• Design Convergence Study
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• v.18 no.1
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• pp.49-60
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• 2019

While one person household and nuclear family have been increasing, supermarkets began to launch home meal replacement(HMR) promotion. Each brand competes over various types of HMR such as box lunch. In particular, the sales of HMR have been increasing due to one-person households. Experts predicted HMR market will be increased in the future as well. This study presents design evaluation with regards to HMR package design for elders. The methods of this study are: First, research literature review on senior society and analyse the design for both domestic and foreign HMR products. Second, survey on product design for evaluation was conducted. Third, user's evaluation survey was conducted on elders. As a result, containers mostly came in cup or box shaped package designs. The package provided both still and illustration image of food. The HMR design for elders are recommended as follows: first, HMR should be service designed for users. Second, the design should be for elders as well. Third, the design should be empathetic and abundant. For user-interface, the packaging material shall not be slippery and the shape of grip should be considered thoroughly for the elder's design.

• Applied Biological Chemistry
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• v.40 no.6
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• pp.525-530
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• 1997

The changes in rheological properties of egg white stored in biodegradable package were investigated by pH change, failure stress and stress relaxation curve, and compared with control without package and complex PE. Initial pH of egg white stored in biodegradable package changed from 8.39 to 9.3 after 8 day storage, showing similar trend in pH change as that of control without package. Initial 14.25 N failure stress was changed into 6.76 N in biodegradable package and 9.31 N in control. Complex PE, having a relatively low gas permeability compared to biodegradable package, showed less pH changes from 8.30 to 8.81, but a greater decrease in failure stress into 5.29 N, indicating more deteriorating effect in complex PE package. Viscoelastic constants, such as elastic constant and viscous constant, obtained from stress-relaxation curve by three element Maxwell model were not significantly different between control and biodegradable package, but eggs stored in complex PE showed greater changes during storage. Therefore, the permeability seems to be the major factors to influence the rheological properties of egg and biodegradable packaging materials showed a potential substitute package for eggs.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.1-7
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• 2006

In this paper, warpage magnitude and shape of printed-circuit board in case that properties of core and thickness of solder resist are varied are investigated. The cause of warpage is coefficient of thermal expansion differences of stacked materials. Therefore, we need small difference of coefficient of thermal expansion that laminated material, and need to decrease asymmetric of top side and bottom side in structure shape. Also, we can control occurrence of warpage heightening hardness of core in laminated material. Composite material that make core are exploited in connection with the structural bending twisting coupling resulting from directional properties of fiber reinforced composite materials and from ply stacking sequence. If we use such characteristic, we can control warpage with change of material properties. In this paper, warpage of two layer stacked chip scale package is investigated, and evaluate improvement result using an experiment and finite element method tool.

• Industry Promotion Research
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• v.2 no.1
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• pp.31-38
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• 2017

This study is an exploratory study on the package design research strategy for the activation of the energy drink market. We analyzed the case study of energy drinks and the preference of energy beverage package design which are being sold in Korea and overseas from Oct. 24 to 28, 2016. The results of this study are as follows: First, preference is given to two colors, blue and red, regarding the color of package design of energy drinks. In particular, blue was the most preferred at 62.8%, and the reason for choosing color was the image that reminds me of energy drinks, and it was highly visible. Second, most preference of energy drinks for packaging material was selected from can and glass materials, and most preferred for can. Third, preference for calligraphy was found to be due to the dynamic images of energy drink preferring rough images. Fourth, package design awareness focused on overall image rather than one factor. The limitations of the study are the research subjects only to university students in Daejeon and Chungnam area. In the future, it will be necessary to classify the overall elements of package design and various research subjects, and to study the major consumption and consumption areas of energy drinks. In this study, it is implied that the design of the package needs a package design strategy in accordance with the overall product image, rather than focusing on one factor.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.3
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• pp.1479-1487
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• 2011

In the field of the entire electronic component industry including mobile IT products, the importance of a versatile package with the multifunctional or high capacity memories is gradually increased. Multi Chip Package which has several chips in a single package is frequently used for that purpose. In MCP, epoxy adhesive films play a major role in adhesion between the chips or between chip and substrate. A series of silane coupling agents with a functional group such as epoxy, amine, mercaptan, and isocyanate were applied to the epoxy adhesives and material properties such as wettability and reliability of the adhesives were investigated. From the results, the silane coupling agent with an epoxy functional group showed highest wettability and peel strength in epoxy adhesive. For those reasons, it lead to a superior reliability in the epoxy adhesive against interfacial fracture behaviors through moisture resistance test.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.59-66
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• 2018

In this paper, we analyzed the usefulness of single-structured printed circuit board (PCB) modeling by using numerical analysis to model the PCB structure applied to a package for semiconductor purposes and applying modeling assuming a single structure. PCBs with circuit layer of 3rd and 4th were used for analysis. In addition, measurements were made on actual products to obtain material characteristics of a single structure PCB. The analysis results showed that if the PCB was modeled in a single structure compared to a multi-layered structure, the warpage analysis results resulting from modeling the PCB structure would increase and there would be a significant difference. In addition, as the circuit layer of the PCB increased, the mechanical properties of the PCB, the elastic coefficient and inertia moment of the PCB increased, decreasing the package's warpage.

