• Fashion & Textile Research Journal
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• v.24 no.6
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• pp.694-706
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• 2022

This study focusses on the development of a motion-sensing smart leggings prototype with the help of a module that monitors motion using a fiber-type stretch sensor. Additionally, it acquires data on Electrocardiogram (ECG), respiration, and body temperature signals, for the development of smart clothing used in online exercise coaching and customized healthcare systems. The research process was conducted in the following order: 1) Fabrication of a fiber-type elastic strain sensor for motion monitoring, 2) Positioning and attaching the sensor, 3) Pattern development and three-dimensional (3D) design, 4) Prototyping 5) Wearability test, and 6) Expert evaluation. The 3D design method was used to develop an aesthetic design, and for sensing accurate signal acquisition functions, wearability tests, and expert evaluation. As a result, first, the selection or manufacturing of an appropriate sensor for the function is of utmost importance. Second, the selection and attachment method of a location that can maximize the function of the sensor without interfering with any activity should be studied. Third, the signal line selection and connection method should be considered, and fourth, the aesthetic design should be reflected along with functional verification. In addition, the selection of an appropriate material is important, and tests for washability and durability must be made. This study presented a manufacturing method to improve the functionality and design of smart clothing, through the process of developing a prototype of motion-sensing smart leggings.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2020.06a
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• pp.14-15
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• 2020

The need for off-site construction has increased in the construction industry in Korea in recent years due to the enforcement of the 52-hour workweek, the increasing age of workers on construction sites, the deepening dependence on overseas workers, and the stagnation of productivity in the construction industry. Thus, studies on OSC started in April 2020. In addition, as a national policy study advocating the modular construction method, which is one of the OSC methods, was completed in the first half of 2019. 70 housing units in two complexes that satisfied the Housing Act requirements have been supplied to citizens. However, although modular construction methods have been recognized as a dramatic construction method that achieves shortened construction schedules and solves the issues of cost reduction and the shortage of technical workers on sites by combining the advantages of the manufacturing industry and applying the economies of scale, realistically it has issues due to the rising cost of steel and a low pre-fabrication ratio. Moreover, the construction time of core parts, such as those built by pouring concrete, has become a factor that hinders the shortening of construction times. Thus, this study aims to propose a precast concrete(PC) modular construction system, which fuses three-dimensional infill as an interior finish material and a three-surface PC module that can acts as a structure for a construction method that is economical and can shorten construction time.

• Fire Science and Engineering
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• v.31 no.3
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• pp.63-72
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• 2017

This study fabricated a low-voltage 10 circuit distribution board based on the KEMC (Korea Electrical Manufacturers Cooperative) 2102-610 standard and performed a characteristics assessment of the developed 10 circuit distribution board to secure product stability. The developed 10 circuit distribution board is designed to have the characteristics of insulation materials, as well as resistance to corrosion ultraviolet radiation and mechanical impact. The developed distribution board is fabricated to have an appropriate protection class of enclosure, electric shock prevention and protection circuits, switchgear and its components, internal electrical circuits and connectors, external conduct terminal, insulation characteristics, temperature rise test, heat resistance, etc. The developed 10 circuit distribution board consists of a single phase circuit and 3-phase circuits. It is possible to measure in real time the leakage current generated from the load distribution line by installing a sensor module at the load side of each of the branched switchgears. In addition, it is possible to increase a circuit according to the use and purpose of the load and to also manage and check the load in real time. Temperature rise tests were performed on the developed 10 circuit distribution board at 18 places including the inlet connection, main circuit and distribution circuit bus bars and bus bar supports, etc. The highest temperature of $65.3^{\circ}C$ was measured at the R-Phase of the connection of the MCCB power supply for the branch circuit bus bar and a temperature rise of $61.6^{\circ}C$ was measured at the T-Phase of the load side. When applying thermal stress to an MCCB for 6 hours at $180^{\circ}C$ using a heat resistant experimental device, it was found that the actuator lever was transformed and moved in the tripped state.

