• 제목/요약/키워드: micromachining technology

검색결과 232건 처리시간 0.028초

Fabrication and characterization of silicon-based microsensors for detecting offensive $CH_3SH\;and\; (CH_3)_3N$ gases

  • Lee, Kyu-Chung;Hur, Chang-Wu
    • Journal of information and communication convergence engineering
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    • 제6권1호
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    • pp.38-42
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    • 2008
  • Highly sensitive and mechanically stable gas sensors have been fabricated using the microfabrication and micromachining techniques. The sensing materials used to detect the offensive $CH_3SH$ and $(CH_3)_3N$ gases are 1 wt% Pd-doped $SnO_2$ and 6 wt% $Al_2O_3$-doped ZnO, respectively. The optimum operating temperatures of the devices are $250^{\circ}C$ and $350^{\circ}C$ for $CH_3SH$ and $(CH_3)_3N$, respectively and the corresponding heater power is, respectively, about 55mW and 85mW. Excellent thermal insulation is achieved by the use of a double-layer membrane: i.e. $0.2{\mu}m$-thick silicon nitride and $1.4{\mu}m$-thick phosphosilicate glass. The sensors are mechanically stable enough to endure the heat cycles between room temperature and $350^{\circ}C$, at least for 30 days.

열풍동형 폴리실리콘 마이크로 액츄에이터의 제작 및 특성 분석 (Fabrication of thermally driven polysilicon micro actuator and its characterization)

  • 이종현
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1996년도 춘계학술대회 논문집
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    • pp.146-150
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    • 1996
  • A thermal micro actualtor has been fabricated using surface micromachining techniques. It consists of doped ploysilicon as a moving part and TEOS(Tetra Ethyl Ortho Silicate) as a sacrificial layer. The polysilicon was annealed for the reduction of residual stress which is the main cause to its deformation such as bending and buckling. And the newly developed HF VPE(vapor phase etching)process was also used as an effective release method for the elimination of sacrificaial layer. With noliquid involved during any of the steps for relasing, unlike other reported relase techniques, the HF VPE pocess has produced polysilicon microstructures with virtually no process-induced stiction problem. The actuation is incured by the thermal expasion due to current flow in active polysilicon cantilever, which motion is amplified bylever mechanism. The thickness of pllysilicon is 2 .mu. m and the length of active and passive polysilicon cantilever are 500 .mu. m, respectively. The moving distance of polysilicon actuator was experimentally conformed as large as 21 .mu. m at the input voltage level of 10 V and 50Hz square wave. These micro actuator technology can be utilized for the fabrication of MEMS (microlectromechanical system) such as microrelay, which requires large displacement or contact force but relatively slow response.

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수평구동형 정전반발력 마이크로액추에이터 (Laterally-Driven Electrostatic Repulsive-Force Microactuator)

  • 이기방;조영호
    • 대한기계학회논문집A
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    • 제25권3호
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    • pp.424-433
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    • 2001
  • We present a new electrostatic repulsive-force microactuator using a lateral repulsive force induced by an asymmetric distribution of electrostatic field. The lateral repulsive force has been characterized by a simple analytical equation, derived from a finite element simulation. A set of repulsive force polysilicon microactuators has been designed and fabricated by a 4-mask surface-micromachining process. Static and dynamic micromechanical behavior of the fabricated microactuators has been measured at the atmospheric pressure for a varying bias voltage. The static displacement of the fabricated microactuator, proportional to the square of the DC bias voltage, is obtained as 1.27 $\mu\textrm{m}$ for the DC bias voltage of 140V. The resonant frequency of the repulsive-force microactuator increases from 11.7 kHz to 12.7 kHz when the DC bias voltage increases from 60V to 140V. The measured quality-factor varies from 12 to 13 for the bias volatge range of 60V∼140V. The characteristics of the electrostatic repulsive-force have been discussed and compared and compared with those of the conventional electrostatic attractive-force.

