• Title/Summary/Keyword: package information

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DRAM Package Substrate Using Via Cutting Structure (비아 절단 구조를 사용한 DRAM 패키지 기판)

  • Kim, Moon-Jung
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.48 no.7
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    • pp.76-81
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    • 2011
  • A new via cutting structure in 2-layer DRAM package substrate has been fabricated to lower its power distribution network(PDN) impedance. In new structure, part of the via is cut off vertically and its remaining part is designed to connect directly with the bonding pad on the package substrate. These via structure and substrate design not only provide high routing density but also improve the PDN impedance by shortening effectively the path from bonding pad to VSSQ plane. An additional process is not necessary to fabricate the via cutting structure because its structure is completed at the same time during a process of window area formation. Also, burr occurrence is minimized by filling the via-hole inside with a solder resist. 3-dimensional electromagnetic field simulation and S-parameter measurement are carried out in order to validate the effects of via cutting structure and VDDQ/VSSQ placement on the PDN impedance. New DRAM package substrate has a superior PDN impedance with a wide frequency range. This result shows that via cutting structure and power/ground placement are effective in reducing the PDN impedance.

${\mu}$BGA and ${\mu}$Spring Packages for Rambus DRAM Applications and Their Electrical Characteristics (Rambus DRAM실장용 ${mu}!$BGA (Ball Grid Array) 및 ${mu}!$Spring 패키지와 전기적 특성)

  • Kim, Jin-Seong;Yu, Yeong-Gap
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.38 no.4
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    • pp.243-250
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    • 2001
  • This paper presents the structure of a $\mu$Spring package, its fabrication process and an analysis of its electrical characteristics compared to that of a $\mu$BGA. It was found that both $\mu$BGA and $\mu$Spring packages provide with outstanding high speed signal transmission characteristics due to their lower inductance of package interconnection lines, smaller than half of inductance of TSOP package lines. Even the worst case substrate trace of a Rambus DRAM $\mu$Spring package yields the line inductance of 2.9nH, which provides with 25% margin compared to the Rambus DRAM specification of 4nH. The fabrication cost of $\mu$Spring package is lower than that of $\mu$BGA by 50%, passes 1000 thermal cycles, meets JEDEC Level 1 specification whereas $\mu$BGA does not, and thereby yields high reliability and strong competing power.

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A Web-based SAS System for Lab Statistics

  • Oh, Chang-Hyuck;Lee, Soon-Ho;Lee, Hyun-Jung
    • Journal of the Korean Data and Information Science Society
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    • v.17 no.2
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    • pp.395-400
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    • 2006
  • For lab statistics the statistical package SAS is usually used in PC environment. But most Universities in Korea have bought 'Academic Initiative Package chair licence', which allows to install SAS to student lab PCs only. Most students are hardly able to afford to purchase a licence for use of SAS in their PCs at home or other places than school. It would be very convenient to have a web-based SAS system, physically located inside a campus, which university students can use through internet. In this paper we report the web-based SAS system implemented for the lab purpose of Yeungnam University using SAS/Intrnet module. We overcome some Server-Client environmental difficulties not allowing use of the SAS command 'infile' by implementing modules with PHP language. In the system, users can see and execute some basic SAS sample codes by clicking buttons, which makes students feel comfy in SAS programming.

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A Case-based Decision Support Model for The Semiconductor Packaging Tasks

  • Shin, Kyung-shik;Yang, Yoon-ok;Kang, Hyeon-seok
    • Proceedings of the Korea Inteligent Information System Society Conference
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    • 2001.01a
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    • pp.224-229
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    • 2001
  • When a semiconductor package is assembled, various materials such as die attach adhesive, lead frame, EMC (Epoxy Molding Compound), and gold wire are used. For better preconditioning performance, the combination between the packaging materials by studying the compatibility of their properties as well as superior packaging material selection is important. But it is not an easy task to find proper packaging material sets, since a variety of factors like package design, substrate design, substrate size, substrate treatment, die size, die thickness, die passivation, and customer requirements should be considered. This research applies case-based reasoning(CBR) technique to solve this problem, utilizing prior cases that have been experienced. Our particular interests lie in building decision support model to aid the selection of proper die attach adhesive. The preliminary results show that this approach is promising.

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Implementing an Enterprise Repository for Enterprise Resource Planning System (전사적 자원관리 시스템을 위한 기업 리파지토리 구축)

  • Lee, Hee-Seok;Lee, Jay;Lee, Choong-Seok;Cho, Chang-Rae;Sohn, Joo-Chan;Baik, Jong-Myung
    • Proceedings of the Korean Operations and Management Science Society Conference
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    • 1998.10a
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    • pp.172-175
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    • 1998
  • Currently, many companies are trying to be more competitive by implementing the most appropriate software package, called ERP (Enterprise Resource Planning). ERP can support the company's business process. A repository, which can story and retrieve enterprise-wide information, is a key component of such software package. This paper implements an enterprise repository for the ERP. A wellknown repository standard, IRDS (Information Resource Dictionary System), is employed for the repository architecture. A meta schema that can help develop database, business applications, models, and workflow is proposed. To illustrate the practical usefulness, a real-life ERP prototype is built within the framework of the proposed repository.

