• 센서학회지
• /
• 제8권6호
• /
• pp.476-480
• /
• 1999

PLD 법을 이용하여 PbSe 박막을 p-Si(100) 기판 위에 성장시켰다. 성장온도에 따른 박막의 결정구조를 조사하기 위하여 기판온도를 RT${\sim}400^{\circ}C$로 변화시키면서 박막을 제작하였다. 여러 기판온도에서 제작한 PbSe 박막의 XRD 패턴과 PbSe(200) rocking curve의 반치폭(FWHM)을 분석한 결과, 성장온도 $200^{\circ}C$에서 제작한 박막이 가장 양호한 결정성을 나타냈다. 또한 AFM으로 관찰한 PbSe 박막의 표면형태도 $200^{\circ}C$에서 성장시킨 박막의 표면입자들이 가장 규칙적인 배열을 보였다. Hall 측정결과, PbSe 박막은 n-type 반도체임을 알 수 있었고, 전류-전압 특성 곡선은 전형적인 p-n junction 현상을 나타냈다. 또한 n-type 반도체인 PbSe 박막의 전기전도도는 일반적인 반도체의 값보다 약간 큰 것으로 확인되었다.

• 한국진공학회지
• /
• 제15권5호
• /
• pp.534-540
• /
• 2006

$V_2O_3$, $VO_2$, $V_2O_5$ 박막들이 하나의 선구 용액으로부터 다양한 후열처리 조건을 통하여 제작될 수 있었다. 진공 중 후열처리 시 rhombohedral 구조의 $V_2O_3$ 박막이 형성되어졌고, 공기 중 후열처리 시 orthorhombic 구조의 $V_2O_5$ 박막을 얻을 수 있었다. Monoclinic 구조의 $VO_2$ 박막은 진공 후열처리 중 $O_2$ 가스를 공급함으로써 제작될 수 있었다. $V_2O_3$ 박막이 상온에서 도체적 특성을 보이는 반면, $V_2O_5$, $VO_2$ 박막은 반도체적 성질을 지니고 있음을 전기적, 광학적 특성 조사를 통하여 알 수 있었다. 크롬(Cr)이 도핑됨에 따라 $VO_2$ 박막은 그 전기전도성이 n-type에서 p-type으로 변화하였고 비저항이 감소되는 결과를 나타내었다. 또한, 크롬 도핑된 $VO_2$ 박막은 orthorhombic 구조를 나타내었다. 이와 같은 바나듐 옥사이드 박막들에서 관측된 광학적 흡수 구조들은 O 2p 에서 V 3d 밴드로의 전이에 의한 것으로 해석되어진다. 바나듐 이온의 $t_{2g}$ 상태와 $e_g$ 상태 사이의 결정장 갈라짐(crystal-field splitting)은 $V_2O_5$와 $VO_2$에 대해서 각각 1.5 및 1.0 eV로 해석된다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
• /
• pp.216-217
• /
• 2008

Zinc-oxide films were deposited by pulsed laser deposition (PLD) technique using doped ZnO target (mixed $In_2O_3$ 0.1, 0.3, 0.6 at. % - atomic percentage) on the p-type Si(111) substrate. A little Indium has added at the n-ZnO films for the electron concentration control and enhanced the electrical properties. Also, post thermal annealed ZnO films are shown an enhanced structural and controled electron concentration by the annealing condition for the hetero junction diode of a better emitting characteristics. The electrical and the diode characteristics of the ZnO films were investigated by using Hall effect measurement and current-voltage measurement.

• 한국전기전자재료학회논문지
• /
• 제25권12호
• /
• pp.969-973
• /
• 2012

AlN thin films were deposited on p-type Si(100) substrates by RF magnetron sputtering method. This study showed the change of the preferential orientation of AlN thin films deposition with the change of the deposition conditions such as sputtering pressure and Ar/N2 gas ratio in chamber. It was identified by X-ray diffraction patterns that AlN thin film deposited at low sputtering pressure has a (002) orientation, however its preferred orientation was changed from the (002) to the (100) orientation with increasing sputtering pressure. Also, it was observed that the properties of AlN thin films such as thickness, grain size and surface roughness were largely dependent on Ar/$N_2$ gas ratio and a high quality thin film could be prepared at lower nitrogen concentration. AlN thin films were investigated relationship between preferential orientation and deposition condition by using XRD, FE-SEM and PFM.

• 한국결정성장학회지
• /
• 제9권2호
• /
• pp.212-216
• /
• 1999

SiC(3C) 광다이오드는 p-형 Si 위에 tetramethylsilane (TMS)를 열분해아여 화학기상증착법으로 성장된 SiC(3C) 에피층을 성장하여 제작되었다. SiC(3C)의 전기적 특성은 홀 측정(Hall measurement) 및 전류-전압(I-V) 특성으로 조사되었다. SiC(3C) 에피층의 전도형은 n-형이었다. 저항성 접촉은 마스크 (shadow-mask)를 통해서 Al을 열증착하여 형성하였다. SiC(3C)광다이오드의 광학적 이득(photovoltaic detection)를 해석하기 위하여 SiC(3C) 에피층의 Spectral response (SR)를 전기적 변수(electrical parameter) 및 광다이오드의 기하학적 구조(geometric structure)를 고려하여 계산하였다. 적절히 선정된 변수들로부터 계산된 SR의 최대값은 550 nm에서 약 0.75이었고, 파장영역 400~600 nm 사이에서 청색 및 근자외선 광검지기로서 매우 유용하다.