레이저에 의한 Li$_2$O-A1$_2$O$_3$-SiO$_2$계 유리의 미세가공 및 광학적 특성 (Micromachining & Optical Properties of Li$_2$O-A1$_2$O$_3$-SiO$_2$ Glass System by Laser Treatment)

  • 강원호
    • 마이크로전자및패키징학회지
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    • 제8권4호
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    • pp.43-45
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    • 2001
  • 본 연구는 레이저 처리기술에 의한 $Li_2O-A1_2O_3-SiO_2$계 유리의 미세가공과 레이저에 의한 유리의 광활성반응에 관한 것으로서, 1064 nm와 355 nm의 파장을 갖는 Nd:YAG laser를 유리에 조사하여 유리의 파괴특성 및 광학적변화를 관찰하였다. 1064 nm레이저에 의한 유리의 파괴 부분은 광학현미경과 주사전자현미경 (SEM)으로서 파괴특성을 평가하였으며, 355 nm 레이저에 의한 유리의 변화는 흡수대역은 측정함으로서 그 광학적 특성을 나타내었다. 이와 같은 레이저에 의한 가공은 유리내부의 3차원적인 미세구조물 형성이나, internal waveguide, 또는 광 흡수대역의 변화에 따른 광기록방법으로 응용될 것으로 예상된다.

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단층 다결정 실리콘 마이크로머시닝 기술로 제작된 정전형 마이크로 미러 어레이의 모델링 및 측정 (Modeling and Measurement of Electrostatic Micro Mirror Array Fabricated with Single Layer Polysilicon Micromachining Technology)

  • 민영훈;김용권
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1997년도 추계학술대회 논문집 학회본부
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    • pp.612-614
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    • 1997
  • Silicon based micro mirror array is a highly efficient component for use in optical applications such as adaptive optical systems and optical correlators. A micro mirror array designed, fabricated and tested here is consisted of $5{\times}5$ single layer polysilicon, electrostatically driven actuators. In this paper, deflection characteristics and pull-in behavior of the actuators for analog control was studied and particularly, the influence of the residual stress in flexure beams for the restorative force of actuators was considered. The springs are modeled as a residual stress-free spring and a spring with residual stress. In calculation, a mirror with the residual stress-free springs has 30.3N/m spring constant and 31.1V pull-in voltage. On the other hand, a mirror with the stressed springs has 23.6N/m and 27.4V respectively. The experimental result, which is 20.5N/m and 25.5V, shows that the stressed springs ore well modeled.

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미세 연소기 개발 (III) - 감광 유리를 이용한 마이크로 엔진의 제작 - (Design and Fabrication of Micro Combustor (III) - Fabrication of Micro Engine by Photosensitive Class -)

  • 이대훈;박대은;윤준보;윤의식;권세진
    • 대한기계학회논문집B
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    • 제26권12호
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    • pp.1639-1645
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    • 2002
  • Micro engine that includes Micro scale combustor is fabricated. Design target was focused on the observation of combustion driven actuation in MEMS scale. Combustor design parameters are somewhat less than the size recommended by feasibility test. The engine structure is fabricated by isotropic etching of the photosensitive glass wafers. Electrode formed by electroplating of the Nickel. Photosensitive glass can be etched isotropically with almost vertical angle. Bonding and assembly of structured photosensitive glass wafer form the engine. Combustor size was determined to be 1 mm scale. Movable piston is engraved inside the wafer. Ignition was done by nickel spark plug which was electroplated with thickness of 40 ${\mu}{\textrm}{m}$. The wafers were bonded by epoxy that resists high temperature. In firing test due to the bonding method and design tolerance pressure buildup by reaction was not confirmed. But ignition, flame propagation and actuation of micro structure from the reaction was observed. From the result basement of design and fabrication technology was obtained.

Reduced Hybrid Ring Coupler Using Surface Micromachining Technology for 94-GHz MMIC Applications

  • Uhm, Won-Young;Beak, Tae-Jong;Ryu, Keun-Kwan;Kim, Sung-Chan
    • Journal of information and communication convergence engineering
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    • 제14권4호
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    • pp.246-251
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    • 2016
  • In this study, we developed a reduced 94 GHz hybrid ring coupler on a GaAs substrate in order to demonstrate the possibility of the integration of various passive components and MMICs in the millimeter-wave range. To reduce the size of the hybrid ring coupler, we used multiple open stubs on the inside of the ring structure. The chip size of the reduced hybrid ring coupler with multiple open stubs was decreased by 62% compared with the area of the hybrid ring coupler without open stubs. Performance in terms of the loss, isolation, and phase difference characteristics exhibited no significant change after the use of the multiple open stubs on the inside of the ring structure. The reduced hybrid ring coupler showed excellent coupling loss of $3.87{\pm}0.33dB$ and transmission loss of $3.77{\pm}0.72dB$ in the measured frequency range of 90-100 GHz. The isolation and reflection were -48 dB and -32 dB at 94 GHz, respectively. The phase differences between two output ports were $180^{\circ}{\pm}1^{\circ}$ at 94 GHz.

