• 마이크로전자및패키징학회지
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• 제15권4호
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• pp.65-70
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• 2008

본 연구에서는 BGA(Ball Grid Array) 솔더 접합부에 high impact가 가해졌을 경우 접합부의 기계적 특성에 대해서 연구하였다. 시편은 ENIG(Electroless Nickel Immersion Gold) 표면 처리된 FR-4 기판 위에 직경이 500 ${\mu}m$인 Sn-37Pb 솔더볼을 BGA 방식으로 배열하고 리플로우(Reflow)를 통하여 제작하였다. HTS(High Temperature Storage) 테스트를 위해, 시편을 일정한 온도의 $120^{\circ}C$에서 250시간 동안 시효처리(Aging)를 실시하였다. 시효처리 후, 각각의 시편은 고속 전단 시험기(Dage-4000HS)를 이용하여 속도 변수는 0.01, 0.1, 1, 3 m/s로 설정하여 고속전단 시험을 실시하였다. 전단시험 후, 솔더 접합 계면과 파면을 주사전자현미경(Scanning Electron Microscope, SEM)을 통하여 관찰하였다. 솔더 접합 계면에는 $Ni_3Sn_4$의 금속간 화합물이 성장하였으며, 시효처리 후, 솔더 접합 계면에 생성된 금속간 화합물의 두께가 증가하는 것을 관찰 할 수 있었다. 전단 시험 결과, 전단 속도가 빨라짐에 따라 전단 강도값은 증가하는 경향을 나타내었다. 솔더 접합부의 파단은 전단 속도와 시효처리 시간에 따라 다양한 파괴 모드로 진행됨을 알 수 있었다. 또한, 파괴 모드는 연성파괴 형상을 보이다가 전단속도가 증가함에 따라 취성 파괴 형상으로 변하는 것을 알 수 있었다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• 마이크로전자및패키징학회지
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• 제30권1호
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• pp.55-62
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• 2023

본 연구에서는 서로 다른 Pore per inch (PPI, 1 inch 당 pore의 수)를 갖는 Ni-foam 사이에 Sn-3.0Ag-0.5Cu(wt.%, SAC305) 솔더 침지 공정을 수행하여 Ni-foam/SAC305 복합 솔더를 제조한 후, 이를 천이액상 확산 접합(Transient liquid Phase bonding, TLP bonding) 공정에 적용하여 형성된 접합부의 미세구조 분석 및 기계적 특성 평가가 수행되었다. 제조된 Ni-foam/SAC305 복합 솔더 프리폼 (Solder preform)은 Ni-foam 및 SAC305로 구성되었으며, Ni-foam 계면에는 (Ni,Cu)₃Sn₄ 조성의 금속간 화합물이 형성되었다. TLP 접합 공정 수행 시, Ni-foam 계면의 금속간 화합물은 (Ni,Cu)₃Sn₄+Au로 변환 되었으며, 접합 시간이 증가할수록 Ni-foam과 SAC305가 지속적으로 반응하면서 접합부는 금속간 화합물로 변환되었다. 130 PPI Ni-foam/SAC305 복합 솔더 접합부가 가장 빠른 속도로 금속간 화합물로 변화되는 것을 확인하였다. 기계적 특성에 미치는 Ni-foam의 영향을 확인하기 위해 전단 시험 수행 결과, TLP 접합 초기에 모든 조건의 솔더 접합부는 50 MPa 이상의 우수한 기계적 특성을 나타내었으며, 접합 시간이 증가할수록 전단 강도는 증가하는 경향을 나타내었다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2010년도 춘계학술발표대회 초록집
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• pp.82-82
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• 2010

