• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.504-505
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• 2007

In 2004, a department of engineering education was established at Virginia Tech and Purdue university in the United States. Innovation of engineering education for improving the quality of engineering college education has been progressing. Content of subject of engineering exploration was developed newly for engineering college freshmen. And, effect of a sustainable energy design project on academic achievement for engineering freshmen at Virginia Tech in 2006 was researched. The project was performed throughout a 6 weeks period with one by 50 minutes lecture by professor and one 90 minutes workshop by TAs (Teaching Assistants) every week. To analyze the data, statistical package SPSS (ver. 15.0) was used. In responses to an open-ended question about freshmen students' perceptions of their improvement in design skills, the 3 most identified skills were teamwork, design process, knowledge. In, Korea, an innovation relating to engineering curriculum, facility, instructional strategy and so on will be required.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.4 no.1
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• pp.33-40
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• 1997

The microbial growth of fresh, vacuum packaged, cook-in-bag uncured beef patties was determined in two film structures, a commercial (PE/EVOH), and super barrier ($SiO_2$ coated polyester) material. Packaged samples were cooked to internal temperature of 71 and $82^{\circ}C$ for 30 minutes, and stored in temperature abused ($23{\pm}2^{\circ}C$) and refrigerated storage ($4-6^{\circ}C$). Barrier properties had a significant effect (p<0.001) on aerobic and mesophilic growth in the abused condition. Cooking temperatures had a statistically significant effect (p<0.05) on aerobic growth in the refrigerated condition. The growth of anaerobes and psychrophiles were not significantly effected by either variables. Storage times had the most significant effect (p<0.001) for all groups of microorganisms. The physical properties of the commercial film (strength, thickness, and shrinkage) were changed after exposure to thermal treatment, while the super barrier package had actually no change.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.10
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• pp.1644-1652
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• 2003

The monitor product is packed by cushioning materials because the monitor can be broken during transportation. However, the addition of the cushioning material increased the volume of the product. Therefore, it is required that the usage of cushioning material be minimized. In practice, design engineers have followed the ad hoc design with experiences of predecessors. Automation of the design process is very important for the reduction of engineering cost, and can be achieved by an excellent design process and software development. According to Axiomatic design, a design flow is defined and a software system is developed for automated design. At first, a basic model is defined. A user can modify the model from menus and design is carried out according to the input from the user. Finite element models are automatically generated based on the design. A nonlinear finite element analysis program called LS/DYNA3D is linked for the impact analysis. The process of Design of Experiments using orthogonal array is installed to minimize the maximum acceleration in drop test. Therefore, a new design can be proposed by the system. The program is designed according to the Independence Axiom of Axiomatic design. FRs and DPs of the software system are defined and decomposed by zigzagging process. Independent modules can be generated by analysis of the full design matrix and each module is coded as class in Object Oriented Programming (OOP). Design results are discussed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.11
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• pp.3538-3548
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• 1996

In this study, as a part of basic study for developing the simulation program for the assemssment of reliability of electronic EMC packaging which covers from EMC mixing step to thermal analysis, comparison between a measured and predicted values of material properties of EMC and finitde element analysis of thermal stress are performed. For the experimental testing specimens of fifty, sixty hive and eighty percent filler($13\mu m$, spherical silica) weight fraction are fabricated using tranfer molding. Coefficient of thermal expansion, elastic modulus and thermla conductivity are measured using these specimens and then these measured values are compared with the predicted values by various equations ( such as dilute suspension method. self consistent method, generalized self consistent method, Hashin-Shtrikman's bounds. Shapery's bounds, Nielsen's method and others). Measured values are distributed within the upper and lower bounds of equations. Measured elastic modulus and coefficient of thermal expansion approaches closely the perdicted values with self consisten mehtod and upper bound of Shaperys equation respectively. However small differences of thermal conductivity between the different filler volume fraction are obserbed. FEM analysis indicates that firstly stress is concentrated at the corner section of EMC and secondly EMC with eighty percent filler weight fraction shows less thermal stress when package is cooling down and relatively high thermal stress when package is heating up.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.366-369
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• 2003

The vertical fountain plating system with the point contact has been used in semiconductor industry. But the plating shape in the opening of photoresist becomes gradated shape, because bubbles from the wafer surface are difficult to escape from the deep openings, vias. So, we designed the tilted electrode ring contact to get uniform bump height on all over the wafer and evaluated the film uniformity by SEM and $\alpha$-step. A photoresist was coated to a thickness of $60{\mu}m$ and vias were patterned by a contact aligner After via opening, solder layer was electroplated using the fountain plating system and the tilted electrode ring contact system. In $\alpha$-step measurement, film uniformities in the fountain plating system and the tilted electrode ring contact system were ${\pm}16%,\;{\pm}3.7%$ respectively. In this study, we could get high uniformity bumps by the tilted electrode ring contact system. So, tilted electrode ring contact system is expected to improve workability and yield in module process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.158-158
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• 2008

