• 제목/요약/키워드: micromachining

검색결과 493건 처리시간 0.033초

Silicon Micro-probe Card Using Porous Silicon Micromachining Technology

  • Kim, Young-Min;Yoon, Ho-Cheol;Lee, Jong-Hyun
    • ETRI Journal
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    • 제27권4호
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    • pp.433-438
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    • 2005
  • We present a new type of silicon micro-probe card using a three-dimensional probe beam of the cantilever type. It was fabricated using KOH and dry etching, a porous silicon micromachining technique, and an Au electroplating process. The cantilever-type probe beam had a thickness of $5 {\mu}m$, and a width of $50{\mu}$ and a length of $800 {\mu}m$. The probe beam for pad contact was formed by the thermal expansion coefficient difference between the films. The maximum height of the curled probe beam was $170 {\mu}m$, and an annealing process was performed for 20 min at $500^{\circ}C$. The contact resistance of the newly fabricated probe card was less than $2{\Omega}$, and its lifetime was more than 20,000 turns.

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유전자 알고리즘을 이용한 엑시머 레이저가공의 최적조건 선정 (Determination of Optimal Excimer Laser Ablation Conditions Using Genetic Algorithm)

  • 배창현;최경현;이석희
    • 한국공작기계학회논문집
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    • 제11권6호
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    • pp.17-23
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    • 2002
  • A new 3D micromachining method called Hole Area Modulation(HAM), has been introduced to enhance the current micromachining technology. In this method, information on the depth of machining is converted to the sizes of small holes in the mask. The machining is carried out with a simple 2D movement of the workpiece. This method can be applied for machining various kinds of microcavities in various materials. In this paper, a machematical model for excimer laser micromachining based on HAM and also determination of optimal laser ablation conditions(width hole radius, step size, path, etc.) is performed by Genetic Algorithm(GA).

Laser Micromachining of Submicron Aperture for Electronbeam Microcolumn Application using Piezo Q-Switched Nd:YAG Laser

  • S.J. Ahn;Kim, D.W.;Park, S.S.
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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    • pp.78-78
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    • 1999
  • Experimental studies of laser micromachining on Mo metal using piezo Q-switched Nd:YAG laser have been performed. Miniaturized microcolumn electron gun arrays as a potential electron beam lithography or portable mini-scanning electron microscope application have recently extensively examined. For these purpose, the electro-static electron lens and deflector system called microcolumn has to be assembled. The conventional microcolumn fabrication technique would gave a limitation on the minimization of aberration. The current technique of a 1 $\mu$m misalignment would lead to ~1.3 nm coma. In order to reduce aberration, assembling the microcolumn component followed by laser drilling should be very beneficial. In this report, we will address the preliminary report of laser micromachining on Mo substrate using piezo Q-switched Nd:YAG laser. The geometrical figures, such as the diameter and the depth of the frilled aperture are dependent upon the total energy of the laser pulse train, laser pulsewidth, and the diameter of laser beam in addition to the materials-dependent parameters.

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표면 미세 가공기술을 이용한 마이크로 캔틸레버의 제작과 바이오센서로의 응용 (Fabrication of Microcantilever-based Biosensor Using the Surface Micromachining Technique)

  • 유경아;정승룡;강치중;김용상
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제55권1호
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    • pp.11-15
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    • 2006
  • We propose an optical and an electrical detection methods for detecting various bio-molecules effectively with microcantilevers. The microcantilevers were fabricated employing surface micromachining technique that has attractive advantages in terms of cost efficiency, simplicity and ability of fabricating in array. The fluid cell system for injection of bio-molecular solution is fabricated using polydimethylsiloxane (PDMS) and a fused silica glass. The microcantilever is deflected with respect to the difference of the surface stress caused by the formation of self-assembled bio-molecules on the gold coated side of the microcantilever. It detected cystamine dihydrochloride and glutaraldehyde molecules and analyzed individual concentrations of the cystamine dihydrochloride solution. We confirm that the deflections of bending-up or bending-down are occurred by the bio-molecule adsorption and microcantilever can be widely used to a ${\mu}-TAS$ and a lab-on-a-chip for a potential detection of various bio-molecules.

