• 제목/요약/키워드: nano-transfer printing

검색결과 26건 처리시간 0.027초

Graphene Based Nano-electronic and Nano-electromechanical Devices

  • Lee, Sang-Wook
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.13-13
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    • 2011
  • Graphene based nano-electronic and nano-electromechanical devices will be introduced in this presentation. The first part of the presentation will be covered by our recent results on the fabrication and physical properties of artificially twisted bilayer graphene. Thanks to the recently developed contact transfer printing method, a single layer graphene sheet is stacked on various substrates/nano-structures in a controlled manner for fabricating e.g. a suspended graphene device, and single-bilayer hybrid junction. The Raman and electrical transport results of the artificially twisted bilayer indicates the decoupling of the two graphene sheets. The graphene based electromechanical devices will be presented in the second part of the presentation. Carbon nanotube based nanorelay and A new concept of non-volatile memory based on the carbon nanotube field effect transistor together with microelectromechanical switch will be briefly introduced at first. Recent progress on the graphene based nano structures of our group will be presented. The array of graphene resonators was fabricated and their mechanical resonance properties are discussed. A novel device structures using carbon nanotube field effect transistor combined with suspended graphene gate will be introduced in the end of this presentation.

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Novel 3D nanofabrication technique and its applications

  • 전석우
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2009년도 춘계학술발표대회
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    • pp.15.1-15.1
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    • 2009
  • Nano transfer printing and micro contact printing is well known printing method based on soft lithography which uses conformal soft elastomer with designed surface relief structures. Here I introduce another class of novel 3D nanofabrication technique by using the same elastomer but in a different manner. The approach, which we refer to as proximity field nanopatterning, uses the surface-reliefed elastomers as phase masks to pattern thick layers of transparent, photosensitive materials. Aspects of the optics, the materials, and the physical chemistry associated with this method are outlined. A range of 3D structures illustrate its capabilities, and several application examples demonstrate possible areas of use in technologies ranging from microfluidics to photonic materials to density gradient structures for chemical release and high-energy density science.

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패턴전사프린팅용 고분자 복제 소재 연구 (A Study on Polymer Replica Materials for Nanotransfer Printing)

  • 강영림;박운익
    • 한국전기전자재료학회논문지
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    • 제34권4호
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    • pp.262-268
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    • 2021
  • For the past several decades, various next-generation patterning methods have been developed to obtain well-designed nano-to-micro structures, such as imprint lithography, nanotransfer printing (nTP), directed self-assembly (DSA), E-beam lithography, and so on. Especially, nTP process has much attention due to its low processing cost, short processing time, and good compatibility with other patterning techniques in achieving the formation of high-resolution functional patterns. To transfer functional patterns onto desirable substrates, the use of soft materials is required for precise replication of master mold. Here, we introduce a simple and practical nTP method to create highly ordered structures using various polymeric replica materials. We found that polymethyl methacrylate (PMMA), polystyrene (PS), and polyvinylpyridine (PVP) are possible candidates for replica materials for reliable duplication of Si master mold based on systematic analysis of pattern visualization. Furthermore, we successfully obtained well-defined metal and oxide nanostructures with functionality on target substrates by using replica patterns, through deposition and transfer process. We expect that the several candidates of replica materials can be exploited for effective nanofabrication of complex electronic devices.

전사공정을 위한 UV 경화성 범프형 스탬프의 점착특성 평가 (Evaluation for Adhesion Characteristics of UV-curable Bump Shape Stamp for Transfer Process)

  • 정연우;김경식;이충우;이재학;김재현;김광섭
    • Tribology and Lubricants
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    • 제32권3호
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    • pp.75-81
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    • 2016
  • Future electronics such as electronic paper and foldable cellphone are required to be flexible and transparent and should have a high performance. In order to fabricate the flexible electronics using flexibility transfer process, techniques for transferring various devices from rigid substrate onto flexible substrate by elastomeric stamp, have been developed. Adhesion between the elastomeric stamp and various devices is crucial for successful transfer process. The adhesion can be controlled by the thickness of the stamp, separation velocity, contact load, and stamp surface treatment. In this study, we fabricated the bump shape stamp consisting of a UV-curable polymer and investigated the effects of curing condition, separation velocity, and contact load on the adhesion characteristics of bumps. The bumps with hemispherical shape were fabricated using a dispensing process, which is one of the ink-jet printing techniques. Curing conditions of the bumps were controlled by the amount of UV irradiation energy. The adhesion characteristics of bumps are evaluated by adhesion test. The results show that the pull-off forces of bumps were increased and decreased as UV irradiation energy increased. For UV irradiation energies of 300 and 500 mJ/cm2, the pull-off forces were increased as the separation velocity increased. The pull-off forces also increased with the increase of contact load. In the case of UV irradiation energy above 600 mJ/cm2, however, the pull-off forces were not changed. Therefore, we believe that the bump shape stamp can be applied to roll-based transfer process and selective transfer process as an elastomeric stamp.

