• Journal of the Korea Convergence Society
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• v.11 no.10
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• pp.1-7
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• 2020

The manufacturing process of the resistive variable memory device, which is the based of neuromorphic device, maintained the continuity of vacuum process and applied plasma module suitable for the production of the ReRAM(resistive random access memory) and process technology for the neuromorphic computing, which ensures high integrated and high reliability. The ReRAM device of the oxide thin-film applied to the plasma module was fabricated, and research to improve the properties of the device was conducted through various experiments through changes in materials and process methods. ReRAM device based on TiO₂/TiOx of oxide thin-film using plasma module was completed. Crystallinity measured by XRD rutile, HRS:LRS current value is 2.99 × 10³ ratio or higher, driving voltage was measured using a semiconductor parameter, and it was confirmed that it can be driven at low voltage of 0.3 V or less. It was possible to fabricate a neuromorphic ReRAM device using oxygen gas in a previously developed plasma module, and TiOx thin-films were deposited to confirm performance.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.37-41
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• 2018

This paper presents the integrated fluorescent oxygen sensor probe module based on planner lightwave circuits using UV imprint lithography. The oxygen sensor system is consisted of the optical source part, optical detector part and optical sensing probe part to be composed of the planner lightwave circuit and oxygen sensitive thin film layer. Firstly, we optimally designed the planner lightwave circuit with asymmetric $1{\times}2$ beam splitter using beam propagation method. Then, we fabricated the planner lightwave circuits using UV imprint lithography process. This planner lightwave circuits transmitted the optical power with 76% efficiency and the fluorescence signal with 70% efficiency. The oxygen sensitive thin film layer is coated on the end face of planner lightwave circuit. The oxygen sensor system using this sensor probe module with planner lightwave circuit could measure the concentration with 0.3% resolution from 0% to 20% gas range. This optical oxygen sensor probe module make it possible to compact, simple and cheap measurement system.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.19 no.12
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• pp.1322-1328
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• 2009

This paper presents vibration analysis of maskless exposure module in printed circuit board(PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the finite element analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

• Journal of the Korean Solar Energy Society
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• v.37 no.2
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• pp.77-85
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• 2017

Thin crystalline silicon (C-Si) solar cell is expected to be a low price energy source by decreasing the consumption of Si. However, thin c-Si solar cell entails the bowing and crack issues in high temperature manufacturing process. Thus, the conventional tabbing process, based on high temperature soldering (> $250^{\circ}C$), has difficulties for applying to thin c-Si solar cell modules. In this paper, a conductive paste (CP) based interconnection process has been proposed to fabricate thin c-Si solar cell modules with high production yield, instead of existing soldering materials. To optimize the process condition for CP based interconnection, we compared the performance and stability of modules fabricated under various lamination temperature (120, 150, and $175^{\circ}C$). The power from CP based module is similar to that with conventional tabbing process, as modules are fabricated. However, the output of CP based module laminated at $120^{\circ}C$ decreases significantly (14.1% for Damp heat and 6.1% for thermal cycle) in harsh condition, while the output drops only in 3% in the samples process at $150^{\circ}C$, $175^{\circ}C$. The peel test indicates that the unstable performance of sample laminated at $120^{\circ}C$ is attributed to weak adhesion strength (1.7 N) between cell and ribbon compared to other cases (2.7 N). As a result, optimized lamination temperature for CP based module process is $150^{\circ}C$, considering stability and energy consumption during the fabrication.

• Journal of IKEEE
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• v.24 no.1
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• pp.72-80
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• 2020

This paper describes the design and fabrication of a BUC(Block Up-converter) which is a component of a FST (Flyaway Satellite Terminal), one of the ET(Earth Terminal) of the military satellite. BUC is physically composed of an up-converter module, a high power amplifier module, a receive band suppression filter, a housing, and a cable assembly. It was designed using simulator AWR to satisfy the electrical characteristics of BUC's such as maximum output power, gain, unwanted signal, and intermodulation. The maximum output power and gain characteristics were measured at 43.4dBm and 51.8dB, respectively. The unwanted wave and intermodulation characteristics were -73.5dBc and -31.9dBc, respectively. Of the electrical requirements of Table 1, not only the above four but also all of the items were confirmed to be satisfied.

• Journal of IKEEE
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• v.24 no.1
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• pp.81-89
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• 2020

This paper describes the design and fabrication of a LNB(Low Noise Block downd-converter) which is a component of a FST(Flyaway Satellite Terminal), one of the ET(Earth Terminal) of the military satellite. LNB is physically composed of an down-converter module, a low noise amplifier module, a transmit band suppression filter, a isolator, a housing, and a cable assembly. It was designed using simulator (AWR) to satisfy the electrical characteristics of LNB's such as gain, noise figure and unwanted signal. The gain and noise figure characteristics were measured at 61.4dBm and 1.37dB, respectively. The unwanted wave was measured at -66.79dBc. Of the electrical requirements of Table 1, not only the above three but also all other items were confirmed to be satisfied.

