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Alleviating Deformation of MEMS Structure in Surface Micromachining  

Hong Seok-Kwan (한국생산기술연구원, 정밀금형팀)
Kweon Soon-Cheol (삼성종합기술원)
Jeon Byung-Hee (인덕대학 컴퓨터응용설계학과)
Shin Hyung-Jae (삼성종합기술원)
Publication Information
Journal of the Korean Society for Precision Engineering / v.23, no.8, 2006 , pp. 163-170 More about this Journal
Abstract
By removing sacrificial layer through ashing process, movable MEMS structure on substrate can be fabricated in surface micromachining. However, MEMS structure includes, during the ashing process, the warping or buckling effects due to stress gradient along the vertical direction of thin film. In this study, we presented method for counteracting the unwanted deflection of MEMS structure and designed using character of deposit process to overcome limited design conditions. Unit cell patterns were designed with character of deposit shape, and their final shapes were adopted using Finite Element Method. Finally, RF MEMS switch was fabricated by surface micro machining as test vehicles. We checked out that alleviation effect for deformation of switch improved by 35%.
Keywords
MEMS; RF Switch; Surface Micromachining; Residual Stress; Finite element Method;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
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