• Textile Coloration and Finishing
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• v.26 no.3
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• pp.151-158
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• 2014

The oil sorption capacities and biodegradability of nonwoven fabrics(pads) of PP and PP/kapok(10/90wt%) blend prepared in this study and commercial pad(T2COM: 100% PP) were compared. The biodegradability(58.5%) of PP/kapok(10/90wt%) blend pad was about 5times higher than those(11%) of PP and T2COM pads after 45days. The oil sorption rates of oil sorbent pads for various oils(diesel, lubricant and Bunker C oils) were markedly increased with increasing dipping time up to about 5min and then levelled off. The oil sorption rate and oil sorption capacity were found to increase in the order of PP/kapok(10/90wt%) blend>PP>commercial(T2COM) and Bunker C>lubricant>diesel.

• Tribology and Lubricants
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• v.14 no.1
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• pp.70-78
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• 1998

Two different friction materials (organic and low-metallic pads) for automotive brakes were studied to investigate the anti-fading phenomena during stop. The anti-fading phenomena were pronounced more in the case of using low metallic friction materials than organic friction materials. The main cause of the anti-fading phenomena was the high dependence of friction coefficient on a sliding speed. The anti-fading was prominent when the initial brake temperature was high in the case of low-metallic friction materials due to the strong stick-slip event at high temperature. On the other hand, the anti-fading was not severe in organic friction materials and the effect was reduced at high braking temperature due to the thermal decomposition of organic friction materials. The strong stickslip phenomena of low metallic friction materials at high temperature induced high torque oscillations during drag test. During this experiment two different braking control modes (pressure controlled and torque controlled modes) were compared. The type of the control mode used for brake test significantly affected the friction characteristics.

• Journal of the Korea Fashion and Costume Design Association
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• v.15 no.3
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• pp.41-50
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• 2013

This study aims to contribute to development of sanitary pad meeting customers' requirements by examining types, sorts, sizes and specifications of cloth sanitary pads currently sold in the market, and the results are as follows. First, with respect to materials of inside cloth of cloth sanitary pads, in most cases, 100% cotton knit was used as materials of the inside cloth and the pads were finished with knit cotton(including organic cotton) and woven cotton bias. Second, for the structures of the cloth sanitary pads, the Jacquard knits in the shape of beehive or waffle are mostly used. Third, the sizes of cloth sanitary pads were classified with 7 sorts were discovered that can be divided into liner, small-size, medium-size, large-size, overnight, extra overnight, accounting for the most percentage among cloth sanitary pads. Fourth, 11 sorts among cloth sanitary pads whose front and back shapes are the same were discovered, accounting for the most percentage. Fifth, cloth sanitary pads can be largely classified into a wing type, all-in-one type and insertion type, which includes subsidiary absorption layer. 9 sorts were wing types and all-in-one types, accounting for the most and percentage. Compared with the scope of the market for women's articles, there is no relevant study, so this study is expected to provide basic materials for women's articles and contribute to development of environment-friendly products as an alternative to a disposable sanitary pad which not only causes environment pollution but also has bad effects on women's health.

• Tribology and Lubricants
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• v.13 no.3
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• pp.10-19
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• 1997

Frictional characteristics of two different types of automotive friction materials were studied. They were non-asbestos organic and semi-metallic friction materials. The two friction materials were tested using an inertial brake dynamometer to investigate friction stability, rooster tailing phenomena, temperature change during drags and stops. Results show that the level of the friction force is strong functions of time, temperature, and speed regardless of the type of friction materials. In particular, rooster tailing effects are pronounced in the case of semi-metallic friction materials compared to non-asbestos organic friction materials. The phenomena appear strongly dependent on raw materials contained in the friction materials.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.65-68
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• 2013

A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process. A selective solder bumping mechanism without the mask is based on the material design of SBM. Maskless screen printing process can implement easily a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology. Its another advantage is ternary or quaternary lead-free SoP can be formed easily. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 ${\mu}m$ is, successfully, formed.

• ETRI Journal
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• v.35 no.2
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• pp.340-343
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• 2013

A novel bumping process using solder bump maker is developed for the maskless low-volume solder on pad (SoP) technology of fine-pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low-volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low-volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of $130{\mu}m$ is successfully formed.

