• 한국분말재료학회지
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• 제16권6호
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• pp.396-402
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• 2009

Tantalum nitrides ($Ta_3N_5$) have been developed to substitute the Cd based pigments for non-toxic red pigment. Various doping elements were doped to reduce the amount of high price Tantalum element used and preserve the red color tonality. Doping elements were added in the synthesizing process of precursor of amorphous tantalum oxides and then Tantalum nitrides doped with various elements were obtained by ammonolysis process. The average particle size of final nitrides with secondary phases was larger than the nitride without the secondary phases. Also secondary phases reduced the red color tonality of final products. On the other hand, final nitrides without secondary phase had orthorhombic crystal system and presented good red color. In other words, in the case of nitrides without secondary phases, doping elements made a solid solution of tantalum nitride. In this context, doping process controlled the ionic state of nitrides and the amount of oxygen/nitrogen in final nitrides affected the color tonality.

• 자원리싸이클링
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• 제31권1호
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• pp.46-55
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• 2022

최근 희유금속 자원 회수에서 초경합금 스크랩 재활용의 중요성이 증가하고 있다. 그러나 IV, V족 전이금속 질화물로 코팅된 초경합금 스크랩에서 고순도 분말 회수에서 어려움을 겪고 있다. 제1원리 계산을 사용하여 IV 및 V족 전이금속 질화물(TiN, VN, ZrN, NbN, HfN 및 TaN)의 구조, 탄성 및 기계적 특성을 조사하였다. IV족 전이금속 질화물은 V족 전이금속 질화물보다 높은 공유결합 특성을 보였다. 따라서 IV족 전이금속 질화물은 V족 전이금속 질화물보다 취성 거동을 보였다. 대조적으로 V족 전이금속 질화물은 최외각전자 농도에 영향받는 금속결합의 특성 때문에 IV족 전이금속 질화물보다 전단응력에 대한 약한 저항성과 연성 거동을 보였다. Crystal orbital Hamilton population 분석 결과는 모든 전이금속 질화물의 전단 저항 경향성이 일치함을 보여주었다.

• 한국해양공학회지
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• 제15권3호
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• pp.58-62
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• 2001

The objective of research is to clarify the interaction between dislocations and precipitates during high temperature creep deformation behaviors of high n austenitic steels. After measuring the internal stress in minimum creep rate state under applied stress of 236MPa at 873K, a transmission electron microscope (TEM) observation was performed to investigate the interaction between dislocations and precipitates during high temperature creep deformation. The band widths and values of internal stress increased when the nitride precipitates distribute more densely. Fine nitrides disturbed the dislocation movement with pinning the dislocations and perfect dislocations were separated into Shockley partial dislocations by fine nitrides. Coarse nitrides disturbed the dislocation movement with climb mechanism.

• 한국분말재료학회지
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• 제5권1호
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• pp.22-27
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• 1998

The effect of the $\alpha$/$\beta$ phase fraction on the mechanical properties in silicon nitrides was investigated in part 1. In part II, we describe the role of microstructure on the mechanical properties and contact damage of silicon nitrides with coarse/equiaxed and coarse/elongated microstructures. Grain sizes and shapes were controlled by starting powder. Hertzian indentation using spherical indenter was also used to investigate contact damage behavior. Cone cracks from the spherical indentation were suppressed when the silicon nitride contains coarse and elongated grains. Coarse and elongated grains played an important role of cone crack suppression. The size of quasi-plastic zone does not depend on grain size or shape but depends on the fraction of $\alpha$/$\beta$ phase. A quasi-plastic zone was consisting of microcracks by shear stress during indentation.

• Bulletin of the Korean Chemical Society
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• 제29권12호
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• pp.2413-2418
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• 2008

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.327.1-327.1
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• 2014

Nitrides-on-silicon structures are considered to be an excellent candidate for unique design architectures and creating devices for high-power applications. Therefore, a lot of effort has been concentrating on growing high-quality III-nitrides on Si substrates, mostly Si(111) and Si(001) substrates. However, there are several fundamental problems in the growth of nitride compound semiconductors on silicon. First, the large difference in lattice constants and thermal expansion coefficients will lead to misfit dislocation and stress in the epitaxial films. Second, the growth of polar compounds on a non-polar substrate can lead to antiphase domains or other defective structures. Even though the lattice mismatches are reached to 16.9 % to GaN and 19 % to AlN and a number of dislocations are originated, Si(111) has been selected as the substrate for the epitaxial growth of nitrides because it is always favored due to its three-fold symmetry at the surface, which gives a good rotational matching for the six-fold symmetry of the wurtzite structure of nitrides. Also, Si(001) has been used for the growth of nitrides due to a possible integration of nitride devices with silicon technology despite a four-fold symmetry and a surface reconstruction. Moreover, Si(110), one of surface orientations used in the silicon technology, begins to attract attention as a substrate for the epitaxial growth of nitrides due to an interesting interface structure. In this system, the close lattice match along the [-1100]AlN/[001]Si direction promotes the faster growth along a particular crystal orientation. However, there are insufficient until now on the studies for the growth of nitride compound semiconductors on Si(110) substrate from a microstructural point of view. In this work, the microstructural properties of nitride thin layers grown on Si(110) have been characterized using various TEM techniques. The main purpose of this study was to understand the atomic structure and the strain behavior of III-nitrides grown on Si(110) substrate by molecular beam epitaxy (MBE). Insight gained at the microscopic level regarding how thin layer grows at the interface is essential for the growth of high quality thin films for various applications.

