• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• v.9 no.2
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• pp.881-883
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• 2005

In case is below length 100nm of gate, various kinds problem can be happened with by threshold voltage change of device, occurrence of leakage current by tunneling because thickness of oxide by 1.5nm low scaling is done and doping concentration is increased. SiO$_2$ dielectric substance can not be used for gate insulator because is expected that tunneling current become 1A/cm$^2$ in 1.5nm thickness low. In this paper, devised double gate MOSFET(DGMOSFET) to decrease effect of leakage current by this tunneling. Therefore, could decrease effect of these leakage current in thickness 1nm low of SiO$_2$ dielectric substance. But, very big gate insulator of permittivity should be developed for develop device of nano scale.

• Journal of the Korean Magnetics Society
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• v.15 no.2
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• pp.133-136
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• 2005

In the case of contacts between semiconductor and metal in semiconductor devices, they tend to be unstable because of thermal budget. To prevent these problems we deposited W-C-N diffusion barrier for preventing the interdiffusion between metal and semiconductor. The thickness of the barrier is $1,000{\AA}$ and the pressure is 3 mTorr during the deposition. In this work we coated LSMO (CMR material) on W-C-N diffusion barrier and then we studied the interface effects between LSMO layer and W-C-N diffusion barrier. We got results that the magnetic characteristics of LSMO thin film are still maintained after annealing at $800^{\circ}C$ for 3 hr because W-C-N thin diffusion barrier was prevented the diffusion of oxygen between LSMO and Si substrate.

• Journal of Advanced Marine Engineering and Technology
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• v.37 no.2
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• pp.144-148
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• 2013

In this paper, the ultra water-repellent thin films were prepared by RF PECVD. On the basis of surface morphology, chemical bonding states and plasma diagnostics, a formation model of clusters for the ultra water-repellent films was discussed from considerations of formation process and laser scattering results. Moreover, using laser scattering method, the relative change of quantity of nano-clusters or size of agglomerates could be confirmed. From the results, the films were deposited with nano-clusters and those of agglomerates, which formed in organosilicon plasma, and formation of agglomerates were depended on the deposition time.

• Advances in nano research
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• v.13 no.1
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• pp.97-111
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• 2022

In the present article, silica nanoparticles (SNPs) were exploited to improve the tribological and mechanical properties of vinyl ester/glass fiber composites. To the best of our knowledge, there hasn't been any prior study on the wear properties of glass fiber reinforced vinyl ester SiO₂ nanocomposites. The wear resistance is a critical concern in many industries which needs to be managed effectively to reduce high costs. To examine the influence of SNPs on the mechanical properties, seven different weight percentages of vinyl ester/nano-silica composites were initially fabricated. Afterward, based on the tensile testing results of the silica nanocomposites, four wt% of SNPs were selected to fabricate a ternary composite composed of vinyl ester/glass fiber/nano-silica using vacuum-assisted resin transfer molding. At the next stage, the tensile, three-point flexural, Charpy impact, and pin-on-disk wear tests were performed on the ternary composites. The fractured surfaces were analyzed by scanning electron microscopy (SEM) images after conducting previous tests. The most important and interesting result of this study was the development of a nanocomposite that exhibited a 52.2% decrease in the mean coefficient of friction (COF) by augmenting the SNPs, which is beneficial for the fabrication/repair of composite/steel energy pipelines as well as hydraulic and pneumatic pipe systems conveying abrasive materials. Moreover, the weight loss due to wearing the ternary composite containing one wt% of SNPs was significantly reduced by 70%. Such enhanced property of the fabricated nanocomposite may also be an important design factor for marine structures, bridges, and transportation of wind turbine blades.

• Transactions on Electrical and Electronic Materials
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• v.4 no.3
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• pp.15-18
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• 2003

Aluminum oxide ($Al_2O_3$) materials were coated conformally on ZnO nanorods by atomic layer deposition (ALD). The ZnO nanorods were first synthesized on a Si(100) substrate from ball-milled ZnO powders by a thermal evaporation procedure. $Al_2O_3$ films were then deposited on these ZnO nanorods by ALD at a substrate temperature of $300^{\circ}C$ using trimethylaluminum (TMA) and distilled water ($H_2O$). Transmission electron microscopy (TEM) and high-resolution transmission electron microscopy (HRTEM) images of the deposited ZnO nanorods revealed that amorphous $Al_2O_3$ cylindrical shells surround the ZnO nanorods. These TEM images illustrate that ALD has an excellent capability to coat any shape of nanorods conformally.

• Korean Journal of Materials Research
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• v.19 no.6
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• pp.325-329
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• 2009

Titanium dioxide thin films were fabricated as hydrogen sensors and its sensing properties were tested. The titanium was deposited on a $SiO_2$/Si substrate by the DC magnetron sputtering method and was oxidized at an optimized temperature of $850^{\circ}C$ in air. The titanium film originally had smooth surface morphology, but the film agglomerated to nano-size grains when the temperature reached oxidation temperature where it formed titanium oxide with a rutile structure. The oxide thin film formed by grains of tens of nanometers size also showed many short cracks and voids between the grains. The response to 1% hydrogen gas was ${\sim}2{\times}10^6$ at the optimum sensing temperature of $200^{\circ}C$, and ${\sim}10^3$ at room temperature. This extremely high sensitivity of the thin film to hydrogen was due partly to the porous structure of the nano-sized sensing particles. Other sensor properties were also examined.