• Korean Journal of Metals and Materials
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• v.49 no.3
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• pp.237-242
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• 2011

The effect of shearing speed on the shear force and energy of Sn-0Ag-0.5Cu solder ball was investigated. Various UBM (under bump metallurgy)'s on Cu pads were used such as ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold; Ni/Pd/Au), ENIG (Electroless Nickel, Immersion Gold; Ni/Au), OSP (Organic Solderability Preservative). To fabricate a shear test specimen, a solder ball, $300{\mu}m$ in diameter, was soldered on a pad of FR4 PCB (printed circuit board) by a reflow soldering machine at $245^{\circ}C$. The solder bump on the PCB was shear tested by changing the shearing speed from 0.01 m/s to 3.0 m/s. As experimental results, the shear force increased with a shearing speed of up to 0.6 m/s for the ENIG and the OSP pads, and up to 0 m/s for the ENEPIG pad. The shear energy increased with a shearing speed up to 0.3 m/s for the ENIG and the OSP pads, and up to 0.6 m/s for the ENEPIG pad. With a high shear speed of over 0 m/s, the ENEPIG showed a higher shear force and energy than those of the ENIG and OSP. The fracture surfaces of the shear tested specimens were analyzed, and the fracture modes were found to have closer relationship with the shear energy than the shear force.

• Steel and Composite Structures
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• v.19 no.4
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• pp.939-952
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• 2015

In this paper, brake pad performance of two organic matrix composites namely, Sample 1 (contains no brass filler) and Sample 2 (contains 1.5% brass filler), is studied based on tribological and squeal noise behavior. In the first stage, a pin-on-disc tribometer is used to evaluate the frictional behavior of the two pads. On the following stage, these pads are tested on squeal noise occurrence using a drag-type brake dynamometer. From the two type of tests, the results show that; (i) brass fillers play a dual role; firstly as reinforcing element of the brake pad providing primary contact sites, and secondly as solid lubricant by contributing to the formation of a layer of granular material providing velocity accommodation between the pad and the disc; (ii) brass fillers contribute to friction force stabilization and smooth sliding behavior; (iii) the presence of small weight quantity of brass filler strongly contributes to squeal occurrences; (iv) there is close correlation between pin-on-disc tribometer and brake dynamometer tests in terms of tribological aspect.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.450-450
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• 2006

Organic light-emitting diodes (OLED) as pixels for flat panel displays are being actively pursued because of their relatively simple structure, high brightness, and self-emitting nature [1, 2]. The top-emitting diode structure is preferred because of their geometrical advantage allowing high pixel resolution [3]. To enhance the performance of TOLEDs, it is important to deposit transparent top cathode films, such as transparent conducting oxides (TCOs), which have high transparency as well as low resistance. In this work, we report on investigation of the characteristics of an indium tin oxide (ITO) cathode electrode, which was deposited on organic films by using a radio-frequency magnetron sputtering method, for use in top-emitting organic light emitting diodes (TOLED). The cathode electrode composed of a very thin layer of Mg-Ag and an overlaying ITO film. The Mg-Ag reduces the contact resistivity and plasma damage to the underlying organic layer during the ITO sputtering process. Transfer length method (TLM) patterns were defined by the standard shadow mask for measuring specific contact resistances. The spacing between the TLM pads varied from 30 to $75\;{\mu}m$. The electrical properties of ITO as a function of the deposition and annealing conditions were investigated. The surface roughness as a function of the plasma conditions was determined by Atomic Force Microscopes (AFM).

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.95-99
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• 2001

Cu is considered as a promising alternative interconnection material to Al-based interconnection materials in Si-based integrated circuits due to its low resistivity and superior resistance to the electromigration. New humping and UBM material systems for solder flip chip interconnection of Cu pads were investigated using electroless-plated copper (E-Cu) and electroless-plated nickel (E-Ni) plating methods as low cost alternatives. Optimally designed E-Ni/E-Cu UBM bilayer material system can be used not only as UBMs for solder bumps but also as bump itself. Electroless-plated E-Ni/E-Cu bumps assembled using anisotropic conductive adhesives on an organic substrate is successfully demonstrated and characterized in this study