The Design and Fabrication of SRAM Modules Surface Mounted on Multilayer Borads

다층 기판 위에 표면실장된 SRAM 모듈 설계 제작

In this paper, we ecamined the effect that MCM-L technique influencess on the design and fabrication of multichip memory modules in increasing the packing desity of memory capacity and maximizing its electrical characteristics. For that purpose, we examined the effective methods of reducing the area of module layout and the wiring length with the variation of chip allocation and the number of wiring layers. We fabricated a 256K${\times}$8bit SRAM module with eight 32K${\times}$8bit SRAM chips. The routing experiment showed that we could optimize the area of module layout and wiring length by placing chips in a row, arranging module I/O pads parallel to chip I/O pads, and equalizing the number of terminal sides of module I/O's to that of chip I/O's. The routing was optimized when we used three wire layers in case of one sided chip mounting or five wire layers in case of double sided chip mounting. The fabricated modules showed 18.9 cm/cm$^{2}$ in wiring density, 65 % in substrate occupancy efficiency, and module substrate and functionally tested to find out the module working perfectly.