• 제목/요약/키워드: nano Ag

검색결과 342건 처리시간 0.029초

Hydrazine Hydrate 환원(還元)에 의한 질산은(窒酸銀) 수용액(水溶液)으로부터 은(銀) 나노분말(粉末)의 제조(製造) 연구(硏究) (Preparation of Ag Nano-Powder from Aqueous Silver Nitrate Solution through Reduction with Hydrazine Hydrate)

  • 이화영
    • 자원리싸이클링
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    • 제15권4호
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    • pp.19-26
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    • 2006
  • 함은 폐재의 리싸이클링을 위한 연구의 일환으로써 Hydrazine Hydrate을 환원제로 사용하여 질산은 수용액으로부터 Ag 나노분말을 제조하기 위한 실험을 수행하였다. 이를 위해 질산은을 소정 농도로 증류수에 용해시킨 수용액에 Ag 미립자의 응집방지를 위한 분산제로써 Tamol NN8906 혹은 Tween 20을 미리 혼합한 다음 환원제인 Hydrazine Hydrate 용액을 첨가하는 방법으로 환원반응을 실시하였다. 환원반응을 통하여 제조한 Ag 미립자는 입도분석기 및 TEM 측정을 통하여 형상과 평균입도를 측정하였다. Hydrazine Hydrate에 의한 은의 환원을 위해서는 이론치의 약 2배를 첨가해 주어야 하는 것으로 나타났으며, Tamol NN8906을 분산제로 사용하여 제조한 Ag 나노분발은 매우 좁은 입도범위의 분포특성을 보여 주었다. Tween 20을 분산제로 사용한 경우의 입도 분포는 bimodal 혹은 multimodal distribution을 보였으며, 입자 모양에 있어서는 Tamol NN8906과 Tween 20이 모두 비슷하게 표면이 매끄러운 불규칙한 모양의 입자들로 구성되어 있었다.

저온 경화형 Ag 페이스트 및 이를 이용한 Ag 후막의 제조 및 특성 (Properties of Ag Thick Films Fabricated by Using Low Temperature Curable Ag Pastes)

  • 박준식;황준호;김진구;김용한;박효덕;강성군
    • 한국재료학회지
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    • 제13권1호
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    • pp.18-23
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    • 2003
  • Properties of Ag thick films fabricated by using low temperature curable silver pastes were investigated. Ag pastes were consisted of polymer resins and silver powders. Ag pastes were used for conductive or fixing materials between board and various electrical and electronic devices. Low temperature curable Ag pastes have some advantages over high temperature curable types. In cases of chip mounting, soldering properties were required for screen printed Ag thick films. In this study, four types of Ag pastes were fabricated with different compositions. Screen printed Ag thick films on alumina substrates were fabricated at various curing temperatures and times. Thickness, resistivity, adhesive strength and solderability of fabricated Ag thick films were characterized. Finally, Ag thick films produced using Ag pastes, sample A and B, cured at $150^{\circ}C$ for longer than 6 h and $180^{\circ}C$ for longer than 2 h, and $150^{\circ}C$ for longer than 1 h and $180^{\circ}C$ for 1 h, respectively, showed low resistivities of $10^{-4}$ $∼10^{-5}$ Ωcm and good adhesive strength of 1∼5 Mpa. Soldering properties of those Ag thick films with curing temperatures at solder of 62Sn/36Pb/3Ag were also investigated.

나노 임프린트 공정을 이용한 Ag 나노로드 제조 및 비정질 박막 태양전지 적용 (Ag nanorod manufacturing using nano-imprint lipography process and application of amorphous thin film solar cells)

  • 장지훈;한강수;조준식;이헌;박해웅;송진수;이정철
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2011년도 춘계학술대회 초록집
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    • pp.103.2-103.2
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    • 2011
  • 비정질 실리콘 태양전지의 효율을 증가하기 위하여 많이 사용되는 방법 중 하나는 입사되는 빛의 산란을 증가하여 태양전지의 광흡수를 증가시키는 방법이다. 이를 위하여 양극전극으로 사용되는 TCO층의 일정한 패턴 처리를 통하여 광산란을 증가시키는 방법이 사용되고 있다. 본 연구에서는 나노 임프린트 리소그래피방법을 사용하여 Ag 나노로드를 증착한 기판을 제조하고 이를 비정질 실리콘 태양전지에 적용하였다. 실험결과, 그림과 같이 높이와 너비가 300nm 정도로 일정한 패턴의 Ag 나노로드를 제조하였다. 또한, 그 위에 증착된 Si 박막의 경우, 나노로드 전체를 감싸는 돔 형태로 성장하였다. 이와 같은 나노로드 위에 substrate n-i-p 구조의 비정질 박막 태양전지를 증착하고 그 특성변화를 분석하고자 하였다.