• 한국전기전자재료학회논문지
• /
• 제29권8호
• /
• pp.461-465
• /
• 2016

n-type silicon shows the better tolerance towards metal impurities with a higher minority carrier lifetime compared to p-type silicon substrate. Due to better lifetime stability as compared to p-type during illumination made the photovoltaic community to switch toward n-type wafers for high efficiency silicon solar cells. We fabricated the front electrode of the n-type solar cell with AgAl paste. The electrodes characteristics of the AgAl paste depend on the contact junction depth that is closely related to the firing temperature. Metal contact depth with p+ emitter, with optimized depth is important as it influence the resistance. In this study, we optimize the firing condition for the effective formation of the metal depth by varying the firing condition. The firing was carried out at temperatures below $670^{\circ}C$ with low contact depth and high contact resistance. It was noted that the contact resistance was reduced with the increase of firing temperature. The contact resistance of $5.99m{\Omega}cm^2$ was shown for the optimum firing temperature of $865^{\circ}C$. Over $900^{\circ}C$, contact junction is bonded to the Si through the emitter, resulting the contact resistance to shunt. we obtained photovoltaic parameter such as fill factor of 76.68%, short-circuit current of $40.2mA/cm^2$, open-circuit voltage of 620 mV and convert efficiency of 19.11%.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 1992년도 춘계학술대회 논문집
• /
• pp.110-113
• /
• 1992

$n^{+}$-p homojunction InP diodes were fabricated using thermal diffusion of Sulfur into p-type InP substrates(Zn doped, LEC grown, p=2.3${\times}$10$^{16}$c $m^{-3}$). The Sulfur diffusion was carried out at 550$^{\circ}C$, 600$^{\circ}C$, 700$^{\circ}C$ for 4 hours in a sealed quartz ampule(～2ml in volume) containing 5mg I $n_2$ $S_3$ and Img of red phosphorus. The formed junction depth was below 0.5$\mu\textrm{m}$. After the removal of diffused layer on the rear surface of the wafer, the beak ohmic contacts to the p-side were made with a vacuum evaporation of An-Zn(2%) followed by an annealing at 450$^{\circ}C$ for 5 minutes in flowing Ar gas. The front contacts were made with a vacuum evaporation of Au-Ge(12%) followed by an annealing at 500$^{\circ}C$ for 3 minutes in flowing Ar gas. The remarkable sprctral response of the cells obtained at the region of 6000-8000${\AA}$ region. The open circuit voltage $V_{oc}$ , short circuit current density $J_{sc}$ , fill factor and conversion efficiency η of the fabricated pattern solar cells(diffusion condition : at 700$^{\circ}C$ for 4 hours) were 0.660V, 14.04㎃/$\textrm{cm}^2$, 0.6536 and 10.09%, respectively.y.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
• /
• pp.115-121
• /
• 2002

In this research we have investigated the characteristics of ultra thin $HfO_2 /SiON$stack structure films using several analytical techniques. SiON layer was thermally grown on standard SCI cleaned silicon wafer at $825^{\circ}C$ for 12sec under $N_2$O ambient. $HfO_2 /SiON$$_4$/$H_2O$ as precursors and $N_2$as a carrier/purge gas. Solid HfCl$_4$was volatilized in a canister kept at $200^{\circ}C$ and carried into the reaction chamber with pure $N_2$carrier gas. $H_2O$ canister was kept at $12^{\circ}C$ and carrier gas was not used. The films were grown on 8-inch (100) p-type Silicon wafer at the $300^{\circ}C$ temperature after standard SCI cleaning, Spectroscopic ellipsometer and TEM were used to investigate the initial growth mechanism, microstructure and thickness. The electrical properties of the film were measured and compared with the physical/chemical properties. The effects of heat treatment was discussed.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제48권6호
• /
• pp.429-435
• /
• 1999

The $SrTiO_3$ thin films were prepared on Ag/TiN-coated and p-type bare Si(100) substrates by r.f. magnetron sputtering deposition technique. The electrical properties of the deposited films were investigated, which controlling deposition parameters such as substrate temperature and film thickness. The electrical properties ofthe $SrTiO_3$ films were measured using the capacitance-voltage(C-V) technique. The thickness dependence of the electrical properties of the $SrTiO_3$ films was analyzed of the connection with the films in series. The substrate affected the crystal structure and texture characteristics of the $SrTiO_3$ films. The resistivity of the film, sandwiched between Al and Ag films was measured, as a function of the temperature.

• 센서학회지
• /
• 제24권4호
• /
• pp.219-223
• /
• 2015

Indium free consisting of three alternating layers GTO/Ag/GTO has been fabricated by radio-frequency (RF) sputtering for the applications as transparent conducting electrodes and the structural, electrical and optical properties of the gallium tin oxide (GTO) films were carefully studied. The gallium tin oxide thin films deposited at room temperature are found to have an amorphous structure. Hall Effect measurements show a strong influence on the conductivity type where it changed from n-type to p-type at $700^{\circ}C$. GTO/Ag/GTO multilayer structured electrode with a few nm of Ag layer embedded is fabricated and show the optical transmittance of 86.48% in the visible range (${\lambda}$ = 380~770 nm) and quite low electrical resistivity of ${\sim}10^{-5}{\Omega}cm$. The resultant power conversion efficiency of 2.60% of the multilayer based OPV (GAG) is lower than that of the reference commercial ITO. GTO/Ag/GTO multilayer is a promising transparent conducting electrode material due to its low resistivity, high transmittance, low temperature deposition and low cost components.