• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1997.04a
• /
• pp.123-127
• /
• 1997

Recently, it is gradually raised necessity that interface is measured accurately and managed in industrial circles and medical world, An Ultrasonic wave transmitted from a focused beam transducer is being expected as a powerful tool for NDE of micro-defect. The ultrasonic NDE of the defect is based on the form of the wave reflected form the interface In this study, regarding to the thickness of film which is in opaque object and thickness measurement was done by MEM-cepstrum analysis of received ultrasonic wave. In measument results, film thickness which is beyond distance resolution capacity was measured accurately. Also, automatically repeated discrimination analysis method can be decided in the category of all kinds of defects on semiconductor package.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.14 no.5
• /
• pp.365-376
• /
• 2002

An experimental study has been conducted to measure the local film-cooling effectiveness and the heat transfer coefficient for a single row of rectangular-shaped holes. four different cooling hole shapes such ai a straight rectangular hole, a rectangular hole with laterally expanded exit, a circular hole and a two-dimensional slot are tested. A technique using thermochromic liquid crystals determine adiabatic film cooling effectiveness values and heat transfer coefficients on the test surface. Both film cooling effectiveness and heat transfer coefficient are measured for various blowing rates and compared with the results of the cylindrical ho1es and the two-dimensional slot. The flow patterns downstream of holes are calculated numerically using a cummercial package. The results show that the rectangular hopes provide better peformance than the cylindrical holes. For the rectangular holes with expanded exit, the penetration is reduced significantly, and the higher and more uniform cooling Peformance is obtained even at relatively high blowing rates.

• Tribology and Lubricants
• /
• v.21 no.2
• /
• pp.71-76
• /
• 2005

This paper compares of mechanical tensile properties of 6 kinds of copper foil. The beam lead made with copper foil. Different from other package type such as plastic package, Chip Size Package has a reliability problem in beam lead rather than solder joint in board level. A new tensile loading system was developed using voice-coil actuator. The new tensile loading system has a load cell with maximum capacity of 20 N and a non-contact position measuring system based on the principle of capacitance micrometry with 0.1nm resolution for displacement measurement. Strain was calculated from the measured displacement using FE analysis. The comparison of mechanical properties helps designer of package to choose copper for ensuring reliability of beam lead in early stage of semiconductor development.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2002.09a
• /
• pp.219-225
• /
• 2002

This paper presents a novel "bumpless flip chip package"for cost! performance driven devices. Using the conventional electroplating and etching processes, this package enables the production of fine pitch BGA up to 256 I/O with single layer routing. An array of circuitry down to $25-50{\mu}{\textrm}{m}$ line/space is fabricated to fan-in and fan-out of the bond pads without using bumps or substrate. Various types of joint methods can be applied to connect the fine trace and the bond pad directly. The resin-filled terminal provides excellent compliancy between package and the assembled board. More interestingly, the thin film routing is similar to wafer level packaging whereas the fan-out feature enables high lead count devices to be accommodated in the BGA format. Details of the design concepts and processing technology for this novel package are discussed. Trade offs to meet various cost or performance goals for selected applications are suggested. Finally, the importance of design integration early in the technology development cycle with die-level and system-level design teams is highlighted as critical to an optimal design for performance and cost.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.43 no.11 s.353
• /
• pp.8-13
• /
• 2006

Recent RF SAW filters are made using a HTCC package with a CSP(chip scale Package) technology. This paper describes a development of a new $1.4{\times}1.1\;and\;2.0{\times}1.4mm$ RF SAW liters made by PCB substrate instead of HTCC package, and this technology can reduce the cost of materials down to 40%. We have investigated the multi-layered PCB substrate structures and raw materials to find out the optimal flip-bonding condition between the $LiTaO_3$ wafer and PCB substrates. Also the optimal materials and processing conditions of epoxy laminating film were found out through the experiments which can reduce the bending moment caused by the difference of the thermal expansion between the PCB substrate and laminating film. The new PCB SAW filter shows good electrical and reliability performances with respect to the present SAW filters.

