• Journal of the Korean Society for Precision Engineering
• /
• v.14 no.12
• /
• pp.73-85
• /
• 1997

The rolling force and roll deformation behavior in the twin roll type strip continuous casting process has been computed to estimate the thermal charcteristics of a caster roll. To calculation of rolling force, the relationship between flow stress and strain for a roll material and casting alloy are assumed as a function of strain-rate and temperature because mechanical properties of a casting materials depends on tempera- ture. The three dimensional thermal dlastic-plastic analysis of a cooling roll has also been carried out to obtain a roll stress and plastic strain distributions with the commercial finite element analysis package of ANSYS. Temperature fields data of caster roll which are provided by authors were used to estimated of roll deformation. Roll life considering thermal cycle is calculated by using thermal elastic-plastic analysis results. Roll life is proposed as a terms of a roll revolution in the caster roll with and without fine failure model on the roll surface. To obtain of plastic strain distributions of caster roll, thermomechan- ical properties of roll sleeve with a copper alloy is obtained by uniaxial tensile test for variation of temperature.

• Steel and Composite Structures
• /
• v.50 no.1
• /
• pp.77-87
• /
• 2024

In this study, the two-dimensional crack problem was investigated by using the finite element method (FEM)-based ANSYS package program and the artificial neural network (ANN)-based multilayer perceptron (MLP) method. For this purpose, a half-infinite functionally graded (FG) layer with a crack pressed through two rigid blocks was analyzed using FEM and ANN. Mass forces and friction were neglected in the solution. To control the validity of the crack problem model exercised, the acquired results were compared with a study in the literature. In addition, FEM and ANN results were checked using Root Mean Square Error (RMSE) and coefficient of determination (R²), and a well agreement was found. Numerical solutions were made considering different geometric parameters and material properties. The stress intensity factor (SIF) was examined for these values, and the results were presented. Consequently, it is concluded that the considered non-dimensional quantities have a noteworthy influence on the SIF. Also FEM and ANN can be logical alternative methods to time-consuming analytical solutions if used correctly.

• Korean Journal of Metals and Materials
• /
• v.49 no.2
• /
• pp.180-186
• /
• 2011

Isothermal annealing and electromigration tests were performed at $125^{\circ}C$ and $125^{\circ}C$, $3.6{\times}10_4A/cm^2$ conditions, respectively, in order to compare the growth kinetics of the intermetallic compound (IMC) in the Cu/thin Sn/Cu bump. $Cu_6Sn_5$ and $Cu_3Sn$ formed at the Cu/thin Sn/Cu interfaces where most of the Sn phase transformed into the $Cu_6Sn_5$ phase. Only a few regions of Sn were not consumed and trapped between the transformed regions. The limited supply of Sn atoms and the continued proliferation of Cu atoms enhanced the formation of the $Cu_3Sn$ phase at the Cu pillar/$Cu_6Sn_5$ interface. The IMC thickness increased linearly with the square root of annealing time, and increased linearly with the current stressing time, which means that the current stressing accelerated the interfacial reaction. Abrupt changes in the IMC growth velocities at a specific testing time were closely related to the phase transition from $Cu_6Sn_5$ to $Cu_3Sn$ phases after complete consumption of the remaining Sn phase due to the limited amount of the Sn phase in the Cu/thin Sn/Cu bump, which implies that the relative thickness ratios of Cu and Sn significantly affect Cu-Sn IMC growth kinetics.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.2
• /
• pp.49-52
• /
• 2022

As the difficulty of flip chip products increase, interest in stable PKG material technology from the viewpoint of reliability is increasing. Currently, the representative of poor reliability that are mainly occurring in flip chip PKG are Sn bridge and Cu dendrite. Two type defects are caused by void generated by the flux residue around the bump. In order to essentially minimize the risk of this type of reliability failure, the linkage between the composition of Molded Under-fill (MUF) and flux, which is related material, was reviewed. In this study, the correlation between base resin and filler, which is the main component of MUF, and flux, was defined, and the material composition design was carried out by refer to lesson learn. With the current material composition, it was confirmed that moisture absorption reliability 85%/85%/24hrs pass result and void did not occur during destructive analysis, and developed MUF has shown flux immunity improving result in flip Chip PKG. We think this study can be used in yield enhancement of flip chip process and give insights to study in compatibility between MUF and flux.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.3
• /
• pp.31-36
• /
• 2018

This research scrutinizes the reason of failure after pressure cooker test (PCT) for DRAM device. We use the physical inspecting tools, such as microscope, SEM and TEM, and finally find the discolor phenomenon, corrosion of Al and delamination of inter-metal dielectric (IMD) in the failed devices after PCT. Furthermore, we discover the abnormal $Al_XO_Y$ layer on Al through the careful additional measurements. To find the reason, we evaluate the effect of package ball size and pinhole in passivation layer. Unfortunately, those aren't related to the problems. We also estimate halide effect of Al. The halogens such like Cl are contained within EMC material. Those result in the slight improving of PCT characteristics but do not perfectly solve the problems. We make a hypothesis of Galvanic corrosion. We can find the residue of Ti at the edge of pad open area. We can see the improving the PCT characteristics by the time split of repair etch. The possible mechanism of the PCT failure can be deduced as such following sequence of reactions. The remained Ti reacts on the pad Al by Galvanic corrosion. The ionized Al is easily react with the $H_2O$ supplied under PCT environment, and finally transfers to the abnormal $Al_XO_Y$ layer.

