventional element should contain one material within an element. Thus the total number of nodes and elements, which are needed to analyze the multi-layered composite structures, can be tremendously reduced. In solving the global equation, a partitioning technique is used to obtain the temperature and the displacements which are caused by both the mechanical boundary conditions and temperature distributions. The results by using the developed element are compared wish the commercial package, ANSYS and the conventional finite element methods, and they are in good agreement. It is also shown that the Number of nodes and elements can be tremendously reduced using the element without losing the numerical accuracies.

• ETRI Journal
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• 제34권5호
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• pp.706-712
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• 2012

In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed to form low-volume solder bumps on a through silicon via (TSV) chip for the 3D IC integration through the conventional reflow process. To obtain the optimized volume of solder bumps using the SBM, the effect of the volumetric mixing ratio of resin and solder powder is studied in this paper. A no-flow underfill material named "fluxing underfill" is proposed for a simplified stacking process for the 3D IC integration. It can remove the oxide layer on solder bumps like flux and play a role of an underfill after the stacking process. The bumping process and the stacking process using the SBM and the fluxing underfill, respectively, for the TSV chips are carefully designed so that two-tier stacked TSV chips are sucessfully stacked.

• 한국정밀공학회지
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• 제30권12호
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• pp.1237-1243
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• 2013

This study has focused on the effect of ultrasonic vibration table in ELID grinding process of aluminum nitride ceramics. Aluminum nitride ceramics has superior physical and chemical properties and widely used in IC, LSI substrate, package and so on. To achieve the high effective machining of brittle and high strength ceramics as like aluminum nitride, machining method combined ELID grinding and ultrasonic vibration has been adopted in this study. From the experimental results, material removal rate, MRR has been increased maximum 36 percent and spindle resistance has been decreased in using ultrasonic table. Surface roughness of ground surface became a little worse in using ultrasonic table but was somewhat improved in feed direction.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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• pp.129-132
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• 2004

This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 sccm at a supplied voltage of 100 V with a 50 % duty cycle, maximum non-linearity was 2.24 % FS and leak rate was $3.03{\times}10^{-8}\;pa{\cdot}m^3/cm^2$. Therefore, the fabricated MCA valve is suitable for a variety of flow control equipment, a medical bio-system, automobile and air transportation industry.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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• pp.26-29
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• 2004

High density plasma fluorinated silicate glass (HDP FSG) is used as a gap fill film for metal-to-metal space because of many advantages. However, FSG films can cause critical problems such as bonding issue of top metal at package, metal contamination, metal peel-off, and so on. It is known that these problems are caused by fluorine penetration out of FSG film. To prevent it, FSG capping layers such like SRO (Silicon Rich Oxide) are needed. In this study, their characteristics and a capability to block fluorine penetration for various FSG capping layers are investigated. Normal stress and High stress due to denser film. While heat treatment to PETEOS caused lower blocking against fluorine penetration, it had insignificant effect on SiN. Compared with other layers, SRO using ARC chamber and SiN were shown a better performance to block fluorine penetration.