• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.504-505
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• 2007

In 2004, a department of engineering education was established at Virginia Tech and Purdue university in the United States. Innovation of engineering education for improving the quality of engineering college education has been progressing. Content of subject of engineering exploration was developed newly for engineering college freshmen. And, effect of a sustainable energy design project on academic achievement for engineering freshmen at Virginia Tech in 2006 was researched. The project was performed throughout a 6 weeks period with one by 50 minutes lecture by professor and one 90 minutes workshop by TAs (Teaching Assistants) every week. To analyze the data, statistical package SPSS (ver. 15.0) was used. In responses to an open-ended question about freshmen students' perceptions of their improvement in design skills, the 3 most identified skills were teamwork, design process, knowledge. In, Korea, an innovation relating to engineering curriculum, facility, instructional strategy and so on will be required.

• 한국포장학회지
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• 제4권1호
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• pp.33-40
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• 1997

The microbial growth of fresh, vacuum packaged, cook-in-bag uncured beef patties was determined in two film structures, a commercial (PE/EVOH), and super barrier ($SiO_2$ coated polyester) material. Packaged samples were cooked to internal temperature of 71 and $82^{\circ}C$ for 30 minutes, and stored in temperature abused ($23{\pm}2^{\circ}C$) and refrigerated storage ($4-6^{\circ}C$). Barrier properties had a significant effect (p<0.001) on aerobic and mesophilic growth in the abused condition. Cooking temperatures had a statistically significant effect (p<0.05) on aerobic growth in the refrigerated condition. The growth of anaerobes and psychrophiles were not significantly effected by either variables. Storage times had the most significant effect (p<0.001) for all groups of microorganisms. The physical properties of the commercial film (strength, thickness, and shrinkage) were changed after exposure to thermal treatment, while the super barrier package had actually no change.

• 대한기계학회논문집A
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• 제27권10호
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• pp.1644-1652
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• 2003

The monitor product is packed by cushioning materials because the monitor can be broken during transportation. However, the addition of the cushioning material increased the volume of the product. Therefore, it is required that the usage of cushioning material be minimized. In practice, design engineers have followed the ad hoc design with experiences of predecessors. Automation of the design process is very important for the reduction of engineering cost, and can be achieved by an excellent design process and software development. According to Axiomatic design, a design flow is defined and a software system is developed for automated design. At first, a basic model is defined. A user can modify the model from menus and design is carried out according to the input from the user. Finite element models are automatically generated based on the design. A nonlinear finite element analysis program called LS/DYNA3D is linked for the impact analysis. The process of Design of Experiments using orthogonal array is installed to minimize the maximum acceleration in drop test. Therefore, a new design can be proposed by the system. The program is designed according to the Independence Axiom of Axiomatic design. FRs and DPs of the software system are defined and decomposed by zigzagging process. Independent modules can be generated by analysis of the full design matrix and each module is coded as class in Object Oriented Programming (OOP). Design results are discussed.

• 대한기계학회논문집A
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• 제20권11호
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• pp.3538-3548
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• 1996

In this study, as a part of basic study for developing the simulation program for the assemssment of reliability of electronic EMC packaging which covers from EMC mixing step to thermal analysis, comparison between a measured and predicted values of material properties of EMC and finitde element analysis of thermal stress are performed. For the experimental testing specimens of fifty, sixty hive and eighty percent filler($13\mu m$, spherical silica) weight fraction are fabricated using tranfer molding. Coefficient of thermal expansion, elastic modulus and thermla conductivity are measured using these specimens and then these measured values are compared with the predicted values by various equations ( such as dilute suspension method. self consistent method, generalized self consistent method, Hashin-Shtrikman's bounds. Shapery's bounds, Nielsen's method and others). Measured values are distributed within the upper and lower bounds of equations. Measured elastic modulus and coefficient of thermal expansion approaches closely the perdicted values with self consisten mehtod and upper bound of Shaperys equation respectively. However small differences of thermal conductivity between the different filler volume fraction are obserbed. FEM analysis indicates that firstly stress is concentrated at the corner section of EMC and secondly EMC with eighty percent filler weight fraction shows less thermal stress when package is cooling down and relatively high thermal stress when package is heating up.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.366-369
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• 2003

The vertical fountain plating system with the point contact has been used in semiconductor industry. But the plating shape in the opening of photoresist becomes gradated shape, because bubbles from the wafer surface are difficult to escape from the deep openings, vias. So, we designed the tilted electrode ring contact to get uniform bump height on all over the wafer and evaluated the film uniformity by SEM and $\alpha$-step. A photoresist was coated to a thickness of $60{\mu}m$ and vias were patterned by a contact aligner After via opening, solder layer was electroplated using the fountain plating system and the tilted electrode ring contact system. In $\alpha$-step measurement, film uniformities in the fountain plating system and the tilted electrode ring contact system were ${\pm}16%,\;{\pm}3.7%$ respectively. In this study, we could get high uniformity bumps by the tilted electrode ring contact system. So, tilted electrode ring contact system is expected to improve workability and yield in module process.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.158-158
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• 2008