• Korean Journal of Food Science and Technology
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• v.26 no.1
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• pp.62-67
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• 1994

Quality change of Kimchi packaged with Ny/PE, Ny/CPP (PPtray+Ny/CPP cover), Cryovac BK-1, BK-4, and PET/Al/PE film was observed during storage at $5^{\circ}C$ (97%RH) and $20^{\circ}C$ (76%RH). To evaluate quality change of Kimchi, gas composition of package, pH, acidity, color, growth of lactic acid bacteria, and sensory score were measured periodically. Regarding to gas composition of package, Kimchi packaged with PET/Al/PE showed higher oxygen concentration at the beginning of storage than the others; carbon dioxide concentration was almost 100% at the end of storage. Carbon dioxide concentration of Kimchi packaged with Cryovac BK-1 and BK-4 which has higher gas permeability than the others, was increased to a maximum and then decreased due to permeation of gas during storage; oxygen concentration was increased. Unlike Kimchi packaged with Ny/PE, Ny/CPP, and PET/Al/PE, package swelling was not observed in Kimchi packaged with Cryovac BK-1 and BK-4 during storage. Although pH change was not significant depending on the packaging material, Kimchi packaged with Cryovac BK-1 and BK-4 showed lower pH value and higher acidity than those of the others. Color change of Kimchi was different depending on the packaging material during storage. Difference of the growth of lactic acid bacteria and sensory evaluation were not significant among Kimchi packaged with different packaging material during storage at either temperature. In conclusion, the effect of packaging materials on the quality change of Kimchi was not significant; however, to prevent from swelling of packaged Kimchi which is one of the most serious problem during storage and distribution, might be avoided by using relatively high $CO_2$ permeable film than high gas barrier film.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.17-28
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• 2012

It is known that thermo-mechanical properties of solder material and molding compound in WB-PBGA packages are considerably affected by not only temperature but elapsed time. In this paper, finite element analysis (FEA) taking material nonlinearity into account was performed for more reliable prediction on deformation behavior of a lead-free WB-PBGA package, and the results were compared with experimental results from moire interferometry. Prior to FEA on the WB-PBGA package, it was carried out for two material layers consisting of molding compound and substrate in terms of temperature and time-dependent viscoelastic effects of molding compound. Reliable deformation analysis for temperature change was then accomplished using viscoplastic properties for solder ball and viscoelastic properties for molding compound, and the analysis was also verified with experimental results. The result showed that the deformation of WB-PBGA packages was strongly dependent on material model of molding compound; thus, temperature and time-dependent viscoelastic behavior must be considered for the molding compound analysis. In addition, viscoelastic properties of B-type molding compound having comparatively high glass transition temperature of $135^{\circ}C$ could be recommended for reliable prediction on deformation of SAC lead-free WB-PBGA packages.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1999.05a
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• pp.9-19
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• 1999

A clad material is a different type of the typical composites which is composed of two or more materials joined at their interface surface. The advantage of clad material is that the combination of different materials can satisfy both the need of good mechanical properties and the other demand of user such as electrical properties instantaneouly. This paper is concerned with the direct and indirect extrusion process of copper-clad aluminum rod. Extrusion of copper-clad aluminum rod was simulated using a commercially available finite element package of DEFORM. The simulations were performed for copper-clad aluminum rod to predict the distributions of temperature, effective stress, effective strain rate and moan stress for some sheath thicknesses, die exit diameters and die temperatures.

• Journal of electromagnetic engineering and science
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• v.6 no.2
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• pp.135-145
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• 2006

This paper presents the theory, design, fabrication and characterization of the novel low actuation voltage capacitive shunt RF-MEMS switch using a corrugated membrane with HRS MEMS packaging. Analytical analyses and experimental results have been carried out to derive algebraic expressions for the mechanical actuation mechanics of corrugated membrane for a low residual stress. It is shown that the residual stress of both types of corrugated and flat membranes can be modeled with the help of a mechanics theory. The residual stress in corrugated membranes is calculated using a geometrical model and is confirmed by finite element method(FEM) analysis and experimental results. The corrugated electrostatic actuated bridge is suspended over a concave structure of CPW, with sputtered nickel(Ni) as the structural material for the bridge and gold for CPW line, fabricated on high-resistivity silicon(HRS) substrate. The corrugated switch on concave structure requires lower actuation voltage than the flat switch on planar structure in various thickness bridges. The residual stress is very low by corrugating both ends of the bridge on concave structure. The residual stress of the bridge material and structure is critical to lower the actuation voltage. The Self-alignment HRS MEMS package of the RF-MEMS switch with a $15{\Omega}{\cdot}cm$ lightly-doped Si chip carrier also shows no parasitic leakage resonances and is verified as an effective packaging solution for the low cost and high performance coplanar MMICs.