• Journal of Sensor Science and Technology
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• v.14 no.5
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• pp.357-361
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• 2005

Low-stress silicon nitride (LSN) thin films with embedded metal line have been developed as free standing structures to keep microspheres in proper locations and localized heat source for application to a chip-based sensor array for the simultaneous and near-real-time detection of multiple analytes in solution. The LSN film has been utilized as a structural material as well as a hard mask layer for wet anisotropic etching of silicon. The LSN was deposited by LPCVD (Low Pressure Chemical Vapor Deposition) process by varing the ratio of source gas flows. The residual stress of the LSN film was measured by laser curvature method. The residual stress of the LSN film is 6 times lower than that of the stoichiometric silicon nitride film. The test results showed that not only the LSN film but also the stack of LSN layers with embedded metal line could stand without notable deflection.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.976-979
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• 2002

A focusing grating coupler (FGC) was not fabricated by the 'Continuous Path Control' writing strategy but by an electron-beam lithography system of more general exposure mode, which matches not only the address grid with the grating period but also an integer multiple of the address grid resolution (5 nm), To more simplify the fabrication, we are able to reduce a process step without large decrease of pattern quality by excluding a conducting material or layer such as metal (Al, Cr, Au), which are deposited on top or bottom of an e-beam resist to prevent charge build-up during e-beam exposure. A grating pitch period and an aperture feature size of the FGC designed and fabricated by e-beam lithography and reactive ion etching were ranged over 384.3 nm to 448.2 nm, and $0.5{\times}0.5mm^2$ area, respectively, This fabrication method presented will reduce processing time and improve the grating quality by means of a consideration of the address grid resolpution, grating direction, pitch size and shapes when exposing. Here our investigations concentrate on the design and efficient fabrication results of the FGC for coupling from slab waveguide to a spot in free space.

• The Journal of Korean Academy of Prosthodontics
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• v.44 no.4
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• pp.383-393
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• 2006

Statement of problem : Limited research on flowable resin has been undertaken on its application directly on dentin associated with the adhesive systems. Purpose : This study was to evaluate the shear bond strengh and fracture aspect of flowable resin on human dentin with various types of dentin bonding adhesives with thermo cycling effect. Materials and methods: Filtek-Flow(3M ESPE, USA) was used as flowable resin and Eighty human molars were randomly divided into 4 groups : three dentin bonding adhesives (Scotchbond-Multipurpose : 3-step contentional system, One-Step : One-bottle system. Prompt L-Pop : All-in-one, self-etching primer) and 32% etching treatment without bonding adhesive as a control group. For evaluating their durability of bonding, each group was subdivided : storaging in the water at 37$^{\circ}C$(24 hours) and thermocycling (0$^{\circ}C$-55$^{\circ}C$, 30 seconds intervals, 1000 cycle). Shear bond strength tests were performed and resin-dentin interface and fracture mode were observed. Results were analysed by one-way ANOVA and Scheffe's multiple range test. Results and Conclusion : 1. At 0 cycle, the mean shear bond strength of One-Step exhibited the highest value of all groups(p<0.05), and there were no significant differences between Prompt L-Pop and Scotchbond-Multipurpose, Scotchbond-Multipurpose and control(p>0.05). After 1000 thermocycling, One-Step exhibited higher value than other groups(p<0.05), and there were no significant differences among other groups (p>0.05). 2. The shear bond strength of each group was significantly decreased after thermocycling except Scotchbond-Multipurpose (p>0.05). 3. The most common failure mode was adhesive type and mixed type, next in order.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.3 no.3
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• pp.661-669
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• 1999

A probe card is one of the most important pan of test systems as testing IC(integrated circuit) chips. This work was related to bump-type silicon vertical probe card which enabled simultaneous tests for multiple semiconductor chips. The probe consists of silicon cantilever with bump tip. In order to obtain optimum size of the cantilever, the dimensions were determined by FEM(finite element method) analysis. The probe was fabricated by RIE(reactive ion etching), isotropic etching, and bulk-micromachining using SDB(silicon direct bonding) wafer. The optimum height of the bump of the probe detemimed by FEM simulation was 30um. The optimum thickness, width, and length of the cantilever were 20 $\mum$, 100 $\mum$,and 400 $\mum$,respectively. Contact resistance of the fabricated probe card measured at contact resistance testing was less than $2\Omega$. It was also confirmed that its life time was more than 20,000 contacts because there was no change of contact resistance after 20,000 contacts.

