• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2002.05a
• /
• pp.193-197
• /
• 2002

The tribological properties and van der Waals attractive forces and the thermal stability of films are very important characteristics of highly hydrophobic fluorocarbon (FC) films for the long-term reliability of nano system. The effect of thermal annealing on films and van der Waals attractive forces and friction coefficient of films have been investigate d in this study. It was coated Al wafer which was treated O2 and Ar that ocatfluorocyclobutane ($C_4_{8}$) and Ar were supplied to the CVD chamber in the ratio of 2:3 for deposition of FC Films. Static contact angle and dynamic contact angle were used to characterize FC films. Thickness of films was measured by variable angle spectroscopy ellipsometer (VASE). Nanotribological data was got by atomic force microscopy (AFM) to measure roughness, lateral force microscopy (LFM) to measure friction force, and force vs. distance (FD) curve to evaluate adhesion force. FC films were cured in N2 and vacuum. The film showed the slight changes in its properties after 3 hr annealing. FTIR ATR studies showed the decrease of C-F peak intensity in the spectra as the annealing time increased. A significant decrease of film thickness has been observed. The friction force of Al surface was at least thirty times higher than ones with FC films. The adhesive force of bare Al was greater than 100 nN. After deposit FC films adhesive force was decreased to 40 nN. The adhesive force of films was decreased down to 10 nN after 24 hr annealing. During 24 hr annealing in $N_2$and vacuum at $100^{\circ}C$ film properties were not changed so much.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.3
• /
• pp.37-41
• /
• 2019

Sheet resistance reduction in the Ag nanowire (NW) coated films is accomplished with slight improvement of optical properties for the application of transparent conducting electrodes by using $O_2$ plasma treatment. The sheet resistance was optimized after 30 seconds $O_2$ plasma treatment, showing the 27 % of maximum decrease of sheet resistance. It is found that the $O_2$ plasma treatment get rid of the residual organic materials at the junction of Ag NWs. However, the Ag NWs may be also snapped by the excessive $O_2$ plasma treatment can showing the collapses of Ag NWs networks. Furthermore, the optical properties such as optical transmittance and haze were monotonically improved with the $O_2$ plasma treatment time until 90 seconds.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.3
• /
• pp.51-57
• /
• 2019

To protect the Cu surface from oxidation in air, a two-step plasma process using Ar and $N_2$ gases was studied to form a copper nitride passivation as an anti-oxidant layer. The Ar plasma removes contaminants on the Cu surface and it activates the surface to facilitate the reaction of copper and nitrogen atoms in the next $N_2$ plasma process. This study investigated the effect of Ar plasma on the formation of copper nitride passivation on Cu surface during the two-step plasma process through the full factorial design of experiment (DOE) method. According to XPS analysis, when using low RF power and pressure in the Ar plasma process, the peak area of copper oxides decreased while the peak area of copper nitrides increased. The main effect of copper nitride formation in Ar plasma process was RF power, and there was little interaction between plasma process parameters.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.2
• /
• pp.13-20
• /
• 2023

The process of microelectromechanical system (MEMS) fabrication involves surface treatment to impart functionality to the device. Such surface treatment method is the self-assembled monolayer (SAM) technique, which modifies and functionalizes the surface of MEMS components with organic molecule monolayer, possessing a precisely controllable strength that depends on immersion time and solution concentration. These monolayers spontaneously adsorb on polymeric substrates or metal/ceramic components offering high precision at the nanoscale and modifying surface properties. SAM technology has been utilized in various fields, such as tribological property control, mass-production lithography, and ultrasensitive organic/biomolecular sensor applications. This paper provides an overview of the development and application of SAM technology in various fields.

• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.4
• /
• pp.77-86
• /
• 2008

The reliability of leaded and lead-free solders of BGA type packages on a printed circuit board was investigated by employing the standard drop test and 4-point bending test. Tested solder joints were examined by optical microscopy to identify associated failure mode. Three-dimensional finite element analysis(FEM) with ANSYS Workbench v.11 was carried out to understand the mechanical behavior of solder joints under the influence of bending or drop impact. The results of numerical analysis are in good agreement with those obtained by experiments. Packages in the center of the PCB experienced higher stress than those in the perimeter of the PCB. The solder joints located in the outermost comer of the package suffered from higher stress than those located in center region. In both drop and bending impact tests, the lead-free solder showed better performances than the leaded solders. The numerical analysis results indicated that stress and strain behavior of solder joint were dependent on various effective parameters.

• Journal of the Optical Society of Korea
• /
• v.12 no.1
• /
• pp.38-41
• /
• 2008

Precise micropatterning of polypropylene film, which is highly transparent in the wavelength range over 250 nm has been demonstrated by 355 nm nano/picosecond laser and 785 nm femtosecond laser. Increments of both the pulse energy and the shot number of pulses lead to cooccurrence of photochemical and thermal effects, demonstrated by the spatial expansion of rim on the surface of PP. The shapes of the laser-ablated polypropylene films were imaged by optical microscope and measured by a 3D optical measurement system. And, the ablation depth and width of polypropylene film ablated by femtosecond laser at various pulse energy and pulse number were characterized. Our results demonstrate that a femtosecond pulsed laser is an efficient tool for fabricating micropatterns of polypropylene films, where the micropatterns are specifically tailored in size, location and number easily controlled by laser processing conditions.