• Journal of Embryo Transfer
• /
• v.28 no.3
• /
• pp.297-302
• /
• 2013

Cryopreservation of epididymal spermatozoa offers a potential tool for rescuing genetic material from males of genetically elite populations. Castration, catastrophic injury, sudden death or any other event that makes semen collection or mating impossible may prematurely terminate a stallion reproduction. Stallion epididymal spermatozoa vary widely in the loss of progressive motility, acrosomal integrity, and viability during freezing and thawing. The objective of this work was to investigate the effect of (1) freezing package types on cryopreservation efficiency, (2) thawing temperatures (37, 56 or $70^{\circ}C$) on Computer Assisted Sperm Analysis (CASA) parameters and (3) post-thawing incubation time (0, 1, 2 or 4h) on castrated stallion epididymis. Post-thawed sperm motility ranged between 59.69% and 64.28% ($56^{\circ}C$ and $37^{\circ}C$) in various thawing temperatures. When stallion epididymis sperm was frozen, straw was better than freezing tube on VCL (Velocity of Curvilinear Line) and VAP (Velocity of Average Path) parameter. Higher percentage of motility was observed at $37^{\circ}C$ thawing temperature even though no significant difference was observed among various temperatures. The motility, VCL, ALH (Amplitude of Lateral Head displacement), VAP, BCF (Beat-Cross Frequency) and STR (Straightness index) parameter of post-thawed sperm were significantly decreased by increasing the incubation time for all thawing temperatures. The present study showed that type of freezing package (Straw vs. Freezing tube) was not significantly different on cryopreservation efficiency. Furthermore, stallion epididymal spermatozoa frozen-thawed at $37^{\circ}C$ for 1 min resulted the highest proportion of motility and velocity movement. In addition, motility and viability of frozen-thawed stallion epididymal spermatozoa were also decreased by incubation.

• Archives of design research
• /
• v.17 no.4
• /
• pp.97-106
• /
• 2004

Oukjuk becomes to known to the people and valuates due to the importance of the effect of the medicine. Known as taoist hermit plant, Oukjuk tea has called as a Solomon's Seal Tea in the western countries. Dissimilarly from other herb teas, it contains a high percentage of minerals. Because of the utility value of this, people used to use Oukjuk as an oriental medical treatment for various kinds of the condition of illness as for nutritive food or tonic material. According to the records, a sage of old or people seeking after truth had enjoyed the tea very much. In spite of these all effects, public has only a superficial understanding of the matter, Comprehending the problems, this study analyses ways and means of the functional packaging for the Solomon's Seal tea. In this research, the most problems came out with the quality of the products and the level of their packaging which is not variously in forms and not properly developed in materials and designs. As a conclusion the paper pointed out the importance of keeping the traditional high quality in product and having an appeal to packaging for customer's needs.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.21 no.1
• /
• pp.19-26
• /
• 2015

The carton for liquid products are divided into 'gable top carton' and 'aseptic carton'. Currently, these packages are being recycled in the toilet tissue manufacturing process. The recycling of the carton aluminium laminate is the most important problem facing the recycling procedure of the carton packages due to the reduction in quality of recycled materials. The polymer structure with synthetic resins being used mainly in beverage packaging is also one of the important factors for the procedure for its recycling. The objective of this study was to investigate the package material and structure of the carton for liquid products through marketing research and suggest the supplementation in the work processes of production, use, and recycling. The results represent to improve the recycling profit and the quality of recycled materials when a laminated aluminium of carton for liquid products is replaced to the transparent polymer film. The improvement of the sorting and recycling process may help their recycling efficiencies. In addition, the limited use of synthetic resin molded packaging and increase of wood-pulp collection rate will provide the improvement of the recycling profit and the quality of recycled materials.

• Polymer(Korea)
• /
• v.30 no.6
• /
• pp.519-524
• /
• 2006

Poly(4-vinyl pyridine) (PVP) and its copolymers, poly(4-vinyl pvridine- co-acrylamide) and poly(4-vinyl pyridine-co-allylamine), were synthesized and evaluated for application to organic solder-ability preservatives (OSP). The copolymers were synthesized by radical polymerization of vinyl pyridine in the presence of acrylamide or allylamine as a comonomer. Various kinds of polymers with different chemical composition were synthesized by varying the feed ratio of monomers and their low $M_w$ polymers can be obtained by adding 2-mercaptoethanol as a chain transfer agent during poly-merization. All the polymers showed good adhesion properties on Cu pad when they were spin-coated. Especially, allylamine -containing copolymers showed both good adhesion and solubility properties. Also, they exhibited better thermal stability than PVP homopolymer and such thermal properties were changed depending on the chemical composition and their $M_w$, which were evidenced by the measurement of oxygen induced temperature (OIT). From the OIT measurement, poly(4-vinyl pyridine- co-allylamine) was thermally stable up to $230^{\circ}C$ for 70 min in the 100% oxygen environment. As a result, allylamine-containing copolymers can be considered as a promising OSP coating material that has excellent thermal and adhesive properties applicable to the present microelectronic package processes.

• Korean Chemical Engineering Research
• /
• v.57 no.5
• /
• pp.628-636
• /
• 2019

In various industrial processes, piping serves as a link between unit processes and is an essential installation for internal flow. Therefore, the optimum design of the piping system is very important in terms of safety and cost, which requires the estimation of the pressure drop, flow rate, pipe size, etc. in the piping system. In this study, we developed a software that determines pressure drop, flow rate, and pipe size when any two of these design variables are known. We categorized the flows into single phase, homogeneous two phase, and separated two phase flows, and applied suitable calculation models accordingly. We also constructed a system library for the calculation of the pipe material, relative roughness, fluid property, and friction coefficients to minimize user input. We further created a costing library according to the piping material for the calculation of the investment cost of the pipe per unit length. We implemented all these functions in an integrated environment using a graphical user interface for user convenience, and C # programming language. Finally, we verified the accuracy of the software using literature data and examples from an industrial process with obtained deviations of 1% and 8.8% for the single phase and two-phase models.