다결정실리콘 표면 미세가공 기술을 이용한 초소형 기계식 스위치의 설계 및 제작 (Design and fabrication of a Micromechanical Switch Using Polysilicon Surface Micromachining)

  • 채경수;한승오;하종민;문성욱;박정호
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제49권9호
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    • pp.546-551
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    • 2000
  • A micromechanical switch that can be used as a logic gate is described in this paper. This switch consists of fixed input electrodes an output electrode Vcc/GND electrodes and movable plates suspended by crab-leg flexures. for mechanical switching of an electrical signal a parallel plate actuator which comes in contact with output electrode was used. Provided that movable plates are connected to Vcc and a low input voltage(ground signal) is applied to the fixed input electrodes the movable plates are pulled by an electrostatic force between the fixed input electrodes and the movable plates. the proposed micromechanical switch was fabricated by surface micromachining technology with$2\mum$ -thick poly-Si and the measured threshold voltage for ON/OFF switching was 23.5V.

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유한요소법을 이용한 레이저 미세 패터닝 공정 해석 (Simulation of Laser Micro Patterning Process Using FEM)

  • 이진호;김병희;이종길
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 금형가공,미세가공,플라스틱가공 공동 심포지엄
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    • pp.54-58
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    • 2005
  • Femtosecond laser is the latest generation pulsed laser delivering shortest pulses. Any solid materials can be machined by it. Femtosecond laser micromachining allows highest precision and minimal heat influence within the workpiece. But due to the complex physical phenomena between the laser beam and the workpiece materials, it is very difficult to determine the optimal process conditions in the femtosecond laser micromachining. In this study, a method to simulate the femtosecond laser micromachining process was proposed. And femtosecond laser micro patterning processes of chromium thin film are simulated by the proposed method using a commercial FE code, LS-Dyna. Simulation results were compared with those of experiments.

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표면미세가공시 발생하는 MEMS 구조물의 변형 억제 (Alleviating Deformation of MEMS Structure in Surface Micromachining)

  • 홍석관;권순철;전병희;신형재
    • 한국정밀공학회지
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    • 제23권8호
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    • pp.163-170
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    • 2006
  • By removing sacrificial layer through ashing process, movable MEMS structure on substrate can be fabricated in surface micromachining. However, MEMS structure includes, during the ashing process, the warping or buckling effects due to stress gradient along the vertical direction of thin film. In this study, we presented method for counteracting the unwanted deflection of MEMS structure and designed using character of deposit process to overcome limited design conditions. Unit cell patterns were designed with character of deposit shape, and their final shapes were adopted using Finite Element Method. Finally, RF MEMS switch was fabricated by surface micro machining as test vehicles. We checked out that alleviation effect for deformation of switch improved by 35%.

미세입자 분사 가공에서 2차 충돌의 영향 (The Effect of the Second Impact for Abrasive Jet Micromachining)

  • 이재민;박영우;고태조
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.488-491
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    • 2005
  • Abrasive Jet Micromachining (AJM) is a process that uses high pressure air with micron-sized particles to erode a substrate. It has been considered as the most economic and appropriate technique to pattern glass surfaces for the flat panel applications. To accelerate the industrialization of AJM, it is necessary to understand the erosion mechanisms thoroughly. Thus, this paper introduces a new method to model the erosion mechanism in AJM. The model is developed by using the concept of the accumulation of the microdeformation caused by each particle. And this paper proposes the model added the effects of second impact. The developed model is used to simulate the erosion profile, and is compared with the model considered only first impact. It can be concluded that the proposed model predicts the erosion profile more accurately.

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미소절삭에서의 절삭력 해석 (An Analysis of Cutting Force in Micromachining)

  • 김동식;강철희;곽윤근
    • 한국정밀공학회지
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    • 제12권12호
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    • pp.72-80
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    • 1995
  • Ultraprecision machining technology has been playing a rapidly increasing and important role in manufacturing. However, the physics of the micromachining process at very small depth of cut, which is typically 1 .mu. m or less is not well understool. Shear along the shear plane and friction at the rake face dominate in conventional machining range. But sliding along the flank face of the tool due to the elastic recovery of the workpiece material and the effects of plowing due to the large effective negative rake angle resultant from the tool edge radius may become important in micromachining range. This paper suggests an orthogonal cutting model considering the cutting edge radius and then quantifies the effect of plowing due to the large effective negative rake angle.

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레이져를 이용한 3차원 형상가공에 관한 연구 (Laser application in 3-D micromachining)

  • 윤경구;이성국;황경현
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1995년도 추계학술대회 논문집
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    • pp.75-78
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    • 1995
  • This paper presents the feasibility of laser ablation process in 3-D micro machining of MEMS (micro Electro Mechanical System)parts. The micro machining characteristics of polymer(Energy fluence, pulse repetition rate, number of pulse, ablation rate)are investigated and 3-D micro machined samples are demonstrated.

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