• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2000.06a
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• pp.670-678
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• 2000

Loose parts monitoring system(LPMS) is one of the important monitoring systems for the safe and efficient operation of the nuclear reactor, since it is LPMS that can early detect loose parts which may cause a significant damage in facilities or components of the plant. Nuclear power plants in Korea have recently experienced several loose part alarms due to the metallic impact and it is expected that the frequency of the loose part will be increased along the aging of the plants. In this paper, the status of loose parts monitoring technologies and facilities in Korean nuclear power plants is presented for the establishment of LPMS installation plan in some nuclear reactors which are not yet equipped with LPMS. Sensor specification, location and mounting method for loose parts monitoring were reviewed. As a result, the location and the mounting method of the properly chosen sensor was recommended. Data acquisition algorithms and discriminating rules of loose part impact signals were also reviewed. Actual alarm cases occurred by true impact signal and false impact signal were stated here.

• Journal of Welding and Joining
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• v.27 no.1
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• pp.85-89
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• 2009

Reflow process conditions were investigated for 0402 electric parts with Sn-3.0Ag-0.5Cu solders. Circle hole shape metal mask with 100 m thickness showed excellent printability. Self alignment abilities were 71% for 1005 chips, 52% for 0603 chips, and 3% for 0402 chips. Average joining strengos were 1990 gf for 1005 chips, 867 gf for 0603 chips, and 525 gf for 0402 chips. As mis-mounting angle increased, joining strength decreased. Considering self-alignment ability, mounting angle had to be under $5^{\circ}$ and contact area of the chips had to be over 40% for Pb-free soldering process for 0402 chips.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.3
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• pp.89-99
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• 1995

In this paper, we ecamined the effect that MCM-L technique influencess on the design and fabrication of multichip memory modules in increasing the packing desity of memory capacity and maximizing its electrical characteristics. For that purpose, we examined the effective methods of reducing the area of module layout and the wiring length with the variation of chip allocation and the number of wiring layers. We fabricated a 256K${\times}$8bit SRAM module with eight 32K${\times}$8bit SRAM chips. The routing experiment showed that we could optimize the area of module layout and wiring length by placing chips in a row, arranging module I/O pads parallel to chip I/O pads, and equalizing the number of terminal sides of module I/O's to that of chip I/O's. The routing was optimized when we used three wire layers in case of one sided chip mounting or five wire layers in case of double sided chip mounting. The fabricated modules showed 18.9 cm/cm$^{2}$ in wiring density, 65 % in substrate occupancy efficiency, and module substrate and functionally tested to find out the module working perfectly.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.14 no.6
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• pp.579-589
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• 1989

In this paper, planar power dividers/combiners for millimeter waves K-band or bands which can be printed on the substrates of hybrid or monolithic IC by surface mounting are designed and studied. Power dividers/combiners, and the conductor loss of microstrip lines in particualr the existing Wilkinson power dividers/combiners is modified ad amployes by ist equivalent circuit. Microwave CAD program SUPEROMPACT is employed for the Wilkinson power combiner which is modified and analyzed to reduce the high frequency coupling between the branches of the combiner, and the method to diminish the sensitivity of the input reflection of $2^n$-way power dividers/combiners is studied employing the commerical microwave CAD program package SUPERCOMPACT.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.33 no.4
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• pp.17-26
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• 2005

Numerical investigation has been made on the aerodynamic characteristics of supersonic air-launching rocket, as a new concept launching mechanism. Parametric study on the variations of launching velocity, incident angle and mounting location of the rocket has been performed using three dimensional Euler equations. Influential factors at separating stage of the rocket were extracted through comprehensive analyses, and, the response surface models were constructed for those factors. From the study, the aerodynamic behavior of the air-launching rocket at supersonic speed and useful guidelines for the optimal mounting location of the rocket have been obtained.