솔-젤법에 의해 제조된 실리콘 태양전지 전극형성용 나노 글래스 (Sol-gel Derived Nano-glass for Silicon Solar Cell Metallization)

  • 강성구;이창완;정윤장;김창균;김성탁;김동환;이영국
    • Current Photovoltaic Research
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    • 제2권4호
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    • pp.173-176
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    • 2014
  • We have investigated the seed layer formation of front side contact using the inkjet printing process. Conductive silver ink was printed on textured Si wafers with 80 nm thick $SiN_x$ anti reflection coating (ARC) layers and thickened by light induced plating (LIP). The inkjet printable sliver inks were specifically formulated for inkjet printing on these substrates. Also, a novel method to prepare nano-sized glass frits by the sol-gel process with particle sizes around 5 nm is presented. Furthermore, dispersion stability of the formulated ink was measured using a Turbiscan. By implementing these glass frits, it was found that a continuous and uniform seed layer with a line width of $40{\mu}m$ could be formed by a inkjet printing process. We also investigated the contact resistance between the front contact and emitter using the transfer length model (TLM). On an emitter with the sheet resistance of $60{\Omega}/sq$, a specific contact resistance (${\rho}_c$) below $10m{\Omega}{\cdot}cm^2$ could be achieved at a peak firing temperature around $700^{\circ}C$. In addition, the correlation between the contact resistance and interface microstructures were studied using scanning electron microscopy (SEM). We found that the added glass particles act as a very effective fire through agent, and Ag crystallites are formed along the interface glass layer.

Organic thin-film transistors and transistor diodes with transfer-printed Au electrodes

  • Cho, Hyun-Duck;Lee, Min-Jung;Yoon, Hyun-Sik;Char, Kook-Heon;Kim, Yeon-Sang;Lee, Chang-Hee
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.1122-1124
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    • 2009
  • Organic thin-film transistors (OTFTs) were fabricated by using the transfer patterning method. In order to remove Au pattern easily, UV-curable polymer mold was surface treated. Au source/drain (S/D) pattern was transferred to insulator-coated substrate surface. Fabricated OTFTs were compared to OTFTs using vacuum-deposited Au S/D. Additionally, transistor diodes were characterized.

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나노임프린트 리소그래피 기술을 이용한 그래핀 나노리본 트랜지스터 제조 및 그래핀 전극을 활용한 실리콘 트랜지스터 응용 (Facile Fabrication Process for Graphene Nanoribbon Using Nano-Imprint Lithography(NIL) and Application of Graphene Pattern on Flexible Substrate by Transfer Printing of Silicon Membrane)

  • 엄성운;강석희;홍석원
    • 한국재료학회지
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    • 제26권11호
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    • pp.635-643
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    • 2016
  • Graphene has shown exceptional properties for high performance devices due to its high carrier mobility. Of particular interest is the potential use of graphene nanoribbons as field-effect transistors. Herein, we introduce a facile approach to the fabrication of graphene nanoribbon (GNR) arrays with ~200 nm width using nanoimprint lithography (NIL), which is a simple and robust method for patterning with high fidelity over a large area. To realize a 2D material-based device, we integrated the graphene nanoribbon arrays in field effect transistors (GNR-FETs) using conventional lithography and metallization on highly-doped $Si/SiO_2$ substrate. Consequently, we observed an enhancement of the performance of the GNR-transistors compared to that of the micro-ribbon graphene transistors. Besides this, using a transfer printing process on a flexible polymeric substrate, we demonstrated graphene-silicon junction structures that use CVD grown graphene as flexible electrodes for Si based transistors.