• Korean Journal of Food Science and Technology
• /
• v.2 no.1
• /
• pp.81-87
• /
• 1970

Effects of varying gamma-irradiation doses and polyethylene package on the quality and chemical components of Jonathan apples were investigated. The results obtained are as follows: 1. The doses of 50 to 100 krad were effective in the control of fruit rot and physiological disorders. 2. Gamma-irradiation to Jonathan apples rather accelerated shrivelling at the early stage of storage period. 3. Combined treatments of radiation and polyethylene package enabled to control the shrivelling of apples. 4. The rate of freight loss was lower in the irradiated and/or packing lots than control 5. Gamma-irradiation and polyethylene package did not appear to influence on the sugar content of apples.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.49 no.7
• /
• pp.1-9
• /
• 2012

In this paper, resistance temperature detector (RTD) integrated into the LED package is proposed in order to solve the temperature dependence of LED's optical properties. To measure the package temperature in real time, the RTD type temperature sensor having excellent accuracy and linearity between temperature change and resistance change was adopted. A stable metallic film is required for long term reliability and stability of the RTD type temperature sensor. Therefore, deposition and annealing condition for the film were determined. Based on the determined condition, the RTD type temperature sensor with the sensitivity of about $1.560{\Omega}/^{\circ}C$ was fabricated inside the LED package. In order to configurate the LED package system keeping the constant brightness regardless of the temperature, additional conversion circuit and control circuit boards were fabricated and added to the fabricated LED package. The proposed system was designed to compensate the light intensity caused by temperature change using the variable duty rate of driving current. As a result, the duty rate of PWM signal which is the output signal of the configurated system was changed with the temperature change, and the duty rate was similarly varied with the target duty rate. Consequently, it was focused the fabricated RTD can be used for compensating the optical properties of LED and the LED package which exhibits constant brightness regardless of the temperature change.

• Korean Journal of Materials Research
• /
• v.26 no.8
• /
• pp.438-443
• /
• 2016

We developed an Al sputtering process by varying the plasma power, process temperature, and film thickness. We observed an increase of hillock distribution and average diameter with increasing plasma power, process temperature, and film thickness. Since the roughness of a film increases with the increase of the distribution and average size of hillocks, the control of hillock formation is a key factor in the reduction of Al corrosion. We observed the lowest hillock formation at 30 W and $100^{\circ}C$. This growth characteristic of sputtered Al thin films will be useful for the reduction of Al corrosion in the future of the electronic packaging field.

• Journal of the Korean institute of surface engineering
• /
• v.55 no.4
• /
• pp.202-214
• /
• 2022

Internal connections between device, package and external terminals for connecting packaging and printed circuit board are normally manufactured by electroless Ni-P plating followed by immersion Au plating (ENIG process) to ensure the connection reliability. In this study, a new non-cyanide-based immersion and electroless Au plating solutions using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated on different underlayer electroless Ni-P plating layers. As a result, it was confirmed that the deposition behavior and film properties of electroless Au plating are affected by grain size and impurity of the electroless Ni-P film, which is used as the plating underlayer. Au plating on the electroless Ni-P plating film with a dense surface structure showed the highest bonding strength. In addition, the electroless Au plating film on the Ni-P plating film has a smaller particle size exhibited higher bonding strength than that on the large particle size.

• Food Science and Preservation
• /
• v.4 no.3
• /
• pp.265-270
• /
• 1997

Effect of modified atmosphere packaging conditions on quality changes of dry jujube was investigated. Dry jujubes with moisture content of 26.7% were packaged in PET/Al/PE film pouches with modified atmospheres. The tested packages include those with normal air, vacuum, CO2 flushing, N2 flushing and O2 scavenger. Packages were stored at 25$^{\circ}C$ for 6 months, during which ascorbic acid concentration, browning level, titratable acidity and surface color were measured. Generally modified atmosphere packages could improve quality retention of dry jujubes except that vacuum package resulted in large surface color change. CO2-flushed package showed the best quality retention of high ascorbic acid content and low browning during 112 days, but caused high amounts of ascorbic acid destruction and browning in longer storage. In all the modified atmosphere packages titratable acidity reached a maximum followed by decline and subsequent rise, while it increased linearly with time in normal air package. Considering ascorbic acid retention browning level and surface color changes during 112 days, the packages of CO2 flushing and N2 flushing were better than others.