1 |
H. Tang, J. Nguyen, J. Zhang and I. Chien, "Warpage Study of a Package on Package Configuration," 2007 International Symposium on High Density packaging and Microsystem Integration, Shanghai, pp. 1-5, (2007).
|
2 |
W. Sun, W. H. Zhu, C. K. Wang, A. Y. S. Sun and H. B. Tan, "Warpage simulation and DOE analysis with application in package-on-package development," EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, Freiburg im Breisgau, pp. 1-8, (2008).
|
3 |
Kyoung-Ho Kim, Hyouk Lee, Jin-Wook Jeong, Ju-Hyung Kim, Sung-Hoon Choa1, "Numerical Analysis of Warpage and Stress for 4-layer Stacked FBGA Package," J. Microelectron. Packag. Soc., 19(2), pp. 10-13, (2012).
|
4 |
Man Sung Choi, Kwang Sun Kim, "Experimental Analysis and Optimization of Plasma Etching Process," Journal of the Semiconductor & Display Technology, 8(4), pp. 1-5, (2009).
|
5 |
M.K.LEE, S.H.Choa, J.W.Jeong, J,Y.Ock, "Study of fan-out wafer level package to optimize the warpage," Korean Society for Precision Engineering, pp. 10-19, (2014).
|
6 |
Wei Keat Loh, R. Kulterman, H. Fu and M. Tsuriya, "Recent trends of package warpage and measurement metrologies," 2016 International Conference on Electronics Packaging (ICEP), Sapporo, pp. 89-93, (2016).
|
7 |
Y. Bin, W. Xiaofeng and Z. Yabing, "The Study of Thermally Induced Warpage of BGA Package during Reflow Soldering," 2018 19th International Conference on Electronic Packaging Technology (ICEPT), Shanghai, pp. 1411-1414, (2018).
|
8 |
A. B. Denoyo, "Warpage resolution for Ball Grid Array (BGA) package in a fully integrated assembly," 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, Guilin, pp. 419-422, (2012).
|
9 |
Cha Gyu Song, Sung-Hoon Choa, "Numerical Study of Warpage and Stress for the Ultra Thin Package," J. Microelectron. Packag. Soc., 17(4), pp. 49-60, (2010).
|
10 |
J. Jang, K. Suk, J. Park, K. Paik and S. Lee, "Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition," in IEEE Transactions on Components, Packaging and Manufacturing Technology, 4(7), pp. 1144-1151, (2014).
DOI
|