• 제목/요약/키워드: nickel plating

검색결과 266건 처리시간 0.023초

비시안 무전해 Au 도금의 석출거동에 미치는 하지층 무전해 Ni-P 도금 조건의 영향 (Effect of underlayer electroless Ni-P plating on deposition behavior of cyanide-free electroless Au plating)

  • 김동현;한재호
    • 한국표면공학회지
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    • 제55권5호
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    • pp.299-307
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    • 2022
  • Gold plating is used as a coating of connector in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. In most cases, internal connection between device and package and external terminals for connecting packaging and printed circuit board are electroless Ni-P plating followed by immersion Au plating (ENIG) to ensure connection reliability. The deposition behavior and film properties of electroless Au plating are affected by P content, grain size and mixed impurity components in the electroless Ni-P alloy film used as the underlayer plating. In this study, the correlation between electroless nickel plating used as a underlayer layer and cyanide-free electroless Au plating using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated.

비전해 방법을 이용한 니켈 코팅 알루미늄 분말 제조 및 열물성 평가 (Fabrication and Thermophysical Properties of Nickel-coated Aluminum Powder by Electroless Plating)

  • 이상협;임지환;노관영;윤웅섭
    • 한국추진공학회지
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    • 제18권4호
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    • pp.9-17
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    • 2014
  • 본 연구에서는 고에너지 알루미늄 분말의 점화성 향상을 위해 자연상태 알루미나 산화막을 화학적으로 제거하고 니켈 코팅을 수행하였다. 니켈 코팅은 무전해 방법을 사용하였으며 SEM/EDS에 의한 표면 분석을 통해 시간에 따른 니켈 코팅 정도를 정성 정량적으로 확인하였다. 또한 XRD에 의한 화학종 분석과 TGA/DSC를 이용한 공기 환경 내에서의 열물성 분석을 수행하였고 이를 통해 공기 산화제 분위기에서의 니켈 코팅 된 알루미늄 분말의 점화촉진 메커니즘을 설명하였다. 이러한 결과를 통해 니켈 코팅 된 알루미늄이 코팅 되지 않은 알루미늄보다 좋은 점화성을 갖는 것을 정성적으로 확인하였다.

태양전지의 저가격.고효율화를 위한 Ni/Cu/Ag 전극에 관한 연구 (The Research of Solar Cells Applying Ni/Cu/Ag Contact for Low Cost & High Efficiency)

  • 조경연;이지훈;이수홍
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.444-445
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    • 2009
  • The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on $0.2\sim0.6\;{\Omega}{\cdot}cm$, $20\;\times\;20\;mm^2$, CZ(Czochralski) wafer.

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국산동판을 사용한 리드프레임 도금기술에 관한 연구 (Electroplating on the Lead Frames Fabricated from Domestic Copper Plate)

  • 장현구;이대승
    • 한국표면공학회지
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    • 제19권3호
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    • pp.92-108
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    • 1986
  • An electroplating on the lead frame fabricated from domestic copper plate was studied experimentally. In this study, nickel was plated on the thin copper lead frame and silver layer was coated on the nickel film in the cyanide electrolyte. The effect of process variables such as current density, plating time, coating thickness and flow rate of electrolytic solution on the properties of coating was investigated. Some samples on each step were fabricated during electroplating. The results obtained from polarization measurement, observation of SEM photograph, adhesion test of coating and microhardness test are as follows. On silver plating, polarization resistance of potentiostatic cathodic polarization curve is reduced as the flow rate of Ag electrolytic solution increases. And above resistance is also reduced when the minor chemicals of sodium cyanide and sodium carbonate are added in potassium silver cyanide bath. The reduced polarization resistance makes silver deposition on the cathode easy. An increase in the current density and the coating thickness causes the particle size of deposit to coarsen, and consequently the Knoop microhardness of the coating decreases. On selective plating an increase in the flow rate of plating solution lead to do high speed plating with high current density. In this case, the surface morphology of deposit is of fine microstructure with high Knoop hardness. An increasing trend of the adhesion of coating was shown with increasing the current density and flow rate of electrolytic solution.

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초음파를 이용한 초임계 이산화탄소 에멀젼내 Ni 전해도금 (Ni Electroplating in the Emulsions of Supercritical $CO_2$ Formed by Ultrasonar)

  • 고문성;주민수;박광헌;김홍두;김학원;한성호
    • 한국표면공학회지
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    • 제37권6호
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    • pp.344-349
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    • 2004
  • Emulsions were formed through putting small quantity of nickel electroplating solution into supercritical carbon dioxide, and then electroplating in the $sc-CO_2$ emulsions was conducted. It is an environmental-friendly technology that can solve the treatment of a large quantity of toxic plating wastewater, which is a big problem in the existing wet plating, and also can reduce secondary waste generation fundamentally. Supercritical carbon dioxide emulsions enhanced by ultrasonic horn were formed by non-ionic surfactant and nickel solution. Plating condition within emulsions was set up as 120bar and $55^{\circ}C$ through measurement of electrical conductivity following the pressure change. Experiments were conducted respectively against supercritical carbon dioxide emulsions electroplating and general chemical electroplating, and then their results were compared and analyzed. As the experiment result utilizing emulsions, plating surface was formed very evenly even with a small quantity of electroplating solution, and fine particles were plated compactly without any pinhole or crack due to hydrogenation, which occurs in general electroplating. Used electroplating solution can be reused through recovery process. Therefore, this technology will be able to be applied as new clean technology in electro-plating.