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A Facile Synthetic Method of Silver Nanoparticles with a Continuous Size Range from sub-10 nm to 40 nm

  • Piao, Longhai;Lee, Kyung-Hoon;Min, Byoung-Koun;Kim, Woong;Do, Young-Rag;Yoon, Sung-Ho
    • Bulletin of the Korean Chemical Society
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    • 제32권1호
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    • pp.117-121
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    • 2011
  • Size-controlled Ag nanoparticles (NPs) were prepared from the decomposition of Ag(I) carboxylates using ethanolamine derivatives as a reducing agent without an additional stabilizing agent. The size of the Ag NPs with a narrow size distribution (sub-10 nm to ca. 40 nm) was controlled precisely by varying the processing parameters, such as the type of reducing agent and the chain length of the carboxylate in the Ag(I) carboxylate. The optical properties, surface composition and crystallinity of the Ag NPs were characterized by ultraviolet-visible spectroscopy, gas chromatography-mass spectrometry, thermal gravimetric analysis, transmission electron microscopy and X-ray diffraction.

Ag 인쇄배선과 이종재료기판과의 접합계면 (Interfacial Microstructures between Ag Wiring Layers and Various Substrates)

  • 김근수;;허석환
    • Journal of Welding and Joining
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    • 제29권5호
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    • pp.90-94
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    • 2011
  • Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.

금속 나노입자 함량에 따른 유기나노복합체의 광학 및 전기전도성 특성변화 (Effect of Silver Nano-particle Concentration on the Optical and Electrical Characteristics of Organic-based Nano-composite Electrodes)

  • 김영훈;박성규;한정인
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2008년도 Techno-Fair 및 추계학술대회 논문집 전기물성,응용부문
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    • pp.125-126
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    • 2008
  • 본 연구에서는 금속 나노입자 함량에 따른 유기나노복합체에서의 광학 및 전기전도도 특성변화를 분석하였다. 유기나노복합체 전극은 전기전도성을 가리고 있는 PEDOT : PSS(poly(3,4-ethylenedioxythio- phone):poly(styrenesulfonate))나노 입자를 기반으로 하며 이 복합제에 미량의 Ag nano-particle을 첨가하여 전기전도도 특성을 향상시키는 연구를 진행하였다. Ag nano-particle은 전체 중량 대비 01 - 0.4%의 범위에서 첨가하였으며 실험결과 0.1%의 첨가 비율에서 약 5% 정도의 전기전도도 특성 향상이 확인되었다. 또한 광투과도 변화를 분석해본 결과 0.4%까지의 Ag nano-particle 첨가 비율에서는 광투과도의 비율이 크게 감소되지 않는 것으로 파악되었다.

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Nano-sized Effect on the Magnetic Properties of Ag Clusters

  • Jo, Y.;Jung, M.H.;Kyum, M.C.;Park, K.H.;Kim, Y.N.
    • Journal of Magnetics
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    • 제11권4호
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    • pp.160-163
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    • 2006
  • We have prepared crystalline Ag nanoparticles with an average size of 4 nm in diameter by using an inductively coupled plasma reactor equipped with the liquid nitrogen cooling system. Our magnetic data show that the nano-sized effect of Ag nanoparticles on the magnetic properties is ferromagnetic, instead of a diamagnetic component of the Ag bulk and a superparamagnetic component of magnetic nanoparticles. We have also studied the magnetic properties of Ag-Cu nanocomposites with an opposite concentration profile between surface and core. These comparisons indicate that the ferromagnetic component strongly depends on the surface of Ag nanoparticles, while the paramagnetic component is strongly affected by the outer oxide layer, with the background of a diamagnetic component from the core of Ag.