표면실장 공법을 통해 CSP 패키지를 보드에 실장 하는데 있어 무연솔더 접합부의 신뢰성에 영향을 미치는 인자 중 가장 중요한 것은 접합부에 형성되는 IMC (Intermetallic compound, 금속간화합물)인 것으로 알려져 있다. 접합부의 칩 부분에는 솔더와 칩의 UBM (Under bump metalization)이 접합하여 IMC가 형성되나, 보드 부분에는 솔더와 보드의 UBM 뿐만 아니라 그 사이에 솔더 페이스트가 함께 접합되어 IMC가 형성된다. 본 연구에서는 패키지의 신뢰성 연구를 위해 솔더 페이스트의 유무 및 두께에 따른 무연 솔더 접합부의 미세조직의 변화를 분석하였다. 본 실험에서는 Sn-3.0(Wt.%)Ag-0.5Cu 조성과 본 연구진에 의해 개발된 Sn-Ag-Cu-In 조성의 직경 $450{\mu}m$ 솔더 볼을 사용하였으며, 솔더 페이스트는 상용 Sn-3.0Ag-0.5Cu (ALPHA OM-325)를 사용하였다. 칩은 ENIG (Electroless nickel immersion gold) finish pad가 형성된 CSP (Chip scale package)를, 보드는 OSP (Organic solderability preservative)/Cu finish pad가 형성된 것을 사용하였다. 실험 방법은 보드를 솔더 페이스트 없이 플라즈마 처리 한 것, 솔더 페이스트를 $30{\mu}m$ 두께로 인쇄한 것, $120{\mu}m$의 두께로 인쇄한 것, 이렇게 3가지 조건으로 준비한 후, 솔더 볼이 bumping된 칩을 mounting하여, $242^{\circ}C$의 peak 온도 조건의 oven(1809UL, Heller)에서 reflow를 실시하여 패키지를 형성하였다. 이후 시편은 정밀 연마한 후, OM(Optical Microscopic)과 SEM(scanning electron microscope) 및 EDS(energy dispersive spectroscope)를 사용하여 솔더 접합부 IMC의 미세조직을 관찰, 분석하였다.

• 한국세라믹학회지
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• 제51권4호
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• pp.367-373
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• 2014

In this study, the reducing agent hydrazine and precipitator NaOH were used with $NiCl_2$ as a starting material in order to compound Ni-based material with spherical nano characteristics; resulting material was used as an anode for SOFC. Synthetic temperature, pH, and solvent amounts were experimentally optimized and the synthesis conditions were confirmed. Also, a 0 ~ 0.15 mole ratio of metal(Co, Fe) was alloyed in order to increase the catalyst activation performance of Ni and finally, spherical nano $Ni_{(1-x)}-M_{(x=0{\sim}0.15)}$(M = Co, Fe) alloy materials were compounded. In order to evaluate the catalyst activation for hydrocarbon fuel, fuel gas(10%/$CH_4$+10%/Air) was added and the responding gas was analyzed with GC(Gas Chromatography). Catalyst activation improvement was confirmed from the 3% hydrogen selectivity and 2.4% methane conversion rate in $Ni_{0.95}-Co_{0.05}$ alloy; those values were 4.4% and 19%, respectively, in $Ni_{0.95}-Fe_{0.05}$ alloy.

• 한국해양공학회지
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• 제27권2호
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• pp.75-79
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• 2013

This study was carried out to investigate the precipitation behavior of the ${\chi}$ phase and the impact toughness of 25%Cr-7%Ni-2%Mo-4%W super duplex stainless steel. The ${\chi}$ phase was precipitated in the early stage of aging, and with the increasing aging time. However, after reaching a maximum value, the number decreased as a result of the gradual transformation of the ${\chi}$ phase into the ${\sigma}$-phase. It was proved that the ${\chi}$ phase was an intermetallic compound, which represented a lower nickel concentration, higher chromium and molybdenum concentrations, and very higher tungsten concentration compared to the matrix phases. It also showed higher molybdenum and tungsten concentrations than the ${\sigma}$ phase. The decomposition of the ferrite phase into the ${\gamma}_2$ and ${\sigma}$ phases was retarded by W substitution for Mo. Thus, the number of ${\chi}$ phases increased. The impact value was decreased by the substitution of W for Mo. The impact toughness rapidly decreased with time when the ${\chi}$ phase began to precipitate in the initial stage of aging. The impact toughness was, therefore, greatly influenced for the precipitation of the ${\chi}$ phase.