모바일 정보통신기기를 중심으로 실장모듈의 초소형화, 고집적화로 인해 접속단자의 피치가 점점 미세화 됨에 따라 플립칩 본딩용 접착제에 함유되는 무기충전제인 실리카 필러의 크기도 미세화되고 있다. 본 연구에서는 NCP (non-conductive paste)의 실리카 필러의 크기가 COB(chip-on-board) 플립칩 패키지의 신뢰성에 미치는 영향을 조사하였다. 실험에 사용된 실리카 필러는 Fused silica 3 종과 Fumed silica 3종이며 response surface 실험계획법에 따라 혼합하여 최적의 혼합비를 정하였다. 테스트베드로 사용된 실리콘 다이는 투께 $700{\mu}m$, 면적 5.2$\times$7.2mm로 $50\times50{\mu}m$ 크기의 Au 도금범프를 $100{\mu}m$ 피치, peripheral 방식으로 형성시켰으며, 기판은 패드를 Sn으로 finish 하였다. 기판을 플라즈마 전처리 후 Panasonic FCB-3 플립칩 본더를 이용하여 플립칩 본딩을 수행하였다. 패키지의 신뢰성 평가를 위해 $-40^{\circ}C{\sim}80^{\circ}C$의 열충격시험과 $85^{\circ}C$/85%R.H.의 고온고습시험을 수행하였으며 Die shear를 통한 접합 강도와 4-point probe를 통한 접속저항을 측정하였다.

• 마이크로전자및패키징학회지
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• 제6권4호
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• pp.23-33
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• 1999

유한요소법을 이용한 IGBT 3상 풀브릿지 모듈의 열.응력 해석을 수행하였다. 패키지 재료에 의한 영향을 살피고자 AIN과 $A1_2O_3$절연기판을 사용한 경우를 비교하였으며, 적층구조의 규격을 변화시켜 열해석 및 열응력 해석결과를 비교하였다. 열해석 경계조건 설정에 따른 차이를 비교하기 위하여 등가열전달계수 경계조건(FHTCC)과 일정온도 경계조건(CTC)으로 나누어 해석하였다. 절연기판 면적의 증가는 열저항 감소에 거의 기여하지 못하였으나 열응력 감소에는 상당한 효과를 보였는데, 기판면적이 3배 넓어지면 열저항 감소분은 $A1_2O_3$ 절연기판 모듈에서 8.9%정도, AIN 절연기판 모듈에선 1.5% 정도 감소하는데 그쳤으나 열응력은 최고 60%의 감소를 보였다. 또한 솔더의 두께가 증가할수록 열저항은 증가하였으나, 열응력은 감소 또는 일정하게 유지함을 확인하였다. 각 모듈에서 최대응력값은 모두 절연기판과 접촉된 상, 하부 Cu pad에서 발생하였으며 모듈 패키지 가장자리 부분보다는 중앙부의 응력값이 높았다.

• 한국전기전자재료학회논문지
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• 제25권10호
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• pp.849-856
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• 2012

Chip on board type white light emitting diode on metal core printed circuit board with high thixotropy silicone is fabricated by vacuum printing encapsulation system. Encapsulant is chosen by taking into account experimental results from differential scanning calorimeter, shearing strength, and optical transmittance. We have observed that radiant flux and package efficacy are increased from 336 mW to 450 mW and from 11.9 lm/W to 36.2 lm/W as single dome diameter is varied from 2.2 mm to 2.8 mm, respectively. Double encapsulation structure with 2.8 mm of dome diameter shows further significant enhancement of radiant flux and package efficacy to 667 mW and 52.4 lm/W, which are 417 mW and 34.8 lm/W at single encapsulation structure, respectively.

• 한국포장학회지
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• 제19권1호
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• pp.51-56
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• 2013

본 실험에서는 청과물의 포장 완충재로 사용되고 있는 골판지의 압축 및 충격특성을 이용하여 완충곡선(peak acceleration - static stress curve)을 구현하기 위한 알고리즘을 제시하였다. 본 연구에서 알 수 있듯이 한 개의 동적계수로도 완충곡선을 구현할 수 있음을 알 수가 있었으며, 기존의 완충곡선의 구현시 정적응력 범위 내에서의 실험횟수를 현저하게 줄일 수 있음을 알 수가 있었다. 또한, 골판지 완충재료 외에 플라스틱 발포체 완충재료에도 적용이 가능할 것으로 판단되었다.

• 한국산학기술학회논문지
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• 제15권11호
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• pp.6419-6424
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• 2014

스마트폰 배터리 사용시간이 짧아지는 문제의 해결방안으로 PMP(Protection Module Package)를 제안한다. PMP란 보호회로가 하나의 반도체로 구성하는 것을 의미한다. 이번 연구에서는 유한요소 해석을 통하여 EMC 모듈의 적합한 Epoxy 재질을 선정하기 위한 기반연구를 수행하였다. 먼저 굽힘강도 해석을 통하여 외부 힘에 대한 응력을 비교하였다. 다음 열해석에서, 계산한 발열량을 사용하여 EMC 모듈의 내부 부품의 온도 변화를 비교한다. 마지막으로, 충전률은 EMC 모듈 내의 용융된 에폭시를 주입하여 비교하였다.