• Journal of Welding and Joining
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• v.17 no.3
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• pp.90-95
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• 1999

The increase in high speed, multi-function and high I/O pin semiconductor devices highly demands high pin count, very thin, and high density packages. BGA is one of the solutions, but the package has demerits in package reliability, surface mounting problems due to the PCB warpage and solder joint crack related with TCE mismatch between the materials. On this study to verify the thermal fatigue lifetime of the solder joint FEM and experiments were performed after surface mounting BGA with different solder composition and reliability conditions. FEM showed optimum composition of Ag3.2-Sn96.5 and under the composition minimum creep deformation of the solder joint was calculated, and the thermal fatigue lifetime was improved. In view of temperature cycle condition, the conditions of $-65^{\circ}C$to $150^{\circ}C$ showed minimum lifetime and t was 1/3 of $0^{\circ}C$ to $125^{\circ}C$ condition. Test board was prepared and solder joint crack was verified. Until 1000cycle on soder joint crack was observed.

• The Journal of the Acoustical Society of Korea
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• v.6 no.1
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• pp.48-57
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• 1987

It is well known that the major noise source of Refrigerator is compressor, and due to the tendency of higher quality and more lighting of manufactured goods, the importance of prevention and reduction of a noise is increasing. In this paper, in order to prevent and reduce such a noise, sound pressure level and acoustic intensity are measured for compressor, and the result of these measurements, the noise radiation characteristics of compressor are reconized. And the experimental modal analysis is applied to the compressor to identify the noise sourcce. As the results of this study, we come to know that the spring, which is used to reduce vibration, does not reduce vibration efficiently, and compressor shell and its mounting system effect the noise radiation.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.6
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• pp.543-547
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• 2008

In the paper, we develop the ultrasonic bonding technique for LCD driver chips having small size and high pin-density. In general, the mounting technology for LCD driver ICs is a thermo-compression method utilizing the ACF (An-isotropic Conductive Film). The major drawback of the conventional approach is the long process time. It will be shown that the conventional ACF method based on thermo-compression can be remarkably enhanced by employing the ultrasonic bonding technique in terms of bonding time. The proposed approach is to apply the ultrasonic energy together with the thermo-compression methodology for the ACF bonding process. To this end, we design a bonding head that enables pre-heating, pressure and ultrasonic excitation. Through the bonding experiments mainly with LCD driver ICs, we present the procedures to select the best combination of process parameters with analysis. We investigate the effects of bonding pressure, bonding time, pre-heating temperature before bonding, and the power level of ultrasonic energy. The addition of ultrasonic excitation to the thermo-compression method reduces the pre-heating temperature and the bonding process time while keeping the quality bonding between the LCD pad and the driver IC. The proposed concept will be verified and demonstrated with experimental results.

• Journal of Institute of Control, Robotics and Systems
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• v.4 no.3
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• pp.384-391
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• 1998

When a device is mounted on the PCB, it is impossible to have zero defects due to many unpredictable problems. Among these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). It is obvious that given the complexity of the inspection task, the efficiency of a human inspection is questionable. Thus, new technologies for inspection of SMD(Surface Mounting Device) should be explored. An example of such technologies is the Automated Visual Inspection(AVI), wherein the vision system plays a key role to correct this problem. In implementing vision system, high-speed and high-precision are indispensable for practical purposes. In this paper, a new algorithm based on the Radon transform which uses a projection technique to inspect the FIC(Flat Integrated Circuit) device is proposed. The proposed algorithm is compared with other algorithms by measuring the position error(center and angle) and the processing time for the device image, characterized by line scan camera.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.22 no.6
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• pp.495-501
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• 2012

In this study, the natural frequencies and mode shape of an external mounting pod were verified using the modal analysis and modal testing technique for a pod mounted on an aircraft. The procedure associated with the FE model building of an external mounted pod to predict the dynamic behavior of aircraft structures is described. The simplified FE model reflecting the results of the modal testing of a pod is built through the optimization and will be applied to the structural dynamic model of an aircraft which is used to verified the stability of vibration and flutter of an aircraft.