• 한국광학회:학술대회논문집
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• 한국광학회 2005년도 하계학술발표회
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• pp.188-189
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• 2005

• 한국광학회지
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• 제28권4호
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• pp.135-140
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• 2017

본 논문에서는 고출력 광섬유 레이저를 위한 광섬유 칩 기반 all-fiber $7{\times}1$ 펌프 광 결합기의 제작에 대하여 보고한다. 광섬유 칩은 코어, 클래딩 직경이 각각 20, $400{\mu}m$인 광섬유를 길이 방향으로 식각하여 제작하였다. 7개의 입력 광섬유 부분은 105, $125{\mu}m$의 코어, 클래딩 직경을 가진 7개의 입력 광섬유를 원통형 다발로 제작하여 광섬유 칩의 $375{\mu}m$부분에 융착하였고, 1개의 출력 광섬유는 코어, 클래딩 직경이 각각 25, $250{\mu}m$ 광섬유를 광섬유 칩의 $250{\mu}m$부분에 융착하여 최종적으로 $7{\times}1$ 펌프광 결합기를 제작하였다. 제작된 광섬유 칩 기반 $7{\times}1$ 펌프 광 결합기의 포트별 평균 광 전달 효율은 약 90.2%로 나타났다.

• 마이크로전자및패키징학회지
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• 제14권3호
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• pp.7-13
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• 2007

광통신용 광모듈에서 광소자와 광섬유 또는 도파로를 정밀하게 정렬 및 접합하기 위하여 플립칩본딩 방법 이 널리 이용되고 있다. 이때 광소자를 정확한 위치에 정렬시키기 위하여 기판과 광소자 양쪽에 정렬용 마크를 제작하고 플립칩본더 등을 사용하여 정렬마크를 관찰하며 광소자를 정렬 및 본딩하게 된다. 본 연구에서는 이러한 정렬마크의 제작비용을 줄이고 광섬유와 수광소자(PD 칩)의 수동정렬을 용이하게 하기 위하여 He-Ne 레이저(파장 633nm)인 가시광을 이용한 정렬 및 플립칩본딩 방법을 연구하였다. 광섬유에서 방출되는 레이저 광을 육안으로 관찰하면서 수광소자를 정렬하므로써 패키징에 소요되는 시간과 경비를 절감하고 광모듈의 저가격화를 실현 할 수 있는 새로운 방법이다. 광섬유에 가공되어 있는 V-노치를 경유하여 가시광이 광섬유에 대해 직각방향으로 방출되고 이것을 수광소자와 정렬하는 방법이다. 본 연구결과 광정렬을 위해 입사된 633 nm파장의 가시광 레이저와 통신용 레이저인 1550 nm 파장사이의 파장 차이에 의한 광경로 차이는 약 4m으로 무시가능하고 최대 광세기 지점에서 ${\pm}20\;{\mu}m$ 범위내에서는 광결합효율 변화는 약 2%이었으며 최대 광결합효율은 약 23.3%이었다.

• Journal of the Optical Society of Korea
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• 제13권4호
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• pp.439-444
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• 2009

Accurate evaluation of polarization characteristics in the integrated optic chip (IOC) for interferometric fiber optic gyroscope was performed. Spatial distribution of optical wavetrains caused by the polarization parameters such as local polarization cross-coupling and polarization rejection coefficient of the IOC were measured utilizing the path-matched optical coherence domain polarimetry (PM-OCDP). With the analytic model deduced from Jones matrix representation, we could accurately identify the polarization characteristics of the IOC. Both degree of measurement error due to the imperfect equipment conditions in PM-OCDP and birefringence of IOC chip were also characterized.

• 전기학회논문지
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• 제57권12호
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• pp.2276-2280
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• 2008

In this paper, we present thermal dependancy of LED package element by changing temperature of MCPCB for design high efficiency LED lamp, and confirmed influence of LED chip against temperature with analysis of thermal resistance and thermal capacitance. As increasing temperature, WPOs were decreased from 25 to 22.5 [%] and optical power were also decreased. that is decreased reason of optical power that forward voltage was declined by decrease of energy bandgap. Therefore optical power by temperature of MCPCB should consider to design lamp for street light and security light. Moreover, compensation from declined optical efficiency is demanded when LED package is composed. Also, thermal resistances from chip to metal PCB were decreased from 12.18 to 10.8[$^{\circ}C/W$] by changing temperature. Among the thermal resistances, the thermal resistance form chip to die attachment was decreased from 2.87 to 2.5[$^{\circ}C/W$] and was decreased 0.72[$^{\circ}C/W$] in Heat Slug by chaning temperature. Therefore, because of thermal resistance gap in chip and heat slug, reliability and endurance of high power LED affect by increasing non-radiative recombination in chip from heat.

• 전자통신동향분석
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• 제35권2호
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• pp.89-103
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• 2020

Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

• 전자통신동향분석
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• 제35권2호
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• pp.120-136
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• 2020

Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

• 전자통신동향분석
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• 제35권2호
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• pp.104-119
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• 2020

Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

• Journal of the Optical Society of Korea
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• 제7권1호
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• pp.1-6
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• 2003

Integration and miniaturization at the systems level are key requirements for photonics applications. Here, we describe the concept of planar integration of free-space optical systems and its use as an optical interconnection technology. Two specific applications will be considered, a parallel chip-to-chip interconnect and an optical clock distribution network.

• Current Optics and Photonics
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• 제5권2호
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• pp.147-154
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• 2021

Microfluidic chip technology is a research focus in biology, chemistry, and medicine, for example. However, microfluidic chips are rarely applied in imaging, especially in ghost imaging. Thus in this work we propose a ghost-imaging system, in which we deploy a novel microfluidic chip modulator (MCM) constructed of double-layer zigzag micro pipelines. While in traditional situations a spatial light modulator (SLM) and supporting computers are required, we can get rid of active modulation devices and computers with this proposed scheme. The corresponding simulation analysis verifies good feasibility of the scheme, which can ensure the quality of data transmission and achieve convenient, fast ghost imaging passively.