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Park Seong-yeon, On Seung-yoon, & Kim Seong-soo. "A study on the hardening process of EMC encapsulation to reduce warpage of ultra-thin semiconductor packages" In Korean Society of Precision Engineering Integrated Conference. Korean Society of Precision Engineering, 2020.
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Mangi Kim, & Jinwon Joo. "Thermal deformation analysis considering the viscoelasticity of WB-PBGA semiconductor packages" Korean Society of Mechanical Engineers Spring and Autumn Conference, 437-441,2011.
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Cha-Gyu Song, Kyung-Ho Kim, & Seong-Hoon Jwa, "Warpage of ultra-thin packages applied to mobile devices", The Korean Journal of Welding and Bonding, 29(1), 20-24, 2011.
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Jinho Hong, & Sang-eun Shim, "Development trends of thermally conductive polymer composites" Applied Chemistry for Engineering, 21(2), 115-128, 2010.
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Dae-Yeol Kim, Joo-Jung Kim, & Tae-Won Park, "Development of high heat dissipation CNT/polymer composite material for C-EPS ECU housing", Korea Society of Automotive Engineers Fall Conference and Exhibition, 2268-2274. 2011.
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Kim, Y. S., Kim, J. K., & Jeon, E. S, "Effect of the compounding conditions of polyamide 6, carbon fiber, and Al2O3 on the mechanical and thermal properties of the composite polymer", Materials, 12(18), 3047, 2019.
DOI
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Chang-Hyeon Sung, & Kyung-Sik Lee, "A study on the wear properties of engineering plastics for automobile parts", Korean Tribology Society Conference, 100-105, 2007.
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Choi Jeong-ran, Lee Young-sil, & Park Soo-jin, "Effects of the addition of electroless nickel-plated multi-walled carbon nanotubes on thermal conductivity and fracture toughness of alumina-reinforced epoxy composites", Polymers, 37(4), 449-454, 2013.
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Ji-eun Ahn, In-Han Kim, & Yong-Woon Kim, "Heat transfer analysis of the heat sink effect in the heat generating area of semiconductor test equipment" The Spring and Autumn Conference of the Korean Society of Mechanical Engineers, 805-809, 2015.
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Chungha Jeong, Won Seo, & Guseong Kim, "A study on the analysis of bending phenomena according to the influence factors of the FOWLP structure", Journal of Semiconductor Display Technology, 17(4), 42-45, 2018.
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Hwan Kim, "Therapeutic properties of ethoxysilyl bisphenol A type epoxy resin systems for next-generation semiconductor packaging materials", Journal of Semiconductor and Display Technology, 16.2: 19-26, 2017.
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