• ETRI Journal
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• v.35 no.2
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• pp.301-310
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• 2013

Nowadays, the multicore processor is watched with interest by people all over the world. As the design technology of system on chip has developed, observing and controlling the processor core's internal state has not been easy. Therefore, multicore processor debugging is very difficult and time-consuming. Thus, we need a reliable and efficient debugger to find the bugs. In this paper, we propose an on-chip debug architecture for multicore processors that is easily adaptable and flexible. It is based on the JTAG standard and supports monitoring mode debugging, which is different from run-stop mode debugging. Compared with the debug architecture that supports the run-stop mode debugging, the proposed architecture is easily applied to a debugger and has the advantage of having a desirable gate count and execution cycle. To verify the on-chip debug architecture, it is applied to the debugger of the prototype multicore processor and is tested by interconnecting it with a software debugger based on GDB and configured for the target processor.

• Biotechnology and Bioprocess Engineering:BBE
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• v.9 no.2
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• pp.76-85
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• 2004

Biodevices composed of biomolecular layer have been developed in various fields such as medical diagnosis, pharmaceutical screening, electronic device, photonic device, environmental pollution detection device, and etc. The biomolecules such as protein, DNA and pigment, and cells have been used to construct the biodevices such as biomolecular diode, biostorage device, bioelectroluminescence device, protein chip, DNA chip, and cell chip. Substantial interest has focused upon thin film fabrication or the formation of biomaterials mono- or multi-layers on the solid surfaces to construct the biodevices. Based on the development of nanotechnology, nanoscale fabrication technology for biofilm has been emerged and applied to biodevices due to the various advantages such as high density immobilization and orientation control of immoblized biomolecules. This review described the nanoscale fabrication of biomolecular film and its application to bioelectronic devices and biochips.

• Journal of the Korean Society of Industry Convergence
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• v.3 no.1
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• pp.69-75
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• 2000

Multichip packages are comprised of dissimilar materials which expand at different rates on heating. The differential expansion must be accommodated by the various structural elements of the package. A types of heat exposures occur operation cycles. This study presents a finite element analysis simulation of flip-chip among multichip. The effects of geometries and material properties on the reliability were estimated during the analysis of temperature and thermal stress of flip-chip. From the results, it could be obtained that the more significant parameters to the reliability of flip-chip arc chip power cycle, heat convection and height of solder bump.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.1
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• pp.107-112
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• 2009

This paper describes design and fabrication issues of the SiP(System in Package) one-chip for a portable digital broadcasting receiver. It includes RF tuner chip, demodulator chip and passive components for the receiver system. When we apply the SiP one-chip technology to the broadcasting receiver, the system board size can be reduced from $776mm^2$ to $144mm^2$. SiP one-chip has an advantage that the area reduces more 81% than separated chips. Also the sensitivity performance advances -1dBm about 36 channels in the RF weak electric field, the power consumption reduces about 2mW and the C/N keeps on the same level.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.11
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• pp.2664-2675
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• 1993

In this paper, the effects of chip breaker configuration on cutting forces for various cutting conditions are investigated and a method for predicting cutting forces effectively for chip breaker insert in milling is described. Based on the shear plane model and the relevant equations already existing for the relation among the parameters, the method makes use of the analytic geometric approach considering the configuration of cutting too by a 3-dimensional coordinate transformation matrix. The groove type chip breaker insert is modeled to be a double rake insert, represented by the first radial rake angle, the second radial rake angle and the length of land, and the program analyzing the cutting forces is developed. The program capability is verified by comparing the results with the experimental ones for a single cutter; and in case of primary cutting forces, the results of simulation and experiments agree very well showing 2%~16.7% difference within the feed rate range investigated.

• Journal of the Korean Society for Precision Engineering
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• v.7 no.2
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• pp.85-94
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• 1990

In automatic metal cuttings, the chip control is one of the serious problems. So the automatic detection of chip forms is essential to the chip control in automatic metal cuttings. Cutting experiments were carried out under the variety of cutting conditions (cutting speed, feed, depth of cut and tool geometry) and with workpiece made of steel (S45C), and cutting forces were measured in-processing by using a piezoelectric type Tool Dynamometer. In this report, the frequency analysis of dynamic components, the upper frequency distributions, the ratio of RMS values, the numbers of null point and the probability density were calculated from the dynamic componeents of cutting forces filtered through various band pass filters. Experimental results showed that computer chip form monitoring system based on the cutting forces was designed and simulated and that 6 type of chip forms could be detected while in-process machining.

• Journal of Animal Environmental Science
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• v.3 no.1
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• pp.27-34
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• 1997

This study was carried out to evaluate the feasibility of composting of swine manure with wood chips as a bulking agent. To evaluate the optimum blending ratio of wood chip to swine manure three levels of wood chip such as 100, 150, and 200% were blended on a volume basis with 100% of swine manure was used to determine the effect of wood chip compared with sawdust as a bulking agent on composting. The maximum temperature reached during composting was 70, 58, 48, 72$^{\circ}C$ at blending ratio of 100, 150, 200, and 50WC+50SD%, respectively. The bulk density of compost was increased extremely with increasing the blending level of wood chip. The C/N ratio of final compost ranged from 18.25 to 19.82 . Heavy metal contents in the final compost were in the range of 0.05∼0.16 mg/kg, 5,86∼10.95 $\mu\textrm{g}$/kg, and 295∼440 mg/kg for Cd, Hg, and Cu, respectively. It was concluded that the blending ratio of 200:100 of wood chip and manure by volume was satisfactory for swine manure composting.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.19 no.1
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• pp.64-69
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• 2005

In this paper, we analyzed the nonlinear performance on the DS/CDMA Communication System. At the $BER=10^{-4}$, uniform chip waveforms have similar performance in the linear channel. However, non-uniform chip waveforms have about more 0.5[dB] power gain than the conventional raised-cosine chip waveforms. In the nonlinear HPA, non-uniform chip waveforms have worse BER performance than the uniform chip waveforms because of the high PAPR. In other words, non-uniform chip waveforms show similar performance as uniform chip waveforms if IBO (input back on) of 15[dB] is given.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.1
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• pp.103-109
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• 2021

Fine chips generated by machining have an impact on machine failure and quality of machined products, it is necessary to remove the chips, so the microchip collection and removal device by rotating conveyor belt with neodymium permanent magnets was developed. In this research, to solve the problem for reducing the existing microchips in the tank, a micro-chip removal device by rotating conveyor belt with neodymium permanent magnets developed. In the development of micro-chip removal device, 3D CATIA modeling was used, and the flow analysis and the electromagnetic force analysis were performed with COMSOL Multiphysics program. To evaluate the performance of the prototypes produced, design of experiments (DOE) is used to obtain the effect of neodymium conveyor movement speed on chip removal for the ANOVA analysis of recovered powders. An experiment was conducted to investigate the effect of the conveyor feed rate on the chip removal performance in detail. As a result of the experiment, it was confirmed that the slower the feeding speed of the fine chip removing device, the more efficient the chip removal.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.119-120
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• 2009