• KIEAE Journal
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• v.12 no.6
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• pp.77-84
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• 2012

The current architectural design of unit modular has been based on 2D of CAD program, so unit modular character which needs unit information management, as a dried-member system, has no effect on design process. The purpose of this study is We have developed a suitable BIM design process, according to various works of construction, then tried to contribute to supply and activation of the urban-life-housing based on unit modular. The BIM modeling process based on unit modular has been in order of unit combination with preparing manual classification, and, it has been constructed, at construction site, from housing foundation to roof finish by Bottom-up method. At a manufacturing factory, it has been produced in order of 1) grouping materials and parts, 2) fabricating unit boxes, and 3) interference examination of unit boxes, and each order has been classified as housing structure, architecture, plumbing process separately. At a construction site, the fabrication has been done in order of, like as a real housing construction scenario, 1) RC foundation work 2) unit module job-site-fabrication work, 3) roof truss work, 4) plumbing and HVAC work, and 5) housing interior finish work. After modeling process, the interference examination on each work of construction has finally completed modeling. The Unit modular utilizing BIM modeling can make easy housing maintenance through systematic control with preparing manual of unit module information, and securing accurate and speedy construction information. And it will promote design credibility and create maximum effect of unit modular construction method, such as construction period reduction and upgrade of construction quality, etc., through the computer simulation as real as construction environment in cyber space, and with the interfering examination.

• Journal of the Korean Society of Safety
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• v.33 no.1
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• pp.28-34
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• 2018

The purpose of this study is to fabricate a sensor module to detect the resistive leakage current (Igr) in real time that occurs to low voltage electric lines and to verify its reliability. In the case of the developed sensor module, wires are inserted into the zero current transformer (ZCT) and current transformer (CT) in advance and then the branch line is connected to the circuit breaker. The measurement result of the resistance of the distribution panel equipped with the developed sensor module shows that the resistance is $0.151m{\Omega}$ between the R and R phases, $0.169m{\Omega}$ between the S and S phases, and $0.178m{\Omega}$ between the T and T phases, respectively. The insulation resistance measured at AC 500 V and 1,000 V is $0.08m{\Omega}$ between the R, S, T and N phases, respectively. Then, the insulation resistance measured at DC 500 V is $83.3G{\Omega}$ between the R, S, T and G terminal, respectively. In addition, the applied withstanding voltage is AC 220 V/380 V/440 V and it was found that characteristics between all phases are good. This study measured the standby power by installing the developed sensor module at the rear of the MCCB and switching the circuit breaker on sequentially. The standby power is 1.350 W when one circuit breaker is turned on, 1.690 W when 2 circuit breakers are turned on, and 4.371 W when 10 circuit breakers are turned on. This study also verified the reliability of the standby power of the distribution panel equipped with the developed sensor module using the Minitab Program (Minitab PGM). Since the analysis shows the statistical average of 1.34627 in the reliable range of normal distribution, standard deviation of 0.001874, AD of 0.554, and P value of 0.140, it is found that the distribution panel equipped with the developed sensor module has high reliability.

• Journal of the Optical Society of Korea
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• v.10 no.3
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• pp.124-129
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• 2006

We have developed a compact and cost-effective camera module on the basis of wafer-scale-replica processing. A multiple-layered structure of several aspheric lenses in a mobile-phone camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. This wafer-scale processing leads to at least 95% yield in mass-production, and potentially to a very slim phone with camera-module less than 2 mm in thickness. We have demonstrated a VGA camera module fabricated by the wafer-scale-replica processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having $230{\mu}m$ sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in orderto achieve a higher resolution in wafer-scaled lenses for mobile-phone camera modules.

• Korean Journal of Optics and Photonics
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• v.14 no.5
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• pp.509-514
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• 2003

Mach-Zehnder interferometric wavelength converters with monolithically integrated semiconductor optical amplifiers (SOA's) have been fabricated and characteristics of wavelength conversion at 10 Gb/s have been investigated for wavelength span of 40 nm. The devices have been achieved by using a butt-joint combination of buried ridge structure type SOA's and passive waveguides. In the integration, a new method has been applied that removes p+InP cladding layer leading to high propagation loss and forms simultaneously the current blocking and the cladding layer using undoped InP. The module packaging has been achieved by using a titled fiber array for effective coupling into the tilted waveguide in the wavelength converter. Using the module, wavelength conversion with power penalty lower than 1 ㏈ at 10 Gb/s has been demonstrated for wavelength span of 40 nm. In addition, it is show that the module can provide 2R (re-amplification, re-shaping) operation by demonstrating the conversion with the negative penalty.