• 한국전기전자재료학회논문지
• /
• 제20권5호
• /
• pp.415-420
• /
• 2007

Generally, a diode package consists of the synthetic resin that has good durability but low thermal conductivity. The surface mounted type fast recovery diode was fabricated by using ceramic package. Its main manufacture processes are composed of soldering, sillicon coating and side termination. And it has various advantages that diode is small, easy manufacture and fast cooling. The electric characteristics of the diode such as reverse recovery time, breakdown voltage, forward voltage, and leakage current were 5.28 ns, 1322 V, 1.08 V, $0.45\;{\mu}A$, respectively.

• 한국전기전자재료학회논문지
• /
• 제29권2호
• /
• pp.75-78
• /
• 2016

This research was designed 700 level power MOSFET for smart LED driver ICs package. And we analyzed electrical characteristics of the power MOSFET as like breakdown voltage, on-resistance and threshold voltage. Because this research is important optimal design for smart LED ICs package, we designed power MOSFET with design and process parameter. As a result of this research, we obtained $60{\mu}m$ N-drift layer depth, 791.29 V breakdown voltage, $0.248{\Omega}{\cdot}cm^2$ on resistance and 3.495 V threshold voltage. We will use effectively this device for smart LED driver ICs package.

• 한국산업융합학회 논문집
• /
• 제2권2호
• /
• pp.131-137
• /
• 1999

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the energy release rate criterion. The package crack formation depend on various parameters such as chip set, chip size, package thickness, package width, material properties and the moisture content etc. The effects of chip set and the other parameters were estimated during the analysis of package cracks which were located in the edge of the upper interface of the chip and the lower interlace of the die pad. From the results, it could be obtained that the more significant parameters to effect the chip set are chip width.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
• /
• pp.119-123
• /
• 2001

In this paper, a new structure and fabrication method for the wafer level package(WLP) is presented. A packaged VLSI chip is encapsulated by a parylene(which is a low k material) layer as a dielectric layer and is molded by SUB photo-epoxy with dielectric constant of 3.0 at 100 MHz. The electrical parameters (R, L, C) of package traces are extracted by using the Maxwell 3-D simulator. Based on HSPICE simulation results, the proposed wafer level package can operate for frequencies up to 20GHz.

• 반도체디스플레이기술학회지
• /
• 제21권1호
• /
• pp.148-154
• /
• 2022

As the 4th industrial age approaches, the demand for semiconductors is increasing enough to be used in all electronic devices. At the same time, semiconductor technology is also developing day by day, leading to ultraprecision and low power consumption. Semiconductors that keep getting smaller generate heat because the energy density increases, and the generated heat changes the shape of the semiconductor package, so it is important to manage. The temperature change is not only self-heating of the semiconductor package, but also heat generated by external damage. If the package is deformed, it is necessary to manage it because functional problems and performance degradation such as damage occur. The package burn in test in the post-process of semiconductor production is a process that tests the durability and function of the package in a high-temperature environment, and heat dissipation performance can be evaluated. In this paper, we intend to review a new material formulation that can improve the performance of the adapter, which is one of the parts of the test socket used in the burn-in test. It was confirmed what characteristics the basic base showed when polyamide, a high-molecular material, and alumina, which had high thermal conductivity, were mixed for each magnification. In this study, functional evaluation was also carried out by injecting an adapter, a part of the test socket, at the same time as the specimen was manufactured. Verification of stiffness such as tensile strength and flexural strength by mixing ratio, performance evaluation such as thermal conductivity, and manufacturing of a dummy device also confirmed warpage. As a result, it was confirmed that the thermal stability was excellent. Through this study, it is thought that it can be used as basic data for the development of materials for burn-in sockets in the future.