An Environment-Friendly Surface Pretreatment of ABS Plastic for Electroless Plating Using Chemical Foaming Agents

  • Kang, Dong-Ho;Choi, Jin-Chul;Choi, Jin-Moon;Kim, Tae-Wan
    • Transactions on Electrical and Electronic Materials
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    • 제11권4호
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    • pp.174-177
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    • 2010
  • We have developed an environment-friendly etching process, an alternative to the dichromic acid etching process, as a pretreatment of acrylonitrile-butadiene-styrene (ABS) plastic for electroless plating. In order to plate ABS plastic in an electroless way, there should be fine holes on the surface of the ABS plastic to enhance mechanically the adhesion strength between the plastic surface and the plate. To make these holes, the surface was coated uniformly with dispersed chemical foaming agents in a mixture of environmentally friendly dispersant and solvent by the methods of dipping or direct application. The solvent seeps into just below the surface and distributes the chemical foaming agents uniformly beneath the surface. After drying off the surface, the surface was heated at a temperature well below the glass transition temperature of ABS plastic. By pyrolysis, the chemical foaming agents made fine holes on the surface. In order to discover optimum conditions for the formation of fine holes, the mixing ratio of the solvent, the dispersant and the chemical foaming agent were controlled. After the etching process, the surface was plated with nickel. We tested the adhesion strength between the ABS plastic and nickel plate by the cross-cutting method. The surface morphologies of the ABS plastic before and after the etching process were observed by means of a scanning electron microscope.

광택니켈도금공정용 전문가시스템의 개발에 관한 연구 (A Study on the Development of an Expert System for Bright Nickel Plating Processes)

  • 노병호;김석일;조정준;김병학
    • 한국표면공학회지
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    • 제26권3호
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    • pp.121-126
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    • 1993
  • In this study, a user-friendly expert system is developed for bright nickel plating processes which have a number of influence factors related to the plating quality. Because the mutual relations between these factors in the processes are not quantitatively identified, the expert system deals mainly with the troubleshooting process problems by using the production rule which is able to utilize effectively the qualitatives knowledge and the accumulated experience. Especially, to provide the system user with more timely and convenient informations about the cause of problem symptom and the corresponding countermeasure, it is introduced the interactive user interface using the Korean language. Also the knowledge base and inference engine of the expert system are completely separated, so that the substance of knowledge base can be easily updated and extended.

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무전해 니켈 도금용액에 사용되는 안정제의 도금피막 특성에 미치는 영향 (The Effect of Stabilizers on the Characteristics of Deposit in the Electroless Nikel Plating)

  • 이홍기;손성호;전준미;구석본;허진영
    • 한국표면공학회지
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    • 제37권6호
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    • pp.335-343
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    • 2004
  • Bath stabilizers in the electroless nickel(EN) plating solution are known to prevent sudden bath decomposition and extend its lifetime. Further, every stabilizer has a different role and function in EN solution and it influences the surface structure. In this study, the effects of various stabilizers on the deposition rate, surface morphology, deposition content of phosphor and hardness were investigated.

니켈 나노입자가 흡착된 에너제틱용 고반응성 알루미늄 분말 합성 (Synthesis of Nickel Nanoparticle-adsorbed Aluminum Powders for Energetic Applications)

  • 김동원;권구현;김경태
    • 한국분말재료학회지
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    • 제24권3호
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    • pp.242-247
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    • 2017
  • In this study, the electroless nickel plating method has been investigated for the coating of Ni nanoparticles onto fine Al powder as promising energetic materials. The adsorption of nickel nanoparticles onto the surface of Al powders has been studied by varying various process parameters, namely, the amounts of reducing agent, complexing agent, and pH-controller. The size of nickel nanoparticles synthesized in the process has been optimized to approximately 200 nm and they have been adsorbed on the Al powder. TGA results clearly show that the temperature at which oxidation of Al mainly occurs is lowered as the amount of Ni nanoparticles on the Al surface increases. Furthermore, the Ni-plated Al powders prepared for all conditions show improved exothermic reaction due to the self-propagating high-temperature synthesis (SHS) between Ni and Al. Therefore, Al powders fully coated by Ni nanoparticles show the highest exothermic reactivity: this demonstrates the efficiency of Ni coating in improving the energetic properties of Al powders.

에너제틱 응용을 위한 Ni코팅된 Al분말소재 제조 및 산화거동 (Fabrication and Oxidation Behaviors of Nickel-coated Aluminum Powders for Energetic Applications)

  • 김경태;우재열;유지훈;이혜문;임태수;최윤정;김창기
    • 한국입자에어로졸학회지
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    • 제10권4호
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    • pp.177-182
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    • 2014
  • In this study, nickel-coated aluminum (Ni/Al) powders were synthesized for the utilization of energetic applications. Oxide materials present at the surface of Al powders of $45{\mu}m$ in averaged size were removed by using sodium hydroxide(NaOH) solution which is used for controlling pH. Nickel material is coated into the surface of oxide-removed Al powders by electroless-plating process. The microstructure of fabricated Ni/Al powders shows that nickel layers with a few hundreds nm were very homogeneously formed onto the surface of Al powders. The oxidation behavior of Ni/Al exihibit somewhat faster oxidation rate than that of pure Al with surface oxidation. Also, the higher exothermic reaction was observed from the Ni/Al powders. From the result of this, nickel coating is very promising method to obtain highly reactive and safe Al powders for energetic applications.