• Journal of the Korean Magnetics Society
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• v.14 no.5
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• pp.163-168
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• 2004

We prepared ultra thin film structure of Si(100)/ $SiO_2$(200 nm)/Ta(5 nm)/Ni$_{80}$Fe$_{20/(l～15 nm)}$Ta(5 nm) using an inductively coupled plasma(ICP) helicon sputter. Magnetic properties and cross-sectional microstructures were investigated with a superconduction quantum interference device(SQUID) and a transmission electron microscope(TEM), respectively. We report that NiFe films of sub-3 nm thickness show the B$_{bulk}$ = 0 and B$_{surf}$=-3 ${\times}$ 10$^{-7}$(J/$m^2$). Moreover, Curie temperature may be lowered by decreasing thickness. Coercivity become larger as temperature decreased with 0.5 nm - thick Ta/NiFe interface intermixing. Our result implies that effective magnetic properties of magnetoelastic anisotropy, saturation magnetization, and coercivity may change abruptly in nano-thick films. Thus we should consider those abrupt changes in designing nano-devices such as MRAM applications.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.219-219
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• 2010

기존의 플로팅 타입의 메모리는 소자의 소형화에 따른 인접 셀 간의 커플링 현상과 전계에 따른 누설전류의 증가 등과 같은 문제가 발생한다. 이에 대한 해결책으로서 전하 저장 층을 폴리실리콘에서 유전체를 사용하는 SONOS 형태의 메모리와 NFGM (Nano-Floating Gate Memory)연구가 되고 있다. 그러나 높은 구동 전압, 느린 쓰기/지우기 속도 그리고 10년의 전하보존에 대한 리텐션 특성을 만족을 시키지 못하는 문제가 있다. 이러한 문제를 해결 하고자 터널베리어를 엔지니어링 하는 TBM (Tunnel Barrier Engineering Memory) 기술에 대한 연구가 활발히 진행 중이다. TBM 기술은 터널 층을 매우 얇은 다층의 유전체를 사용하여 전계에 따른 터널베리어의 민감도를 증가시킴으로써 빠른 쓰기/지우기 동작이 가능하며, 10년의 전하 보존 특성을 만족 시킬 수 있는 차세대 비휘발성 메모리 기술이다. 또한 고유전율 물질을 터널층으로 이용하면 메모리 특성을 향상 시킬 수가 있다. 일반적으로 TBM 기술에는 VARIOT 구조와 CRESTED 구조로 나눠지는데 본 연구에서는 두 구조의 장점을 가지는 Staggered tunnel barrier 구조를 $Si_3N_4$와 HfAlO을 이용하여 디자인 하였다. 이때 HfO2와 Al2O3의 조성비는 3:1의 조성을 갖는다. $Si_3N_4$와 HfAlO을 각각 3 nm로 적층하여 리세스(Recess) 구조의 트랜지스터를 제작하여 차세대 비휘발성 메모리로써의 가능성을 알아보았다.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.2152-2153
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• 2011

According to a sharp increase in demand for electricity supply secure, and $CO_2$ regulation in accordance with global environmental problems and to solve problems, etc. These factor less pollution, higher energy conversion hyoyulin way that the new electrical equipment, nano-composites The rapid degeneration of the unit study utilizing the power that is required is Free. Accordingly, cables, transformers and switchgear (GIS)-capacity of power equipment, such as, high-voltage high-density along with the miniaturization of equipment have made angry the reliability of these devices is becoming a very important issue. Insulation materials used in electrical equipment for high voltage withstand, power equipment, power equipment due to aging and overloading caused by a weakening of the insulation failure and replacement in accordance with the age due to increased costs because of the reliability of electrical equipment should be secured should. Therefore, improved performance and longevity of insulation material is recognized as an important challenge. In this study, power isolation and degeneration of the unit for use in various parts of the molding epoxy resin to improve the insulation performance of the epoxy resin by varying the added amount of nano-SiO2 nanocomposites made epoxy/SiO2 analysis and breakdown properties of the experiment want to improve the electrical properties through the geometry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.62-62
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• 2008

As micro-system move toward higher speed and miniaturization, requirements for embedding the passive components into printed circuit boards (PCBs) grow consistently. They should be fabricated in smaller size with maintaining and even improving the overall performance. Miniaturization potential steps from the replacement of surface-mount components and the subsequent reduction of the required wiring-board real estate. Among the embedded passive components, capacitors are most widely studied because they are the major components in terms of size and number. Embedding of passive components such as capacitors into polymer-based PCB is becoming an important strategy for electronics miniaturization, device reliability, and manufacturing cost reduction Now days, the dielectric films deposited directly on the polymer substrate are also studied widely. The processing temperature below $200^{\circ}C$ is required for polymer substrates. For a low temperature deposition, bismuth-based pyrochlore materials are known as promising candidate for capacitor $B_2Mg_{2/3}Nb_{4/3}O_7$ ($B_2MN$) multi layers were deposited on Pt/$TiO_2/SiO_2$/Si substrates by radio frequency magnetron sputtering system at room temperature. The physical and structural properties of them are investigated by SEM, AFM, TEM, XPS. The dielectric properties of MIM structured capacitors were evaluated by impedance analyzer (Agilent HP4194A). The leakage current characteristics of MIM structured capacitor were measured by semiconductor parameter analysis (Agilent HP4145B). 200 nm-thick $B_2MN$ muti layer were deposited at room temperature had capacitance density about $1{\mu}F/cm^2$ at 100kHz, dissipation factor of < 1% and dielectric constant of > 100 at 100kHz.