• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.814-816
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• 2005

In this paper, we describe how specially developed polymer capped, nano-particle silver inks can be used to print circuitry for applications like displays, RFID antennas and "disposable electronics". The requirements of printing on temperature sensitive flexible substrates (such as polymer films and papers) that require low temperature curing is also discussed.

• Proceedings of the KIEE Conference
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• 2007.11a
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• pp.98-99
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• 2007

This study has successfully demonstrated the direct fabrication of polymer resistors using ink-jet printing technology as an alternative patterning to traditional photolithography. The polymer resistors were fabricated just by two layer processes using a ink-jet printer (DMP-2800, Fujifilm Dimatix). First, resistive materials was patterned by a ink-jet printing with the desired width and length. Next, resistor fabrication was completed by printing metal contact pads on the both sides of the polymer resistor. We used poly (3,4-ethylene dioxythiophene) poly(styrenesulfonate)(PEDOT:PSS) for the resistor material and a nano-sized silver colloid for the metal contact pads. We characterized the electrical properties of PEDOT:PSS by measuring sheet resistance and specific resistance on a glass substrate. From analysis of the measured resistances, the electrical resistances of the polymer resistors linearly increased as a function of printed width and length of resistors. The accuracy of the fabricated polymer resistor showed about $0.6{\sim}2.5%$ error for the same dimensions.

• Journal of the Semiconductor & Display Technology
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• v.9 no.2
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• pp.73-78
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• 2010

This research is about the drying and curing characteristic of conductivity metallic ink on-line curing device in order to improve the curing time for productivity in RFID Gravure printing. The curing process is carried out to increase the electric conductivity after the metallic ink is printed on the substrate. The metal ink is composed of nano-sized silver or copper particles. In this research, the combined IR and Hot air curing system is used and its results is compared with those of oven, IR and Hot Air type respectively. Generally the curing time in the past is about 3 minutes. But the combined system (IR+Hot Air) in this research shows that curing time is less than 30 seconds. These results is much faster than those of other system. This study can be help to make Roll-to-Roll drying and curing process for mass and continuous production on-line.

• Korean Journal of Materials Research
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• v.17 no.9
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• pp.453-457
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• 2007

Interest in use of ink-jet printing for pattern-on-demand fabrication of metal interconnects without complicated and wasteful etching process has been on rapid increase. However, ink-jet printing is a wet process and needs an additional thermal treatment such as an annealing process. Since a metal ink is a suspension containing metal nanoparticles and organic capping molecules to prevent aggregation of them, the microstructure of an ink-jet printed metal interconnect 'as dried' can be characterized as a stack of loosely packed nanoparticles. Therefore, during being treated thermally, an inkjet-printed interconnect is likely to evolve a characteristic microstructure, different from that of the conventionally vacuum-deposited metal films. Microstructure characteristics can significantly affect the corresponding electrical and mechanical properties. The characteristics of change in microstructure and electrical resistivity of inkjet-printed silver (Ag) films when annealed isothermally at a temperature between 170 and $240^{\circ}C$ were analyzed. The change in electrical resistivity was described using the first-order exponential decay kinetics. The corresponding activation energy of 0.44 eV was explained in terms of a thermally-activated mechanism, i.e., migration of point defects such as vacancy-oxygen pairs, rather than microstructure evolution such as grain growth or change in porosity.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.1
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• pp.20-26
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• 2015

Ceramic ink-jet printing technology in art tiles, decorated tablewares and other porcelain products has many advantages of fast and precision printing of various images with high efficiency and low cost. For the application to ink-jet printing, ceramic ink requires a stable dispersibility with nano-sized pigments. In this paper, characteristics of pink-red aqueous ceramic ink for ink-jet printing was demonstrated. $CaCr_{0.1}Sn_{0.8}SiO_5$ pigment was synthesized using solid state reaction and deagglomerated using attrition milling. The aqueous ceramic ink contains 10 wt% of the obtained $CaCr_{0.1}Sn_{0.8}SiO_5$ nanopigment with 0.4 wt% of sodium dodecyl sulfate (SDS) as a dispersion agent. Viscosity of $CaCr_{0.1}Sn_{0.8}SiO_5$ aqueous ceramic ink was adjusted using 0.18 wt% of polyvinyl alcohol (PVA) for a suitable jetting from the nozzle. The prepared pink-red ceramic ink showed a good jetting property with formation of a single sphere-shaped droplet after $180{\mu}s$ without a tail and satellite droplet.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.89.2-89.2
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• 2007

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.2.3-2.3
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• 2011

With increased interest in printed devices, various metal nano inks have been investigated as candidates materials for printed electrodes and wiring as well as conductive film substituting photo-lithography process. Recent advances in organic conductive polymer allow us to fabricate high performance printed device. Meanwhile, there was several attempts to fabricate conductive films by mixing conductive polymer with metal nano-particle or nano-wires. The presence of Ag nanowires in conductive polymer mixture have shown good potential in organic photovoltaic devices.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.9
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• pp.16-19
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• 2010

This paper presents how to design and fabricate the gravure offset printing system for enhancement of register precision. Factors of precision error are caused by imprecision of gravure plate, deformation of substrate, printing quality change due to the change of ink viscosity, Imprecision of printing machine, and so on. This study suggests concept design of gravure offset printing system which is able to minimize or remove these error factors.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2006.05a
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• pp.922-929
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• 2006

In this study, flow characteristics of the FPN (Fountain Pen Nano-Lithography) using active membrane pumping are investigated. This FPN has integrated chamber, micro channel, and high capacity reservoir for continuous ink feed. The most important aspect in this probe provided control of fluid injection using active membrane pumping in chamber. The flow rates in channel by capillary force are theoretically analyzed, including the control of mass flow rates by deflection of membrane. The above results are compared with numerical simulations that calculated by commercial code, FLUENT. The velocity of fluid in micro channel shows linear behaviors. And the mass flows are proportional to the second order function of pumping pressure that is imposed to membrane.

• Korean Journal of Materials Research
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• v.26 no.4
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• pp.216-221
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• 2016

A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature ($300^{\circ}C$) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.