• 자원리싸이클링
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• 제30권6호
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• pp.36-42
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• 2021

폐리튬이온배터리에 함유된 유가금속을 회수하기 위해 고온에서 용융환원처리한다. 용융환원된 금속상을 염산용액으로 침출한 다음 용매추출과 침전으로 유가금속을 분리한 여과액에는 니켈(II)과 미량의 규소(IV)가 함유되어 있다. 여액으로부터 고순도 니켈화합물을 회수하기 위해 흡착법에 의한 규소(IV)의 분리와 니켈(II)의 선택적 침전에 대해 조사했다. Polyacrylamide는 규소(IV)를 선택적으로 흡착했으나 용액의 점도 역시 증가하여 여과가 어렵다. 침전제로 탄산나트륨을 첨가하면 니켈(II)과 미량의 규소(IV)가 공침되었다. 반면 옥살산나트륨은 상온에서 니켈(II)만을 선택적으로 침전시켜 순도 99.99% 이상의 니켈옥살산염 결정상을 회수할 수 있었다.

• 한국분말재료학회지
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• 제28권6호
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• pp.497-501
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• 2021

Cobalt (Co) is mainly used to prepare cathode materials for lithium-ion batteries (LIBs) and binder metals for WC-Co hard metals. Developing an effective method for recovering Co from WC-Co waste sludge is of immense significance. In this study, Co is extracted from waste cemented carbide soft scrap via mechanochemical milling. The leaching ratio of Co reaches approximately 93%, and the leached solution, from which impurities except nickel are removed by pH titration, exhibits a purity of approximately 97%. The titrated aqueous Co salts are precipitated using oxalic acid and hydroxide precipitation, and the effects of the precipitating agent (oxalic acid and hydroxide) on the cobalt microstructure are investigated. It is confirmed that the type of Co compound and the crystal growth direction change according to the precipitation method, both of which affect the microstructure of the cobalt powders. This novel mechanochemical process is of significant importance for the recovery of Co from waste WC-Co hard metal. The recycled Co can be applied as a cemented carbide binder or a cathode material for lithium secondary batteries.

• 분석과학
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• 제19권4호
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• pp.309-315
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• 2006

Two piperazine-templated metal sulfate complexes, $(C_4N_2H_{12})[Ni(H_2O)_6](SO_4)_2$, I and ($C_4N_2H_{12}$) $[Co(H_2O)_6](SO_4)_2$, II, have been synthesized by hydro/solvothermal reactions and their crystal structures analyzed by single crystal X-ray diffraction methods. Complex I crystallizes in the monoclinic system, $P2_1/n$ space group, a=12.920(3), b=10.616(2), $c=13.303(2){\AA}$, ${\beta}=114.09(1)^{\circ}$, Z=4, $R_1=0.030$ for 3683 reflections; II: monoclinic $P2_1/n$, a=12.906(3), b=10.711(2), $c=13.303(2){\AA}$, ${\beta}=114.10(2)^{\circ}$, Z=4, $R_1=0.032$ for 4010 reflections. The crystal structures of the piperazine-templated metal(II) sulfates demonstrate zero-dimensional compound constituted by diprotonated piperazine cations, metal(II) cations and sulfate anions. The structures of complex I and II are substantially isostructural to that of the previously reported our piperazine-templated copper(II) sulfate complex $(C_4N_2H_{12})[Cu(H_2O)_6](SO_4)_2$. The central metal(II) atoms are coordinated by six water molecules in the octahedral geometry. The crystal structures are stabilized by three-dimensional networks of the $O_{water}-H{\cdots}O_{sulfate}$ and $N_{pip}-H{\cdots}O_{sulfate}$ hydrogen bonds between the water molecules and sulfate anions and protonated piperazine cations. Based on the results of thermal analysis, the thermal decomposition reactions of the complex I was analyzed to have three distinctive stages whereas the complex II proceed through several stages.

• Journal of Welding and Joining
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• 제30권5호
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• pp.64-69
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• 2012

Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.