Ag thickness effect on electrical and optical properties of flexible IZTO/Ag/IZTO multilayer anode grown on PET

  • 남호준;조성우;김한기
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 추계학술대회 논문집
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    • pp.379-379
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    • 2007
  • The characteristics of indium-zinc-tin-oxide (IZTO)-Ag-IZTO multilayer grown on a PET substrate were investigated for flexible organic light-emitting diodes. The IZTO-Ag-IZTO (IAI) multilayer anode exhibited a remarkably reduced sheet resistance of 4 ohm/sq and a high transmittance of 84%, despite the very thin thickness of the IZTO (30 nm) layer. In addition, it was shown that electrical and optical properties of IAI anodes are critically dependent on the thickness of the Ag layer, due to the transition of Ag atoms from distinct islands to continuous films at a critical thickness (14 nm). Moreover, the IAI/PET sample showed more stable mechanical properties than an amorphous ITO/PET sample during the bending test due to the existence of a ductile Ag layer. The current density voltage-luminance characteristics of flexible OLEDs fabricated on an IAI/PET substrate was better than those of flexible OLEDs fabricated on an ITO/PET substrate. This indicates that IAI multilayer anodes are promising flexible and transparent electrodes for flexible OLEDs.

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태양광 리본용 Sn-Pb-Ag 솔더의 특성에 미치는 Ag의 영향 (Effects of Ag on the Characteristics of Sn-Pb-Ag Solder for Photovoltaic Ribbon)

  • 손연수;조태식
    • 한국전기전자재료학회논문지
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    • 제28권5호
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    • pp.332-337
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    • 2015
  • We have studied the effects of Ag on the characteristics of $Sn_{60}Pb_{40}Ag_x$ (wt%) solder for photovoltaic ribbon. Ag atoms in the solder formed an alloy phase of $Ag_3Sn$ after reacting with some part of Sn atoms, while they did not react with Pb atoms, but decreased the mean size of Pb solid phase. The enhancement of peel strength between solar cell and ribbon is an important part in the developments of long-lifespan solar module. The peel strength of the solder ribbon of $Sn_{60}Pb_{40}$ (wt%) was $169N/mm^2$, and it was largely enhanced by adding a small amount of Ag atoms. The maximum peel strength was $295N/mm^2$ in the solder ribbon of $Sn_{60}Pb_{40}Ag_2$ (wt%). This result is caused by the high binding energy of 162.9 kJ/mol between Ag atoms in the solder and Ag atoms in Ag sheet.

등통로각압축공정을 이용하여 제조된 Cu-15 wt%Ag 복합재의 미세구조 (Microstructural Evolution of Cu-15 wt%Ag Composites Processed by Equal Channel Angular Pressing)

  • 이인호;홍순익;이갑호
    • 대한금속재료학회지
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    • 제50권12호
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    • pp.931-937
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    • 2012
  • The microstructure of Cu-15 wt%Ag composites fabricated by equal channel angular pressing (ECAP) with intermediate heat treatment at $320^{\circ}C$ was investigated by transmission electron microscopy (TEM) observations. Ag precipitates with a thickness of 20-40 nm were observed in the eutectic region of the Cu-15 wt%Ag composite solution treated at $700^{\circ}C$ before ECAP. The Cu matrix and Ag precipitates had a cube on cube orientation relationship. ECAPed composites exhibited ultrafine-grained microstructures with the shape and distribution dependent on the processing routes. For route A in which the sample was pressed without rotation between each pass, the Cu and Ag grains were elongated along the shear direction and many micro-twins were observed in elongated Cu grains as well as in Ag filaments. The steps were observed on coherent twin boundaries in Cu grains. For route Bc in which the sample was rotated by 90 degrees after each pass, a subgrain structure with misorientation of 2-4 degree by fragmentation of the large Cu grains were observed. For route C in which the sample was rotated by 180 degrees after each pass, the microstructure was similar to that of the route A sample. However, the thickness of the elongated grains along the shear direction was wider than that of the route A sample and the twin density was lower than the route A sample. It was found that more microtwins were formed in ECAPed Cu-15 wt%Ag than in the drawn sample. Grain boundaries were observed in relatively thick and long Ag filaments in Cu-15 wt%Ag ECAPed by route C, indicating the multi-crystalline nature of Ag filaments.