모바일 정보통신기기를 중심으로 실장모듈의 초소형화, 고집적화로 인해 접속단자의 피치가 점점 미세화 됨에 따라 플립칩 본딩용 접착제에 함유되는 무기충전제인 실리카 필러의 크기도 미세화되고 있다. 본 연구에서는 NCP (non-conductive paste)의 실리카 필러의 크기가 COB(chip-on-board) 플립칩 패키지의 신뢰성에 미치는 영향을 조사하였다. 실험에 사용된 실리카 필러는 Fused silica 3 종과 Fumed silica 3종이며 response surface 실험계획법에 따라 혼합하여 최적의 혼합비를 정하였다. 테스트베드로 사용된 실리콘 다이는 투께 $700{\mu}m$, 면적 5.2$\times$7.2mm로 $50\times50{\mu}m$ 크기의 Au 도금범프를 $100{\mu}m$ 피치, peripheral 방식으로 형성시켰으며, 기판은 패드를 Sn으로 finish 하였다. 기판을 플라즈마 전처리 후 Panasonic FCB-3 플립칩 본더를 이용하여 플립칩 본딩을 수행하였다. 패키지의 신뢰성 평가를 위해 $-40^{\circ}C{\sim}80^{\circ}C$의 열충격시험과 $85^{\circ}C$/85%R.H.의 고온고습시험을 수행하였으며 Die shear를 통한 접합 강도와 4-point probe를 통한 접속저항을 측정하였다.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.23-33
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• 1999

A finite element method was employed fort thermal and stress analyses of an IGBT module of 3-phase full bridge. The effect of material parameters such as substrate material, substrate area, solder thickness on the temperature and stress distributions of the module packages has been investigated. Thermal analysis results have also been compared by setting of boundary conditions such as equivalent heat transfer coefficient or constant temperature at a base metal surface of the package. The increase of ceramic substrate area up to 3 times does little contribution to the reduction(8.9%) of thermal resistance, while contributed a lot to the reduction(60%) of thermal stress. Thicker solder resulted in higher thermal resistance but did slightly reduced thermal stresses. It is revealed by the stress analysis that maximum stress was induced at the region of copper pads which are bonded with ceramic substrate.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.10
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• pp.849-856
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• 2012

Chip on board type white light emitting diode on metal core printed circuit board with high thixotropy silicone is fabricated by vacuum printing encapsulation system. Encapsulant is chosen by taking into account experimental results from differential scanning calorimeter, shearing strength, and optical transmittance. We have observed that radiant flux and package efficacy are increased from 336 mW to 450 mW and from 11.9 lm/W to 36.2 lm/W as single dome diameter is varied from 2.2 mm to 2.8 mm, respectively. Double encapsulation structure with 2.8 mm of dome diameter shows further significant enhancement of radiant flux and package efficacy to 667 mW and 52.4 lm/W, which are 417 mW and 34.8 lm/W at single encapsulation structure, respectively.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.19 no.1
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• pp.51-56
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• 2013

From the time the product is manufactured until it is carried and ultimately used, the product is subjected to some form of handling and transportations. During this process, the product can be subjected to many potential hazards. One of them is the damage caused by shocks. In order to design a product-package system to protect the product, the peak acceleration or G force to the product that causes damage needs to be determined. When a corrugated fiberboard box loaded with products is dropped onto the ground, part of the energy acquired due to the action of the gravitational acceleration during the free fall is dissipated in the product and the package in various ways. The shock absorbing characteristics of the packaging cushion materials are presented as a family of cushion curves in which curves showing peak accelerations during impacts for a range of static loads are shown for several drop heights. The new method for determining the shock absorbing characteristics of cushioning materials for protective packaging has been described and demonstrated. It has been shown that cushion curves can be produced by combining the static compression and impact characteristics of the material. The dynamic factor was determined by the iterative least mean squares (ILMS) optimization technique in which the discrepancies between peak acceleration data predicted from the theoretical model and obtained from the impact tests are minimized. The approach enabled an efficient determination of cushion curves from a small number of experimental impact data.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.11
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• pp.6419-6424
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• 2014

The use of the PMP (Protection Module Package) was proposed as a solution for the shorter battery lifetime. The PMP means that a protection circuit consists of a semiconductor single. In this study, basic research was carried out to select a suitable epoxy material of the EMC module through finite element analysis. First, the stress on the external force was compared by the flexural strength analysis. In the following thermal analysis, the temperature change of the EMC module and the internal part was compared using the calculated heating value. Finally, the filling ratio was compared with the injection of the melting epoxy in the EMC module.