Ni 박막 위 20 nm급 고정렬 Pt 크로스-바 구조물의 형성 방법 (Pattern Formation of Highly Ordered Sub-20 nm Pt Cross-Bar on Ni Thin Film)

  • 박태완;정현성;조영래;이정우;박운익
    • 대한금속재료학회지
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    • 제56권12호
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    • pp.910-914
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    • 2018
  • Since catalyst technology is one of the promising technologies to improve the working performance of next generation energy and electronic devices, many efforts have been made to develop various catalysts with high efficiency at a low cost. However, there are remaining challenges to be resolved in order to use the suggested catalytic materials, such as platinum (Pt), gold (Au), and palladium (Pd), due to their poor cost-effectiveness for device applications. In this study, to overcome these challenges, we suggest a useful method to increase the surface area of a noble metal catalyst material, resulting in a reduction of the total amount of catalyst usage. By employing block copolymer (BCP) self-assembly and nano-transfer printing (n-TP) processes, we successfully fabricated sub-20 nm Pt line and cross-bar patterns. Furthermore, we obtained a highly ordered Pt cross-bar pattern on a Ni thin film and a Pt-embedded Ni thin film, which can be used as hetero hybrid alloy catalyst structure. For a detailed analysis of the hybrid catalytic material, we used scanning electron microscope (SEM), transmission electron microscope (TEM) and energy-dispersive X-ray spectroscopy (EDS), which revealed a well-defined nanoporous Pt nanostructure on the Ni thin film. Based on these results, we expect that the successful hybridization of various catalytic nanostructures can be extended to other material systems and devices in the near future.

카본나노튜브를 이용한 고성능 나노복합재료의 개발 동향 (The Development of High Performance Nano-composites with Carbon Nanotube)

  • 이민경;배수빈;박종규;이승걸
    • 한국염색가공학회지
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    • 제26권2호
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    • pp.71-78
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    • 2014
  • This review paper is a state of the art report of the development of high performance nano-composites with carbon nanotube. We investigate the research and development (R&D) trends of high performance nano-composites with carbon nanotube by analyzing technical trends in research institutes and industry. We report the R&D and technology trends for the properties and applications of fabrication of hybrid composites with aligned carbon nanotubes, multifunctional fiber/carbon nanotube composites. We discuss the specific topics including unidirectional carbon nanotube, carbon nanotube forests, transfer-printing carbon nanotube technology, deposition of carbon nanotube by electrophoresis, vapor grown carbon fiber (VGCF), cup-stacked carbon nanotube, bucky paper and carbon nanotube yarns in this review paper.

유연기판 위 형성된 나노-마이크로 Pt 금속선 패턴의 내구성 연구 (Durability of Nano-/micro- Pt Line Patterns Formed on Flexible Substrate)

  • 박태완;최영중;박운익
    • 마이크로전자및패키징학회지
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    • 제25권3호
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    • pp.49-53
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    • 2018
  • 정렬된 미세 패턴을 형성하는 기술은 차세대 전자소자를 제작함에 있어서 기틀이 되는 기반기술이기 때문에, 최근 더욱 미세한 패턴을 구현하기 위하여 많은 노력들이 이루어지고 있다. 그 중, 본 연구에서는 패터닝 공정에 있어서 비용이 저렴하고 단시간 내에 고해상도 미세패턴의 형성이 가능한 장점을 갖는 나노 패턴전사 프린팅 공정을 이용하였다. 투명하고 유연한 기판 위에 250 nm, 500 nm, 그리고 $1{\mu}m$의 선폭을 갖는 Pt 금속 라인 패턴을 성공적으로 형성하였으며, 벤딩기기를 사용하여 500회 벤딩평가 후 패턴의 파괴가 일어나는지에 대한 내구성을 평가하였고, 전자현미경을 통하여 분석하였다. 벤딩 전과 후의 패턴에 대한 손상 여부에 대하여 확인한 결과, 다양한 선폭의 금속 라인 패턴이 초기 상태와 변함없이 형상을 유지할 뿐만 아니라, 패턴주기 또한 안정적으로 유지됨을 확인할 수 있었다. 이러한 결과를 볼 때, 나노 패턴 전사 프린팅 공정은 다양한 금속 패턴을 형성하는데 매우 유용하다고 판단되며, 향후 차세대 유연 전자소자 또는 배선 및 인터커넥션 기술로 응용이 가능할 것으로 기대된다.