• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.10a
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• pp.268-273
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• 2002

The mechanical etching technique has recently been developed to a powder blasting technique for various materials, capable of producing micro structures larger than 100$\mu\textrm{m}$. This paper describes the performance of powder blasting technique in micromachining of pyrex for the accelerometer sensor and the effect of the number of nozzle scanning and the stand-off distance on the erosion depth.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.115-118
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• 2000

Uncooled pyroelectric infrared detectors based on BST(B $a_{-x}$S $r_{x}$Ti $O_3$) thin films have been fabricated by RF magnetron sputtering and surface Micromachining technology. The detectors form BST thin film ferroelectric capacitors grown by RF magnetron sputtering on N/O/N(S $i_3$ $N_4$/ $SiO_2$/S $i_3$ $N_4$) membrane. The sputtered BST thin film exhibits highly c-axis oriented crystal structure that no poling treatment for sensing applications is required. This is an essential factor to increase the yield for realization of an infrared image sensor. surface-Micromachining technology is used to lower the thermal mass of the detector by giving maximum sensor efficiency Gold-black is evaporated on top of the sensing elements used the thermal evaporator. fabricated uncooled pyroelectric infrared detectors is highly output voltage at the low temperature(1$^{\circ}C$).).).

• Laser Solutions
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• v.14 no.1
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• pp.25-29
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• 2011

Micromachining of photosensitive glass by UV exposure, heat treatment, and etching processes is reported. Like photoresist, the photosensitive glass is also classified into positive and negative types by development characteristics. For the positive type, the exposed area is crystallized and etched away during the etching process in HF solution, whereas the unexposed area is crystallized and etched away for the negative type. The crystallized area of the photosensitive glass has an etch rate approximately 30~100 times faster than that of the amorphous area so that it becomes possible to fabricate microstructures in the glass. Based on the unique properties of glass such as high optical transparency, electrical insulation, and chemical/thermal stability, the glass micromachining technique introduced in this work could be widely applied to various devices in the fields of electronics, bio engineering, nanoelectonics and so on.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.1 s.178
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• pp.89-96
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• 2006

In this study, fabrication of the large area silicon mirror is accomplished by anisotropic wet etching using micromachining technology for implementation of integrated slim optical pickup and the process condition is also established for improving the mirror surface roughness. Until now, few results have been reported about the production of highly stepped $9.74^{\circ}$ off-axis-cut silicon wafers using wet etching. In addition rough surface of the mirror is achieved in case of tong etching time. Hence a novel method called magnetorheolocal finishing is applied to enhance the surface quality of the mirror plane. Finally, areal peak to valley surface roughness of mirror plane is reduced about 100nm in large area of $mm^2$ and it is applicable to optical pickup using infrared wavelength.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.874-877
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• 2001

SOI(Silicon-On-Insulator) technology is proposed as an alternative to bulk silicon for MEMS(Micro Electro Mechanical System) manufacturing. In this paper, we fabricated the SOI wafer with uniform active layer thickness by silicon direct bonding and mechanical polishing processes. Specially-designed electrostatic bonding system is introduced which is available for vacuum packaging and silicon-glass wafer bonding for SOG(Silicon On Glass) wafer. We demonstrated thermopile sensor and RF resonator using the SOI wafer, which has the merits of simple process and uniform membrane fabrication.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.6
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• pp.17-23
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• 2002

A new 3D micromachining method called Hole Area Modulation(HAM), has been introduced to enhance the current micromachining technology. In this method, information on the depth of machining is converted to the sizes of small holes in the mask. The machining is carried out with a simple 2D movement of the workpiece. This method can be applied for machining various kinds of microcavities in various materials. In this paper, a machematical model for excimer laser micromachining based on HAM and also determination of optimal laser ablation conditions(width hole radius, step size, path, etc.) is performed by Genetic Algorithm(GA).

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.54-58
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• 2005

Femtosecond laser is the latest generation pulsed laser delivering shortest pulses. Any solid materials can be machined by it. Femtosecond laser micromachining allows highest precision and minimal heat influence within the workpiece. But due to the complex physical phenomena between the laser beam and the workpiece materials, it is very difficult to determine the optimal process conditions in the femtosecond laser micromachining. In this study, a method to simulate the femtosecond laser micromachining process was proposed. And femtosecond laser micro patterning processes of chromium thin film are simulated by the proposed method using a commercial FE code, LS-Dyna. Simulation results were compared with those of experiments.

• Proceedings of the KIEE Conference
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• 1996.11a
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• pp.413-415
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• 1996

This paper presents a technique for fabricating an electro-optical microlens for microcolumn e-beam system. The device, named Self-Aligned Microlens (SAM) was realized by mixing surface and bulk micromachining technology. The microbridges were formed on both sides of silicon wafer symmetrically. The alignment error between the electrodes could be controlled within a few micrometers with also reducing the numbers of anodic bonding.

• International Journal of CAD/CAM
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• v.6 no.1
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• pp.183-192
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• 2006

A CAD/CAM system has been developed for rapid prototyping (RP) of microfluidic devices based on excimer laser micromachining. The system comprises of two complementary softwares. One, the CAM tool, creates part programs from CAD models. The other, the Simulator Tool, uses a part program to generate the laser tool path and the 2D and 3D graphical representation of the machined microstructure. The CAM tool's algorithms use the 3D geometry of a microstructure, defined as an STL file exported from a CAD system, and process parameters (laser fluence, pulse repetition frequency, number of shots per area, wall angle), to automatically generate Numerical Control (NC) part programs for the machine controller. The performance of the system has been verified and demonstrated by machining a particle transportation device. The CAM tool simplifies part programming and replaces the tedious trial-and-error approach to creating programs. The simulator tool accepts manual or computer generated part programs, and displays the tool path and the machined structure. This enables error checking and editing of the program before machining, and development of programs for complex microstructures. Combined, the tools provide a user-friendly CAD/CAM system environment for rapid prototyping of microfluidic devices.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.3
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• pp.520-528
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• 2001

This paper investigates a resonant microaccelerometer that measures acceleration using a built-in micromechanical resonator, whose resonant frequency is changed by the acceleration-induced axial force. A set of design equations for the resonant microaccelerometer has been developed, including analytic formulae for resonant frequency, sensitivity, nonlinearity and maximum stress. On this basis, the sizes of the accelerometer are designed for the sensitivity of 10$^3$Hz/g in the detection range of 5g, while satisfying the conditions for the maximum nonlinearity of 5%, the minimum shock endurance of 100g and the size constraints placed by microfabrication process. A set of the resonant accelerometers has been fabricated by the combined use of bulk-micromachining and surface-micromachining techniques. From a static test of the cantilever beam resonant accelerometer, a frequency shift of 860Hz has been measured for the proof-mass deflection of 4.3${\pm}$0.5$\mu\textrm{m}$; thereby resulting in the detection sensitivity of 1.10${\times}$10$^3$Hz/g. Uncertainty analysis of the resonant frequency output has been performed to identify important issues involved in the design, fabrication and testing of the resonant accelerometer.