• Journal of the Semiconductor & Display Technology
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• v.17 no.4
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• pp.42-45
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• 2018

As The semiconductor decrease from 10 nanometer to 7 nanometer, It is suggested that "More than Moore" is needed to follow Moore's Law, which has been a guide for the semiconductor industry. Fan-Out Wafer Level Package(FOWLP) is considered as the key to "More than Moore" to lead the next generation in semiconductors, and the reasons are as follows. the fan-out WLP does not require a substrate, unlike conventional wire bonding and flip-chip bonding packages. As a result, the thickness of the package reduces, and the interconnection becomes shorter. It is easy to increase the number of I / Os and apply it to the multi-layered 3D package. However, FOWLP has many issues that need to be resolved in order for mass production to become feasible. One of the most critical problem is the warpage problem in a process. Due to the nature of the FOWLP structure, the RDL is wired to multiple layers. The warpage problem arises when a new RDL layer is created. It occurs because the solder ball reflow process is exposed to high temperatures for long periods of time, which may cause cracks inside the package. For this reason, we have studied warpage in the FOWLP structure using commercial simulation software through the implementation of the reflow process. Simulation was performed to reproduce the experiment of products of molding compound company. Young's modulus and poisson's ratio were found to be influenced by the order of influence of the factors affecting the distortion. We confirmed that the lower young's modulus and poisson's ratio, the lower warpage.

• Journal of Powder Materials
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• v.26 no.3
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• pp.201-207
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• 2019

Tungsten heavy alloys (W-Ni-Fe) play an important role in various industries because of their excellent mechanical properties, such as the excellent hardness of tungsten, low thermal expansion, corrosion resistance of nickel, and ductility of iron. In tungsten heavy alloys, tungsten nanoparticles allow the relatively low-temperature molding of high-melting-point tungsten and can improve densification. In this study, to improve the densification of tungsten heavy alloy, nanoparticles are manufactured by ultrasonic milling of metal oxide. The physical properties of the metal oxide and the solvent viscosity are selected as the main parameters. When the density is low and the Mohs hardness is high, the particle size distribution is relatively high. When the density is high and the Mohs hardness is low, the particle size distribution is relatively low. Additionally, the average particle size tends to decrease with increasing viscosity. Metal oxides prepared by ultrasonic milling in high-viscosity solvent show an average particle size of less than 300 nm based on the dynamic light scattering and scanning electron microscopy analysis. The effects of the physical properties of the metal oxide and the solvent viscosity on the pulverization are analyzed experimentally.

• Composites Research
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• v.31 no.6
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• pp.293-298
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• 2018

In this paper, we have studied the physical properties of braided composites for use as aircraft stringers. Process variables such as drum winder speed, braid velocity, and mandrel diameter for $30^{\circ}$, $45^{\circ}$ and $60^{\circ}$ braid preforms were quantified and different epoxy resin types were applied to the braided preform using TGDDM, YD-128. Physical properties such as tensile strength and flexural strength of braided composites were investigated. Thermal properties and decomposition temperature of epoxy resin were investigated by TGA analysis. As a result, the lower the angle of the braid composites, the higher the tensile strength and the Flexural strength. The physical properties of braided composites fabricated using TGDDM epoxy resin were superior to the physical properties of braided composites fabricated using YD-128 epoxy resin. This is because the molecular weight of TGDDM epoxy resin was higher than that of YD-128 epoxy resin.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.1
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• pp.59-64
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• 2019

In recent years, the HP-CRTM method, which has the ability to produce carbon fiber-reinforce plastic composites at high speeds, has come into the spotlight in the automotive parts industry, which demands high productivity. Multi-axial carbon fabric, an intermediate material used in this HP-CRTM molding process, consists of layered fibers without crimp, which makes it better in terms of tensile and shear strength than the original woven fabrics. The NCF (non-crimp fabric) can form the layers of the carbon fiber, which have different longitudinal and lateral directions, and ${\pm}{\theta}$ degrees, depending on the product's properties. In this research, preforms were made with carbon fibers of ${\pm}45^{\circ}$ and $0/90^{\circ}$, which were lamination structures under seven different conditions, in order to create the optimal laminated structure for automobile reinforcement center floor tunnels. Carbon fiber composites were created using each of the seven differently laminated preforms, and polyurethane was used as the base material. The specimens were manufactured in accordance with the ASTM D3039 standards, and the effect of the NCF lamination structure on the mechanical properties was confirmed by a tensile test.

• Food Engineering Progress
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• v.21 no.3
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• pp.233-241
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• 2017

Scaffolds of cell substrates are biophysical platforms for cell attachment, proliferation, and differentiation. They ultimately play a leading-edge role in the regeneration of tissues. Recent studies have shown the potential of bioactive scaffolds (i.e., osteo-inductive) through 3D printing. In this study, rice bran-derived biocomposite was fabricated for fused deposition modeling (FDM)-based 3D printing as a potential bone-graft analogue. Rice bran by-product was blended with poly caprolactone (PCL), a synthetic commercial biodegradable polymer. An extruder with extrusion process molding was adopted to manufacture the newly blended "green material." Processing conditions affected the performance of these blends. Bio-filament composite was characterized using field emission scanning electron microscopy (FE-SEM) and energy dispersive X-ray spectroscopy (EDX). Mechanical characterization of bio-filament composite was carried out to determine stress-strain and compressive strength. Biological behaviors of bio-filament composites were also investigated by assessing cell cytotoxicity and water contact angle. EDX results of bio-filament composites indicated the presence of organic compounds. These bio-filament composites were found to have higher tensile strength than conventional PCL filament. They exhibited positive response in cytotoxicity. Biological analysis revealed better compatibility of r-PCL with rice bran. Such rice bran blended bio-filament composite was found to have higher elongation and strength compared to control PCL.