MEMS 공정을 이용한 전도성 고분자 액추에이터용 마이크로 구조물의 제작 (Fabrication of Microstructures for Conductive Polymer Actuators Using MEMS Process)

  • 이승기;정승환
    • 센서학회지
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    • 제12권4호
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    • pp.156-163
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    • 2003
  • 일반적인 표면 마이크로머시닝 공정과 고분자의 중합공정을 결합하여 전도성 고분자인 폴리피롤 액추에이터를 제작하였다. 폴리피롤 액추에이터의 제작 공정을 검증하기 위한 가장 기본적인 구조물은 폴리피롤 캔틸레버이며 이를 이용하여 세포 조작에 응용 가능한 폴리피롤 그리퍼 및 밸브의 기본 구조물들을 제작하였다. 그리퍼는 손가락과 유사한 형태로 뼈에 해당하는 단단한 고분자와 근육에 해당하는 폴리피롤 등으로 구성된다. 밸브는 폴리피롤 캔틸레버에 유로가 결합된 형태로 제작되었다. 제안한 폴리피롤 액추에이터의 제작 공정 및 기본 구조물들은 세포 조작기구와 같은 바이오 관련 응용에 이용될 수 있을 것이다.

Three-Dimensional Self-Assembled Micro-Array Using Magnetic Force Interaction

  • Park, Yong-Sung;Kwon, Young-Soo;Eiichi Tamiya;Park, Dae-Hee
    • KIEE International Transactions on Electrophysics and Applications
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    • 제3C권5호
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    • pp.182-188
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    • 2003
  • We have demonstrated a fluidic technique for self-assembly of microfabricated parts onto substrate using patterned shapes of magnetic force self-assembled monolayers (SAMs). The metal particles and the array were fabricated using the micromachining technique. The metal particles were in a multilayer structure (Au, Ti, and Ni). Sidewalls of patterned Ni dots on the array were covered by thick negative photoresist (SU-8), and the array was magnetized. The array and the particles were mixed in buffer solution, and were arranged by magnetic force interaction. Binding direction of the metal particle onto Ni dots was controlled by multilayer structure and direction of magnetization. A quarter of total Ni dots were covered by the particles. The binding direction of the particles was controllable, and condition of particles was almost even with the Au surface on top. The particles were successfully arranged on the array.

Determination of the Dielectrophoretic Force on a Cell in a Micro Planar Electrode Structure

  • Park, Jung-Hoon;Lee, Sang-Wook;Kim, Yong-Kweon
    • Journal of Electrical Engineering and information Science
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    • 제2권4호
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    • pp.66-71
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    • 1997
  • The dielectrophoretic(DEP) force acting on a cell in an electric field is experimentally determined. A cell is accelerated by the DEP force in an electric field generated between micro planar electrodes. the position of the cell is measured and the velocity and acceleration of the cell are calculated based on the measured position data. The DE force is determined from the motion equation of a moving cell in suspension. The electrode structure is fabricated by micromachining technology and the height of electrodes is 1 $\mu\textrm{m}$. Radish cell and yeast are used in th experiments. In the case of radish cell, the DEP force increases as voltage or frequency(1MHz∼3MHz) increases. The voltage dependence can be explained that the DEP force increases when ▽│E│$^2$increases. The frequency dependence means that Re[x\ulcorner] of radish cell is maximized in a certain frequency. In the case of yeast, the DEP force increases only as voltage increases. The reason for the voltage dependence is the same with the case of radish. The DEP force increases only as voltage increases. The reason for the voltage dependence is the same with the case of radish. The DEP force on a yeast does not vary when the frequency varies from 1MHz to 3MHz. This result coincides with the fact that the value of calculated Re[x\ulcorner] is constant in the test frequency range.

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