• 한국콘텐츠학회논문지
• /
• 제16권1호
• /
• pp.42-51
• /
• 2016

오늘날 유통구조의 변화는 오프라인에서 온라인으로 급격하게 수요가 변화해 가고 있다. 이러한 현상은 상품을 편리하게 구입하고자 하는 소비자의 심리가 반영되어 있다고 할 수 있다. 농산물 역시 내용물을 보호하려는 안전성과 소비자들에게 신뢰를 줄 수 있는 브랜드 및 디자인이 어느때보다 중요하게 인식되어지고 있다. 특히, 딸기 과채류는 다른 과채류에 비해 껍질이 얇아서 약한 충격과 흔들림에도 상품의 품질이 떨어지기 때문에 패키지의 지기구조나 소재에 안정성 영향을 많이 받는다. 또한, 직거래 유통이 많은 과채류다보니 생산농가의 열약한 환경 때문에 패키지디자인이 다른 상품에 비해 경쟁력이 떨어지는 것이 현실이다. 즉, 딸기 수요가 날로 증가하는데 비해 딸기패키지는 생산자와 소비자 욕구에 충족하지 못한다는 점이다. 딸기판매에 경쟁력 강화를 위해서는 패키지개발의 기초연구가 시급한 실정이다. 패키지요소(형태, 소재, 디자인) 조사 분석을 통하여 패키지의 문제점을 파악하고, IPA MAP(중요도, 만족도)분석을 통하여 생산자와 소비지가 추구하는 개선점을 파악하고자 한다.

• Nuclear Engineering and Technology
• /
• 제30권5호
• /
• pp.462-469
• /
• 1998

A package to transport high-level radioactive materials is required to withstand normal transport and hypothetical accident conditions pursuant to the IAEA and domestic regulations. The package should maintain the structural safety not to release radioactive material in any condition. The structural safety of the package has been evaluated by tests using proto-type or scaled-down models, however, the method by analysis is gradually utilized due to recent advancement of computers and computer codes. In this paper, to evaluate the structural safety of a radioisotope package of the KAERI, the three dimensional impact analyses under 9m free drop and 1m puncture were performed with an explicit finite-element code, the LS-DYNA3D code. The maximum stress intensity on each part was calculated and the structural safety of the package was evaluated in accordance with the regulations.

• 마이크로전자및패키징학회지
• /
• 제22권1호
• /
• pp.27-34
• /
• 2015

The correlation between crack propagation and localized recrystallization are compared in a series of cross section analyses on thermal cycled edgebond and underfilm material applied wafer level chip scale package (WLCSP) components with a baseline of no-material applied WLCSP components. The results show that the crack propagation distribution and recrystallization region correlation can explain potential degradation mechanisms and support the damage accumulation history in a more efficient way. Edgebond material applied components show a shift of damage accumulation to a more localized region, thus potentially accelerated the degradation during thermal cycling. Underfilm material applied components triggered more solder joints for a more wider distribution of damage accumulation resulting in a slightly improved thermal cycling performance compared to no-material applied components. Using an analysis on localized distribution of recrystallized areas inside the solder joint showed potential value as a new analytical approach.

• Computers and Concrete
• /
• 제9권4호
• /
• pp.293-310
• /
• 2012

This paper discusses a new constitutive model called the high-rate brittle microplane (HRBM) model and also presents the details of a new software package called the Virtual Materials Laboratory (VML). The VML software package was developed to address the challenges of fitting complex material models such as the HRBM model to material property test data and to study the behavior of those models under a wide variety of stress- and strain-paths. VML employs Continuous Evolutionary Algorithms (CEA) in conjunction with gradient search methods to create automatic fitting algorithms to determine constitutive model parameters. The VML code is used to fit the new HRBM model to a well-characterized conventional strength concrete called WES5000. Finally, the ability of the new HRBM model to provide high-fidelity simulations of material property experiments is demonstrated by comparing HRBM simulations to laboratory material property data.

• 농업과학연구
• /
• 제39권1호
• /
• pp.151-159
• /
• 2012

This paper analyzes the consumers' preference for packaged apple and derives the measures to vitalize the distribution of packaged apple. To do this, survey was conducted for consumers in large cities, Seoul, Busan, and Daegu to observe their purchasing behavior and satisfaction both for packaged and unpackaged apple. Survey was focused to how they are satisfied with several attributes of package such as size, appearance, content, material, and label. On the basis of the survey results, the values of the package attributes were estimated. Survey results show that consumers tend to buy unpackaged apple rather than packaged apple. About 34 percent out of 313 respondents have ever purchased apple packed with paper box while only 10.5 percent have an experience to buy packaged apple with transparent box. Most respondents answered they preferred the package of five to six apples and 1.3 kilograms most. They preferred mid or large size apple. Estimation of the values of the package attributes using the conjoint analysis shows that consumers are giving the highest value to the price of packing material. It means that consumers are reluctant to the extra payment resulted from packing the apple. Therefore, the efforts to reduce the cost of packing apple should be made steadily. In order to vitalize the distribution of small packaged apple, the package should contain high quality apple with high sugar content, proper size, good appearance, and so on. And it needs to be promoted to the consumers that small packaged apple are not inferior to apple packed with paper box.