• Journal of the Korean Applied Science and Technology
• /
• v.26 no.3
• /
• pp.288-296
• /
• 2009

In this study, the silica-based hybrid material with high barrier property was prepared by incorporating ethylene-vinyl alcohol (EVOH) copolymer, which has been utilized as packaging materials due to its superior gas permeation resistance, during sol-gel process. In preparation of this EVOH/$SiO_2$ hybrid coating materials, the (3-glycidoxy-propyl)-trimethoxysilane (GPTMS) as a silane coupling agent was employed to promote interfacial adhesion between organic and inorganic phases. As confirmed from FT-IR analysis, the physical interaction between two phases was improved due to the increased hydrogen bonding, resulting in homogeneous microstructure with dispersion of nano-sized silica particles. However, depending on the range of content of added silane coupling agent (GPTMS), micro-phase separated microstructure in the hybrid could be observed due to insufficient interfacial attraction or possibility of polymerization reaction of epoxide ring in GPTMS. The oxygen barrier property of the mono-layer coated BOPP (biaxially oriented polypropylene) film was examined for the hybrids containing various GPTMS contents. Consequently, it is revealed that GPTMS should be used in an optimum level of content to produce the high barrier EVOH/$SiO_2$ hybrid material with an improved optical transparency and homogeneous phase morphology.

• Journal of the Semiconductor & Display Technology
• /
• v.19 no.1
• /
• pp.29-35
• /
• 2020

The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.1
• /
• pp.61-66
• /
• 2012

Chemical Mechanical Planarization (CMP) is a polishing process used in the microelectronic fabrication industries to achieve a globally planar wafer surface for the manufacturing of integrated circuits. Pad conditioning plays an important role in the CMP process to maintain a material removal rate (MRR) and its uniformity. For metal CMP process, highly acidic slurry containing strong oxidizer is being used. It would affect the conditioner surface which normally made of metal such as Nickel and its alloy. If conditioner surface is corroded, diamonds on the conditioner surface would be fallen out from the surface. Because of this phenomenon, not only life time of conditioners is decreased, but also more scratches are generated. To protect the conditioners from corrosion, thin organic film deposition on the metal surface is suggested without requiring current conditioner manufacturing process. To prepare the anti-corrosion film on metal conditioner surface, vapor SAM (self-assembled monolayer) and FC (Fluorocarbon) -CVD (SRN-504, Sorona, Korea) films were prepared on both nickel and nickel alloy surfaces. Vapor SAM method was used for SAM deposition using both Dodecanethiol (DT) and Perfluoroctyltrichloro silane (FOTS). FC films were prepared in different thickness of 10 nm, 50 nm and 100 nm on conditioner surfaces. Electrochemical analysis such as potentiodynamic polarization and impedance, and contact angle measurements were carried out to evaluate the coating characteristics. Impedance data was analyzed by an electrical equivalent circuit model. The observed contact angle is higher than 90o after thin film deposition, which confirms that the coatings deposited on the surfaces are densely packed. The results of potentiodynamic polarization and the impedance show that modified surfaces have better performance than bare metal surfaces which could be applied to increase the life time and reliability of conditioner during W CMP.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.4
• /
• pp.75-82
• /
• 2019

Flexible solar cells have attracted enormous attention in recent years due to their wide applications such as portable batteries, wearable devices, robotics, drones, and airplanes. In particular, the demands of the flexible silicon and compound semiconductor solar cells with high efficiency and high reliability keep increasing. In this study, we fabricated a flexible InGaP/GaAs double-junction solar module. Then, the effects of the wind speed and ambient temperature on the operating temperature of the solar cell were analyzed with the numerical simulation. The temperature distributions of the solar modules were analyzed for three different wind speeds of 0 m/s, 2.5 m/s, and 5 m/s, and two different ambient temperature conditions of 25℃ and 33℃. The flexibility of the flexible solar module was also evaluated with the bending tests and numerical bending simulation. When the wind speed was 0 m/s at 25 ℃, the maximum temperature of the solar cell was reached to be 149.7℃. When the wind speed was increased to 2.5 m/s, the temperature of the solar cell was reduced to 66.2℃. In case of the wind speed of 5 m/s, the temperature of the solar cell dropped sharply to 48.3℃. Ambient temperature also influenced the operating temperature of the solar cell. When the ambient temperature increased to 33℃ at 2.5 m/s, the temperature of the solar cell slightly increased to 74.2℃ indicating that the most important parameter affecting the temperature of the solar cell was heat dissipation due to wind speed. Since the maximum temperatures of the solar cell are lower than the glass transition temperatures of the materials used, the chances of thermal deformation and degradation of the module will be very low. The flexible solar module can be bent to a bending radius of 7 mm showing relatively good bending capability. Neutral plane analysis was also indicated that the flexibility of the solar module can be further improved by locating the solar cell in the neutral plane.