• Transactions on Electrical and Electronic Materials
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• v.3 no.1
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• pp.30-37
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• 2002

A focusing grating coupler (FGC) was not fabricated by the 'Continuous Path Control'writing strategy but by an electron-beam lithography system of more general exposure mode, which matches not only the address grid with the grating period but also an integer multiple of the address grid resolution (5 nm). To more simplify the fabrication, we are able to reduce a process step without large decrease of pattern quality by excluding a conducting material or layer such as metal (Al, Cr, Au), which are deposited on top or bottom of an e-beam resist to prevent charge build-up during e-beam exposure. A grating pitch period and an aperture feature size of the FGC designed and fabricated by e-beam lithography and reactive ion etching were ranged over 384.3 nm to 448.2 nm, and 0.5 $\times$ 0.5 mm$^2$area, respectively. This fabrication method presented will reduce processing time and improve the grating quality by means of a consideration of the address grid resolution, grating direction, pitch size and shapes when exposing. Here our investigations concentrate on the design and efficient fabrication results of the FGC for coupling from slab waveguide to a spot in free space.

• Journal of IKEEE
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• v.23 no.3
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• pp.1077-1081
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• 2019

Lights that enter the surface of a solar cell cannot be absorbed inside all of the solar cells, and some of it is reflected off the surface of the substrate, resulting in loss. Because of this, many studies are underway to reduce reflective losses on the surface of substrates or to steam the generated charge inside the solar cell. In this paper, surface treatment for forming a rough surface by wet etching the surface of a glass substrate is advanced, and structural characteristics of the rough surface are analyzed. Then, spectral characteristics by changing the angle of the glass substrate to which light enters the company are analyzed. When the light entering the company is investigated on a etched surface, it is confirmed that the probability of re-absorbing the light inside the glass substrate by multiple reflection is increased. When entering the light while changing the angle of the glass substrate, the transmission and reflection performance of the light are not changed.

• Journal of Internet Computing and Services
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• v.6 no.1
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• pp.105-114
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• 2005

This paper describes a new measuring technique by analysing multiple time-series patterns. This paper's goal is that extracts a really measured value having a sample pattern which is the best matched with an inputted time-series, and calculates a difference ratio with the value. Therefore, the proposed technique is not a recognition but a measurement. and not a hardware but a software. The proposed technique is consisted of three stages, initialization, learning and measurement. In the initialization stage, it decides weights of all parameters using importance given by an operator. In the learning stage, it classifies sample patterns using LBG and DTW algorithm, and then creates code sequences for all the patterns. In the measurement stage, it creates a code sequence for an inputted time-series pattern, finds samples having the same code sequence by hashing, and then selects the best matched sample. Finally it outputs the really measured value with the sample and the difference ratio. For the purpose of performance evaluation, we tested on multiple time-series patterns obtained from etching machine which is a semiconductor manufacturing.

• IE interfaces
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• v.22 no.2
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• pp.126-134
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• 2009

As product quality and yield are essential factors in semiconductor manufacturing, monitoring the main manufacturing steps is a critical task. For the purpose, FDC(Fault detection and classification) is used for diagnosing fault states in the processes by monitoring data stream collected by equipment sensors. This paper proposes an FDC model based on decision tree which provides if-then classification rules for causal analysis of the processing results. Unlike previous decision tree approaches, we reflect the structural aspect of the data stream to FDC. For this, we segment the data stream into multiple subregions, define structural features for each subregion, and select the features which have high relevance to results of the process and low redundancy to other features. As the result, we can construct simple, but highly accurate FDC model. Experiments using the data stream collected from etching process show that the proposed method is able to classify normal/abnormal states with high accuracy.