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Performance Advancement of Evaluation Algorithm for Inner Defects in Semiconductor Packages (반도체 패키지 내부결함 평가 알고리즘의 성능 향상)

  • Kim, Chang-Hyun;Hong, Sung-Hun;Kim, Jae-Yeol
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.15 no.6
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    • pp.82-87
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    • 2006
  • Availability of defect test algorithm that recognizes exact and standardized defect information in order to fundamentally resolve generated defects in industrial sites by giving artificial intelligence to SAT(Scanning Acoustic Tomograph), which previously depended on operator's decision, to find various defect information in a semiconductor package, to decide defect pattern, to reduce personal errors and then to standardize the test process was verified. In order to apply the algorithm to the lately emerging Neural Network theory, various weights were used to derive results for performance advancement plans of the defect test algorithm that promises excellent field applicability.

Main Features and Implications of KORUS FTA Negotiation Strategy : The Case of Foreign Ownership Regulation on Facilities-based Public Telecom Services (한미 FTA 협상전략의 특징 및 시사점 : 기간통신서비스 외자규제 사례를 중심으로)

  • Lie, Han-Young
    • International Commerce and Information Review
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    • v.9 no.2
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    • pp.399-422
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    • 2007
  • Like in other trade negotiations covering comprehensive sectors, it is reported that KOREA-US FTA tried so-called 'package deal' at the last minutes, when telecom services sector was positioned at the forefront and expected to partly play a role in buffering US' market-opening pressure on other sectors. Before everything else, Korean negotiators had to enhance the value of foreign ownership deregulation in telecom services sector as a leverage in the course of KOREA-US FTA negotiations. In addition, since foreign ownership change, if any, is highly sensitive issue either politically or policy-wise, it seems very difficult to find a breakthrough. Focusing on foreign ownership regulation in telecom services sector, this paper seeks how Korea has developed its strategic reasoning for negotiations and evaluates the outcomes of KOREA-US FTA negotiations.

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Design of Conference Event Package based on SIP (SIP기반 컨퍼런스 응용을 위한 이벤트 처리 기능 설계)

  • 이일진;이종화;김은숙;강신각
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2003.10a
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    • pp.572-575
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    • 2003
  • Mutimedia conference technology provides conference service as well as data service via Internet. Many standards and related applications were developed based on H.323 protocol. but H.323 protocol more complex than SIP. so IETF have developed standard that related conference control based on SIP. In this paper, we design conference event package for conference system based on SIP protocol.

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A Study on FOTA Upgrade Efficiency by Manipulating a Scatter Loading (FOTA에서 Scatter Loading의 최적화 방법 연구)

  • Lee, Hee-Young;Cho, Jun-Dong
    • Proceedings of the Korean Information Science Society Conference
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    • 2007.10d
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    • pp.608-612
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    • 2007
  • FOTA는 무선기능이 장착된 Mobile Device에 새로운 Software에 대한 알림기능이 도착하면, Software가 탐재된 서버에 접속하여 Software를 Download 받고, 그 Download한 Software를 Upgrade 하는 기능을 말한다. FOTA 기능을 장착하기 위해서 Mobile Device는 Delta Package의 사이즈를 최소화하기 위한 특별한 Binary 구조를 가지는데 두 Binary의 차이를 압축한 것을 Delta Package라고 부르며, Binary 사이에 Upgrade를 위한 여분의 Gap을 두어, 향후 수정된 내용이 있을 때, 수정사항을 공간 내에 포함할 수 있도록 한다. 바이너리를 구성하는 Object들이 Image내에 어떤 위치에 포함될 것인지를 결정하는 Scatter Loader에 따라, Binary의 구조 및 확장성, Delta의 크기를 결정하게 되는데, 이것은 Object의 Type이나 Scatter Loading File내에서 명시한 순서와는 관계가 없고, Execution Region의 분할 개수를 늘릴수록, 각 Object의 Dependency 별로 묶을수록 Delta Size가 작아지는 것을 알게 되었다. 이 논문에서는 위에서 제시한 조건이 Delta Size에 미치는 원인에 대해 분석하고, Scatter Loading File을 최적화시킬 수 있는 방안에 대해서 연구한다.

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Package Contents Authoring and Consuming System Based on MPEG-21 Multimedia Framework

  • Kim, Nam-Hoon;Kang, Min-Jae;Jung, Hoe-Kyung
    • Journal of information and communication convergence engineering
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    • v.9 no.1
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    • pp.50-54
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    • 2011
  • Recently there are so many media contents created and used by variety routes. Therefore, it is essential to make a new platform which is used for distributing media contents include IPTV. With open IPTV service, developing the new platform became even more important. Because open IPTV makes it possible for consumers to choose contents regardless of contents of the providers. The new platform has to accept current variety service structure. MPEG-21 multimedia framework was developed to satisfy these needs. It presented the distribution framework of the contents but didn't restrict the particular solutions for protecting the rights. In this paper, we present authoring and consuming system for package contents based on MPEG-21 Multimedia Framework for distributing media resources and managing the license of multimedia contents