• Journal of the Korean Ceramic Society
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• v.41 no.6
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• pp.444-449
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• 2004

The microwave dielectric properties of low temperature sintered BaO-Nd$_2$O$_3$-TiO$_2$ (here after BNT) with a Pb-based glass-ceramics were studied in order to investigate their applicability to Low Temperature Co-fired Ceramics (LTCC) for fabrication of multilayered Radio Frequency (RF) passive components module. The BNT ceramics, with 5∼30 wt% of PbO-TiO$_2$-A1$_2$O$_3$-SiO$_2$ based glass-ceramics, were sintered at 105$0^{\circ}C$, which is lower than 130$0^{\circ}C$, sintering temperature of pure BNT ceramics. With increasing the amount of the glass-ceramics, sintering rate of the ceramics become activated due to the softening of glass, resulting in low-temperature densification. BaO-Nd$_2$O$_3$-TiO$_2$ microwave ceramics with 20 wt% glass-ceramics exhibit sintered relative densities over 95% and dielectric constant of 72, quality factor of 1500, and temperature coefficient of frequency of +22 ppm/$^{\circ}C$. This enhanced dielectric properties are attributed to mainly the presence of crystalline phases PbTiO$_3$ within the Pb-based glass.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.11
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• pp.1034-1046
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• 2011

In this paper, a design and fabrication of 40 W power amplifier for the X-band using load-pull measurement of GaN HEMT chip are presented. The adopted active device for power amplifier is GaN HEMT chip of TriQuint company, which is recently released. Pre-matched fixtures are designed in test jig, because the impedance range of load-pull tuner is limited at measuring frequency. Essentially required 2-port S-parameters of the fixtures for extraction optimal input and output impedances is obtained by the presented newly method. The method is verified in comparison of the extracted optimal impedances with data sheet. The impedance matching circuit for power amplifier is designed based on EM co-simulation using the optimal impedances. The fabricated power amplifier with 15${\times}$17.8 $mm^2$ shows the efficiency above 35 %, the power gain of 8.7~8.3 dB and the output power of 46.7~46.3 dBm at 9~9.5 GHz with pulsed-driving width of 10 usec and duty of 10 %.

• The Bulletin of The Korean Astronomical Society
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• v.35 no.1
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• pp.40.1-40.1
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• 2010

The Main payload of the STSAT-3 (Korea Science & Technology Satellite-3), MIRIS (Multipurpose Infra-Red Imaging System) has been developed for last 3 years by KASI, and its Flight Model (FM) is now being developed as the final stage. All optical lenses and the opto-mechanical components of the FM have been completely fabricated with slight modifications that have been made to some components based on the Engineering Qualification Model (EQM) performances. The components of the telescope have been assembled and the test results show its optical performances are acceptable for required specifications in visual wavelength (@633 nm) at room temperature. The ensuing focal plane integration and focus test will be made soon using the vacuum chamber. The MIRIS mechanical structure of the EQM has been modified to develop FM according to the performance and environment test results. The filter-wheel module in the cryostat was newly designed with Finite Element Analysis (FEM) in order to compensate for the vibration stress in the launching conditions. Surface finishing of all components were also modified to implement the thermal model for the passive cooling technique. The FM electronics design has been completed for final fabrication process. Some minor modifications of the electronics boards were made based on EQM test performances. The ground calibration tests of MIRIS FM will be made with the science grade Teledyne PICNIC IR-array.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.10
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• pp.687-698
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• 2001