• The Journal of Korean Academy of Prosthodontics
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• v.52 no.1
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• pp.1-8
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• 2014

Purpose: The purpose of this study is to evaluate the effect of applying Silano-pen to feldspathic porcelain and zirconia on shear bond strength with composite resin. Materials and methods: Feldspathic porcelain and zirconia specimens were produced into 30 per each 2 mm thick and 12 mm in diameter and their surface was made smooth and even and then embedded in acrylic resin. The specimens were divided into each Group F (Feldspathic porcelain) and Group Z (Zirconia), (1) Hydrofluoric acid etching and silane (F1 & Z1), (2) Silano-pen and silane (F2 & Z2), (3) Hydrofluoric acid etching and Silano-pen, silane (F3 & Z3). After surface conditioning, substrate surfaces of the specimen were examined by SEM. Composite resin cylinders (2 mm high, 3 mm in diameter)were bonded to specimen and shear bond strength between ceramic and composite resin was measured by using universal testing machine. The measured values were statistically analyzed by using two way ANOVA and Tukey's multiple comparison test (${\alpha}=.05$). Results: In the scanning electron micrograph of the treated ceramic surface, Group F2 and F3 appeared the high roughness and Group Z3 appeared the highest density of silica particle. In Feldspathic porcelain, the result of measuring shear bond strength showed that Group F3 was measured to be highest and Group F1 was measured to be lowest but there was no statistical significance among Groups. In zirconia, Group Z3 was measured to be highest and Group Z1 was measured to be lowest and there was statistical significance among Groups (P<.05). Conclusion: In zirconia, applying hydrofluoric acid etching and then Silano-pen and silane is effective for composite resin adhesion.

• Journal of Oral Medicine and Pain
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• v.31 no.3
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• pp.211-221
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• 2006

Purpose The aims of this study were to evaluate micro-tensile bond strength of composite resin bonded to dentin following high-speed rotary handpiece preparation or Er:YAG laser preparation with two different adhesive systems and to assess the influence of different Er:YAG laser energies on the micro-tensile bond strength. Materials and Methods In this study, 40 third morlars were used. Flat dentin specimans were obtained and randomly assigned to eight groups. Dentin surfaces were prepared with one of four cutting types: carbide bur, Er:YAG laser (2 W, 3 W and 4 W) and conditioned with two bonding systems, Scotchbond Multipurpose Plus (SM), Clearfil SE bond (SE) and composite resin-build ups were created. After storage for 24 hours, each specimen was serially sectioned perpendicular to the bonded surface to produce more than thirty slabs in each group. Micro-tensile bond strength test was performed at a crosshead speed of 1.0 mm/min. Micro-tensile bond strengths (${\mu}TBS$) were expressed as means$\pm$SD. Data were submitted to statistical analysis using two-way ANOVA, one-way ANOVA, Student-Newman-Keuls' multiple comparison test and t-test. Results and Conclusion 1. Regardless of bonding systems, the ${\mu}TBS$ according to cutting types were from highest to lowest : 3 W, 2 W, Bur, and 4 W. In addition, there was no significant difference between Bur and 4 W (p<0.001). 2. Regardless of cutting types, SM showed significantly higher ${\mu}TBS$ than SE (p<0.001). 3. Bonding to dentin conditioned with SM resulted in higher ${\mu}TBS$ for 3 W compared to Bur, 2 W, and 4 W. There was no significant difference between 2 W and Bur (p<0.001). 4. Bonding to dentin conditioned with SE resulted in higher ${\mu}TBS$ for 3 W compared to 2 W, 4 W, and Bur. Bur exhibited significant lower ${\mu}TBS$ than all other cutting types. There were no significant differences between 3 W, 2 W and between 4 W and Bur (p<0.001). 5. The ${\mu}TBS$ of laser cutting groups were shown in order from highest to lowest: 3 W, 2 W and 4 W in two bonding systems. There was no significant difference between 2 W and 3 W in SE (p<0.001). : The ${\mu}TBS$ of composite resin bonded dentin was significantly affected by interaction between the cutting type and bonding system. In the range of 2 W-3 W, cavity preparation of the Er:YAG laser seems to supply good adhesion of composite resin restoration no less than bur preparation. In particular, if you want to use the self-etching system, including Clearfil SE bond for the purpose of a simplification of the bonding procedures and prevention of adverse effects by excessive etching, an Er:YAG laser may offer better adhesion than a bur.