• 한국결정성장학회지
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• 제9권2호
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• pp.240-244
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• 1999

화학기상증착법(CVD)을 사용하여 graphite 기판 위에 단층의 SiC와 SiC/C 경사기능층을 증착시켰다. 먼저 상업적인 전산 구조 해석 프로그램을 사용하여 열충격하에 있는 재료층 내부의 온도 분포 및 열응력 분포를 계산하였고, 계산에 의해 설계, 제작된 경사기능층 시편들의 열특성을 조사하였다. 열충격 시험결과, 경사기능층 시편들이 계면에서 매우 효율적인 열응력 이완특성을 나타내는 것을 알 수 있었고, $\Delta$T=1600K의 열충격에도 변형이 없음을 알 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.297-298
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• 2009

대부분의 반도체 소자의 고장 원인은 85%정도가 열로 인한 것이며, 고출력 LED는 인가된 에너지의 20%정도의 광으로 출력되며 나머지 80%가 열로 전환된다. 본 논문에서는 PMS-50과 KEITHLEY 2430을 이용하여 PCB 구조와 Via hole 구성에 따른 LED 패키지의 열적 광학적 특성을 분석하였다. 0.6mm의 Via hole을 가진 FR4 PCB의 열특성이 가장 우수하였으며, Via hole 0.6mm FR4 PCB의 경우 McPCB에 상응하는 광출력 특성을 보였다.

• 한국산업융합학회 논문집
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• 제3권1호
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• pp.69-75
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• 2000

Multichip packages are comprised of dissimilar materials which expand at different rates on heating. The differential expansion must be accommodated by the various structural elements of the package. A types of heat exposures occur operation cycles. This study presents a finite element analysis simulation of flip-chip among multichip. The effects of geometries and material properties on the reliability were estimated during the analysis of temperature and thermal stress of flip-chip. From the results, it could be obtained that the more significant parameters to the reliability of flip-chip arc chip power cycle, heat convection and height of solder bump.

• 산업공학
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• 제11권3호
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• pp.167-180
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• 1998

This study is concerned with the development of a project management system for the turnkey-based plant project, which will help the site manager to plan, control, and report the project progress. This system has been developed as one of the modules of the integrated information system for the H Heavy Industry Co. and is composed of five subsystems; project information system, drawing-material management system, process management system, project progress report system. A/S management system. it also integrates commercial project management package in order to schedule the project activities and report the project progress to the owner. The main purpose of the system is to provide project information, including drawing, material, and progress, to the site manger in the real time and to accumulate site know-how for the turnkey-based plant project.

• Structural Engineering and Mechanics
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• 제53권3호
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• pp.575-587
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• 2015

This paper focuses on vibration analysis of functionally graded cylindrical shell submerged in an incompressible fluid. The equation is established considering axial and lateral hydrostatic pressure based on first order shear deformation theory of shell motion using the wave propagation approach and classic Fl$\ddot{u}$gge shell equations. To study accuracy of the present analysis, a comparison carried out with a known data and the finite element package ABAQUS. With this method the effects of shell parameters, m, n, h/R, L/R, different boundary conditions and different power-law exponent of material of functionally graded cylindrical shells, on the frequencies are investigated. The results obtained from the present approach show good agreement with published results.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.543-546
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• 2001

So far, the design methods of quartz crystal resonator have been developed. Recently, as the electronic package and semiconductor modules become smaller, the need to minimize the sizes of crystal components grows larger. but Minimizing crystal plate sizes has limitations because its temperature-frequency characteristics is worse and unwanted resonances occur. so appropriate design of electrode size and crystal plates is necessary. In this palter, Two-dimensional governing equations for electroded piezoelectric crystal plates with general symmetry have been solved from deduced equations from three-dimensional equations of linear piezoelectricity in most cases. In practice, electroded piezoelectric crystal plates have three-dimensional geometry, so simplified 2-dimensional equations and 2-D modeling are insufficient for explaining its resonance modes and characteristics. So, three-dimensional FEM(finite element method) analysis is done and its effectiveness is verified from analyzing practical crystal resonator model.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.139-142
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• 2001

As microeletronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important for many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (5-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1993년도 추계학술대회 논문집
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• 한국전기전자재료학회논문지
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• 제17권3호
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• pp.272-277
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• 2004

The primary aim of this study is to investigate new semi-abrasive free slurry including acid colloidal silica and hydrogen peroxide for copper chemical-mechanical planarization (CMP). In general, slurry for copper CMP consists of colloidal silica as an abrasive, organic acid as a complex-forming agent, hydrogen peroxide as an oxidizing agent, a film forming agent, a pH control agent and several additives. We developed new semi-abrasive free slurry (SAFS) including below 0.5％ acid colloidal silica. We evaluated additives as stabilizers for hydrogen peroxide as well as accelerators in tantalum nitride CMP process. We also estimated dispersion stability and Zeta potential of the acid colloidal silica with additives. The extent of enhancement in tantalum nitride CMP was verified through anelectrochemical test. This approach may be useful for the application of single and first step copper CMP slurry with one package system.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.218-221
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• 2004

The electronic state of ZnO doped with Al, Ga and In, which belong to III family elements in periodic table, was calculated using the density functional theory. In this study, the program used for the calculation on theoretical structures of ZnO and doped ZnO was Vienna Ab-initio Simulation Package (VASP), which is a sort of pseudo potential method. The detail of electronic structure was obtained by the describe variational $X{\alpha}(DV-X{\alpha})$(DV-Xa) method, which is a sort of molecular orbital full potential method. The optimized crystal structures obtained by calculations were compared to the measured structure. The density of state and energy levels of dopant elements was shown and discussed in association with properties.