• Transactions on Electrical and Electronic Materials
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• 제9권6호
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• pp.231-236
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• 2008

B, P, and Cs ions were implanted with various parameters into silicon nitride layers prepared by LPCVD. In order to get the maximum impurity concentration at the silicon nitride surface, a high temperature oxide (HTO) buffer layers was deposited prior to the implantation. Alkali ion and pH sensing properties of the layers were investigated with an electrolyte-insulator-silicon (EIS) structure using high frequency capacitance-voltage (HF-CV) measurements. The ion sensing properties of implanted silicon nitrides were compared to those of as-deposited silicon nitride. Band Cs co-implanted silicon nitrides showed a pronounced difference in pH and alkali ion sensing properties compared to those of as-deposited silicon nitride. B or P implanted silicon nitrides in contrast showed similar ion sensitivities like those of as-deposited silicon nitride.

• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2001년도 춘계학술대회 논문집
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• pp.332-337
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• 2001

The objective of research is to clarify the interaction between dislocations and precipitates during high temperature creep deformation behaviors of high Mn austenitic steels. After measuring the internal stress in minimum creep rate at 873K, a transmission electron microscope (TEM) observation was performed to investigate the interaction between dislocations and precipitates during high temperature creep deformation. The band width of effective stress and internal stress increased when the nitride precipitates distribute more densely. Fine nitrides disturbed the dislocation movement with pinning the dislocations and perfect dislocations were separated into Shockley partial dislocations by fine nitrides. Coarse nitrides disturbed the dislocation movement with climb mechanism.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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• pp.157-158
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• 2002

A surface hardenable low alloy carbon steel was implanted with medium energy (20 - 50KeV) $N_2^+$ ions to produced a modified hardened surface. The implantation conditions were varied and are given in several doses. The surface hardness of treated and untreated steels were measured using depth sensing ultra micro indentation system (UMIS). It is shown that the hardness of nitrogen ion implanted steels varied from 20 to 50GPa depending on the implantation conditions and the doses of implantation. The structure of the modified surfaces was examined by X-ray photoelectron spectroscopy (XPS). It was found that the high hardness on the implanted surfaces was as a result of formation of non-equilibrium nitrides. High-resolution XPS studies indicated that the nitride formers were essentially C and Si from the alloy steel. The result suggests that the ion implantation provided the conditions for a preferential formation of C and Si nitrides. The combination of evidences from nano-indentation and XPS, provided a strong evidence for the existence of $sp^3$ type of bonding in a suspected $(C,Si)_xN_y$ stoichiometry. The formation of ultra hard surface from relatively cheap low alloy steel has significant implication for wear resistance implanted low alloy steels.

• 한국표면공학회지
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• 제34권3호
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• pp.231-239
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• 2001

The structure and composition of Cr-nitrides formed on an electroplated hard Cr layer during an ionnitriding process was analyzed, and the growth kinetics of the Cr-nitrides was examined as a function of the ion-nitriding temperature and time in order to establish a computer simulation model prediction the growth behavior of the Cr-nitride layer. The Cr-nitrides formed during the ion-nitriding at $550~770^{\circ}C$ were composed of outer CrN and inner $Cr_2$N layers. A nitrogen diffusion model in the multi-layer based on fixed grid FDM (Finite Difference Method) was applied to simulate the growth kinetics of Cr-nitride layers. By measuring the thickness of each Cr-nitride layer as a function of the ion-nitriding temperature and time, the activation energy for growth of each Cr-nitride was determined; 82.26 KJ/mol for CrN and 83.36 Kj/mol for $Cr_2$N. Further, the nitrogen diffusion constant was determined in each layer; $9.70$\times$10^{-12}$ /$m^2$/s in CrN and $2.46$\times$10^{-12}$ $m^2$/s in $Cr_2$N. The simulation on the growth kinetics of Cr-nitride layers was in good agreements with the experimental results at 550~72$0^{\circ}C$.