• Composites Research
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• v.34 no.1
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• pp.51-56
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• 2021

This paper studied the possibility of manufacturing bulk graphite using coal tar, a precursor of coal tar pitch, as a binder and impregnant. Carbonization was conducted after mixing and molding with natural graphite as a filler and coal tar as a binder. Impregnation-recarbonization was performed five times after carbonization. Coal tar used as impregnant. Measuring density, porosity, compressive strength, and anisotropy ratio was conducted. The maximum density of bulk graphite specimen was 1.76 g/㎤ and the minimum porosity was 15.6% which could be controlled by process control. The highest compressive strength was 20.3 MPa. Then the maximum anisotropic ratio of bulk was shown 0.34 through XRD analysis. Therefore, it was confirmed that it was possible to manufacture artificial graphite in a bulk form by using coal tar as a binder and an impregnant.

• Journal of Advanced Technology Convergence
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• v.2 no.2
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• pp.9-14
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• 2023

This study is shown the result of the first year to develop an export 1050MPa-class lightweight ductile iron castings Austempered control arm through the research process to obtain the following results. First, the structure of the optimal design Layout design and development of the component, and then achieve them through the Control Arm rigidity and optimal structure design and robust design of the focus areas of the expected stress Control Arm. Second, to develop a Control Arm reflects the high rigidity and high performance lightweight structures. Control Arm them developed to meet the design and rigidity as required by the consumer through the hollow, and to develop a process for the Core. Third, through optimum alloy composition and heat treatment methods will be derived to derive the amount of iron alloy (Cu, Ni, Mo) and Austempered heat treated and tempered condition. Fourth, through the development of optimum molding technology development component to develop the optimum ADI for the low-stiffness, high-rigidity component development, it attempts to develop a high-strength casting forming technology..

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.11
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• pp.386-393
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• 2019

In this study, we investigated the cause of a voltage controller failure that occurred in the operation of a combat vehicle and attempted to establish a solution for the failure. The failure in the voltage controller was found to be related to thermal resistance, which could be identified by disassembly analysis and a high temperature operation test. Especially, in the disassembly analysis, there was damage caused by high temperature such as soot on the molding material and cracking of the resisters. In addition, in the high temperature operation test, the test results show that the internal temperature of the voltage controller was relatively higher than the external temperature. This means that the voltage controller failure could be attributed to the excessive heat and insufficient thermal resistance. In order to improve the thermal resistance of the voltage controller, several designs with changing circuits and structures were devised. Improvement of thermal resistance was verified by measuring reduction of internal temperatures in the high temperature comparison test.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.2
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• pp.245-253
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• 2010

The reliability problems of flip chip packages subjected to temperature change during the packaging process mainly occur due to mismatches in the coefficients of thermal expansion as well as features with time-dependent material properties. Resin molding compounds like glass fiber reinforced epoxy composites used as the dielectric layer in printed circuit boards (PCB) strongly exhibit viscoelastic behavior, which causes their Young's moduli to not only be temperature-dependent but also time-dependent. In this study, the stress relaxation and creep tests were used to characterize the viscoelastic properties of the glass fiber reinforced epoxy composite. Using the viscoelastic properties, finite element analysis (FEA) was employed to simulate thermal loading in the pre-baking process and predict thermal warpage. Furthermore, the effect of viscoelastic features for the major polymeric material on the dielectric layer in the PCB (the glass fiber reinforced epoxy composite) was investigated using FEA.

• Clean Technology
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• v.28 no.3
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• pp.203-209
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• 2022

An environmental evaluation was conducted by employing LCA methodology for a mechanical seal manufacturing process that uses recycled silicon recovered from end-of-cycle PV modules. The recycled silicon was purified and reacted with carbon to synthesize β-SiC particles. Then the particles underwent compression molding, calcination and heat treatment to produce a product. Field data were collected and the potential environmental impacts of each stage were calculated using the LCI DB of the Ministry of Environment. The assessment was based on 6 categories, which were abiotic resource depletion, acidification, eutrophication, global warming, ozone depletion and photochemical oxidant creation. The environmental impacts by category were 45 kg CO₂ for global warming and 2.23 kg C₂H₄ for photochemical oxide creation, and the overall environmental impact by photochemical oxide creation, resource depletion and global warming had a high contribution of 98.7% based on weighted analysis. The wet process of fine grinding and mixing the raw silicon and carbon, and SiC granulation were major factors that caused the environmental impacts. These impacts need to be reduced by converting to a dry process and using a system to recover and reuse the solvent emitted to the atmosphere. It was analyzed that the environmental impacts of resource depletion and global warming decreased by 53.9% and 60.7%, respectively, by recycling silicon from end-of-cycle PV modules. Weighted analysis showed that the overall environmental impact decreased by 27%, and the LCA analysis confirmed that recycling waste modules could be a major means of resource saving and realizing carbon neutrality.