Intermetallic Compound Growth Characteristics of Cu/thin Sn/Cu Bump for 3-D Stacked IC Package
![]() ![]() |
Jeong, Myeong-Hyeok
(School of Material Science and Engineering, Andong National University)
Kim, Jae-Won (School of Material Science and Engineering, Andong National University) Kwak, Byung-Hyun (School of Material Science and Engineering, Andong National University) Kim, Byoung-Joon (Department of Materials Science & Engineering, Seoul National University) Lee, Kiwook (R&D Center Amkor Technology Korea Inc.) Kim, Jaedong (R&D Center Amkor Technology Korea Inc.) Joo, Young-Chang (Department of Materials Science & Engineering, Seoul National University) Park, Young-Bae (School of Material Science and Engineering, Andong National University) |
1 | J. R. Lloyd, J. Phys. D. Appl. Phys. 32, 109 (1999). |
2 | K. N. Tu and K. Zeng, Mater. Sci. Eng. R34, 1 (2001). |
3 | T. S. Oh, K. Y. Lee, Y. H. Lee, and B. Y. Jung, Met. Mater. Int. 15, 479 (2009). DOI ScienceOn |
4 | J. H. Cho, E. J. Yoon, Y. J. Park, W. J. Ha, and J. K. Kim, Electron. Mater. Lett. 6, 51 (2010). |
5 | R. R. Tummala, Fundamentals of Microsystems Packaging, New York: McGraw-Hill (2001). |
6 | Y. Liu, Microelectronics Reliability 50, 514 (2010). DOI ScienceOn |
7 | H. Shimaamoto, Technical Trend of 3D Chip Stacked Previous Term MCP/SIP Next Term In, Proc. 57th ECTC workshop (2007). |
8 | M. Y. Kim, T. S. Oh, and T. S. Oh, Kor. J. Met. Mater. 48, 557 (2010). |
9 | J. H. Lee, G. T. Lim, S. T. Yang, M. S. Suh, Q. H. Chung, K. Y. Byun, and Y. B. Park, J. Kor. Inst. Met. & Mater. 46, 310 (2008). |
10 | V. S. Rao, V. Kripseph, S. W. Yoon, D. Witarsa, and A. A. O. Tay, Proc. 6th EPTC-IEEE, p. 444-449 (2004). |
11 | M. Ding, G Wang, B. Chao, P. S. Ho, P. Su, and T. Uehling, J. Appl. Phys. 99, 094906 (2006). DOI ScienceOn |
12 | K. Tanida, M. Umemoto, N. Tanaka, Y. Tomita, and K. Takahashi, Jap. J. Appl. Phys. 43, 2264 (2004). DOI |
13 | B. H. Lee, J. Park, S. J. Jeon, K. W. Kwon, and H. J. Lee, J. Electrochem. Soc. 157, H420 (2010). DOI ScienceOn |
14 | Y. S. Lai, Y. T. Chiu, and J. Chen, J. Elecron. Mater. 37, 1624 (2008). DOI ScienceOn |
15 | B. J. Kim, G. T. Lim, J. D. Kim, K. W. Lee, Y. B. Park, H. Y. Lee, and Y. C. Joo, Met. Mater. Int. 15, 815 (2009). DOI ScienceOn |
16 | G. T. Lim, B. J. Kim, K. W. Lee, J. D. Kim, Y. C. Joo, and Y. B. Park, J. Electron. Mater. 38, 2228 (2009). DOI ScienceOn |
17 | B. J. Kim, G. T. Lim, J. D. Kim, K. W. Lee, Y. B. Park, H. Y. Lee, and Y. C. Joo, J. Electron. Mater. 39, 2281 (2010). DOI ScienceOn |
18 | M. H. Jeong, G. T. Lim, B. J. Kim, K. W. Lee, J. D. Kim, Y. C. Joo, and Y. B. Park, J. Electron. Mater. 39, 2368 (2010). DOI ScienceOn |
19 | J. H. Lee, G. T. Lim, S. T. Yang, M. S. Suh, Q. H. Chung, K. Y. Byun, and Y. B. Park, J. Korean Phys. Soc. 54, 1784 (2009). DOI ScienceOn |
20 | K. N. Tu, Acta Metall. 21, 347 (1973). DOI ScienceOn |
21 | K. N. Tu, Solder Joint Technology, Materials, Properties, and Reliability, New York: Springer, p.59-71 (2007). |
22 | D. A. Porter and K. E. Easterling, Phase Transformation in Materials, 2nd edition, London: Chapman & Hall (1992). |
23 | S. Choi, T. R. Bieler, J. P. Lucas, and K. N. Subramanian, J. Electron. Mater. 28, 1209 (1999). DOI ScienceOn |
24 | K. Yamanaka, Y. Tsukada, and K. Suganuma, Scripta Mater. 55, 867 (2006). DOI ScienceOn |
25 | C. Y. Liu, L. Ke, Y. C. Chuang, and S. J. Wang, J. Appl. Phy. 100, 083702 (2006). DOI ScienceOn |
26 | T. Laurila, V. Vuorinen, and J. K. Kivilahti, Mater. Sci. Eng. R49, 1 (2005). |
27 | L. Xu, J. K. Han, J. J. Liang, K. N. Tu, and Y. S. Lai, Appl. Phys. Lett. 92, 262104 (2008). DOI ScienceOn |
28 | C. Yu, Y. Yang, H. Lu, and J. M. Chen, J. Electron. Mater. 39, 1309 (2010). DOI ScienceOn |
29 | K. N. Tu, J. W. Mayer, and L. C. Feldman, Electronic Thin Film Science, New York: Macmillan (1992). |
![]() |