This paper presents a three dimensional stacked pad area away (PAA) package configuration as an implementation method of radio frequency (RF) circuits. 224MHz RF circuits of intelligence traffic system(ITS) were constructed with the stacked PAA RF pakage configuration. In the process of manufacturing the stacked PAA RF pakage, RF circuits were partitioned to subareas following their function and operating frequency. Each area of circuits separated to each subunits. The operating characteristics of RF PAA package module and the electrical properties of each subunits were examined. The measurement of electrical parameters for solder balls which were interconnects for stacked PAA RF packages showed that the parasitic capacitance and inductance were 30fF and 120pH, respectively, which might be negligible in PAA RF packaging system. HP 4396B network/spectrum analyzer revealed that the amplification gain of a receiver and transmitter at 224 MHz was 22dB and 27dB, respectively. The gain was 3dB lower than designed values. The difference was probably generated from fabrication process of the circuits by employing commercial standard

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.10
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• pp.7071-7077
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• 2015

In recently, the demand of cover-glass is increased because smart phone, tablet pc, and electrical device has become widely used. The display of mobile device is enlarged, so it is necessary to have a high strength against the external force such as contact or falling. In fabrication process of cover-glass, a grinding process is very important process to obtain high strength of glass. Conventional grinding process using a grinding wheel is caused such as a scratch, chipping, notch, and micro-crack on a surface. In this paper, polishing system using a abrasive film was developed for a grinding of mobile cover-glass. To evaluate structural stability of the designed system, finite element model of the polishing system is generated, and multi-body dynamic analysis of abrasive film polishing machine is proposed. As a result of the analysis, stress and displacement analysis of abrasive film polishing system are performed, and using laser displacement sensor, structural stability of abrasive film polishing system is confirmed by measuring displacement.

• Korean Journal of Optics and Photonics
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• v.8 no.6
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• pp.510-515
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• 1997

Packaging takes an extremely important element of optical module cost due primarily to the added complication of alignment between semiconductor devices and optical fiber, and many efforts have been devoted on reducing the cost by eliminating the complicated optical alignment procedures in passive manner. In this study, we fabricated silicon optical benches on which the optical alignments are accomplished passively. To improve the positioning accuracy of a flip-chip bonded LD, we adopted fiducial marks and solder dams which are self-aligned with V-groove etch patterns, and a stand-off to control the height and to improve the heat dissipation of LD. Optical sub-assemblies exhibited an average efficiency of -11.75$\pm$1.75 dB(1$\sigma$) from the LD-to-single mode fiber coupling and an average sensitivity of -35.0$\pm$1.5 dBm from the fiber and photodetector coupling.

• The Bulletin of The Korean Astronomical Society
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• v.39 no.1
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• pp.52.2-52.2
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• 2014

The Immersion Grating Infrared Spectrometer (IGRINS) is an unprecedentedly minimized infrared cross-dispersed echelle spectrograph with a high-resolution and high-sensitivity optical performance. A silicon immersion grating features the instrument for the first time in this field. IGRINS will cover the entire portion of the wavelength range between 1.45 and $2.45{\mu}m$ accessible from the ground in a single exposure with spectral resolution of 40,000. Individual volume phase holographic (VPH) gratings serve as cross-dispersing elements for separate spectrograph arms covering the H and K bands. On the 2.7m Harlan J. Smith telescope at the McDonald Observatory, the slit size is $1^{\prime\prime}{\times}15^{\prime\prime}$. IGRINS has a $0.27^{\prime\prime}$ pixel-1 plate scale on a $2048{\times}2048$ pixel Teledyne Scientific & Imaging HAWAII-2RG detector with SIDECAR ASIC cryogenic controller. The instrument includes four subsystems; a calibration unit, an input relay optics module, a slit-viewing camera, and nearly identical H and K spectrograph modules. The use of a silicon immersion grating and a compact white pupil design allows the spectrograph collimated beam size to be 25mm, which permits the entire cryogenic system to be contained in a moderately sized rectangular vacuum chamber. The fabrication and assembly of the optical and mechanical hardware components were completed in 2013. In this presentation, we describe the major design characteristics of the instrument and the early performance estimated from the first light commissioning at the McDonald Observatory.