1 |
Ohmori, H. and Nakagawa, T., "Mirror Surface Grinding of Silicon Wafer with Electrolytic Inprocess Dressing," Annals of the Int. Academy for Prod. Eng., Vol. 37, No. 1, pp. 329-332, 1990.
|
2 |
Kwak, T., "Machining Properties to Nano-Level Mirror Surface Finishing for Fine Grained WCCo18% Alloy using Magnetic Polishing Slurry," J. of the Korean Ceramic Society, Vol. 46, No. 1, pp. 102-107, 2009.
과학기술학회마을
DOI
ScienceOn
|
3 |
Kim, Y., Kwak, T., and Kim, K., "Mirror-surface Machining Properties of Structural Ceramics using Diamond Abrasives," J. of the Korean Ceramic Society, Vol. 47, No. 4, pp. 290-295, 2010.
과학기술학회마을
DOI
ScienceOn
|
4 |
Kang, J., "A Study on an Ultrasonic Vibration Assisted Grinding for Ceramics," Kor. Soc. of Auto. Eng., Vol. 4, No. 5, pp. 37-48, 1996.
|
5 |
Stephan, P. M., "Enhance Machining with Ceramics," ACSB, Vol. 71, No. 11, pp. 1623-1629, 1992.
|
6 |
Choi, S., Lee, H., Rhee, J., and Lee, I., "Sintering of Aluminum Nitride (I): Pressureless Sintering," Journal of the Korean Ceramic Society., Vol. 28, No. 6, pp. 457-464, 1991.
과학기술학회마을
|
7 |
Kwak, T. and Ohmori, H., "Nano-level Micro Surface Machining Technology for SiC Ceramics Mirror," J. Kor. Soc. Prec. Eng., Vol. 23, No. 6, pp. 29-36, 2006.
|