• 한국분말재료학회지
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• 제5권1호
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• pp.15-21
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• 1998

The effect of $\alpha$/$\beta$ phase on the mechanical properties and contact damage of silicon nitrides $Si_3N_4$) was investigated. Silicon nitride materials were prepared from two starting powders, at selective increasing hot-pressing temperatures to coarsen the microstructures: (i) from relatively coarse $\alpha$-phase powder, essentially equiaxed $\alpha$-$Si_3N_4$ grains, with limited, slow transformation to $\beta$-$Si_3N_4$ grain; (ii) from relatively fine $\alpha$-phase powder, a more rapid transformation to $\beta$-$Si_3N_4$, with attendant grain elongation. The resulting micro-structure thereby provided a spectrum of $\alpha$/$\beta$ phase ratios, grain sizes, and grain shapes. Fracture strength, hardness, and toughness were measured, and contact damage and strength degradation after indentation were investigated by Hertzian indentation using spherical indenter. A brittle to ductile transition in $Si_3N_4$ depended on $\alpha$/$\beta$ phase ratio as well as grain size. Silicon nitride with elongated $\beta$ grains showed a superior, contact damage resistance.

• 한국분말재료학회지
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• 제14권3호
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• pp.202-207
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• 2007

Novel polymer mold process for fabrication of microcomponents using metal nanopowders was developed and experimentally optimized. Polymer mold for forming green components was produced by using a hard master mold and polydimethylsiloxane (PDMS). In the preparation of metallic powder premix for the green components without any defect, 90 wt.% 17-4PH statinless steel nanopowders and 10 wt.% organic binder were mixed by a ball milling process. The green components with very clear gear shape were formed by filling the powder premix into the PDMS soft mold in surrounding at about $100^{\circ}C$. Cold isostatic pressing (CIP) was very potent process to decrease a porosity in the sintered microcomponent. The microgear fabricated by the improved process showed a good dimension tolerance of about 1.2%.

• 한국정밀공학회지
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• 제23권8호
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• pp.178-184
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• 2006

Hot embossing is to fabricate desired pattern on the polymer substrate by pressing the patterned mold against the substrate which is heated above the glass transition temperature, and it is a high throughput fabrication method for bio chip, optical microstructure, etc. due to the simultaneous large area patterning. However, the bad pattern fidelity in large area patterning is one of the obstacles to applying the hot embossing technology for mass production. In the present study, PDMS pad was used as a cushion on the backside of the micro-patterned 4 inch Si mold to improve the pattern fidelity over the 4 inch PMMA sheet by increasing the conformal contact between the Si mold and the PMMA sheet. The pattern replicability improvement over 4 inch wafer scale was evaluated by comparing the replicated pattern height and depth for PDMS-cushioned Si mold against the rigid Si mold without PDMS cushion.

• Journal of Ginseng Research
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• 제47권6호
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• pp.694-705
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• 2023

Panax ginseng Meyer is a traditional Chinese medicine that is widely used as tonic in Asia. The main pharmacologically active components of ginseng are the dammarane-type ginsenosides, which have been shown to have anti-cancer, anti-inflammatory, immunoregulatory, neuroprotective, and metabolic regulatory activities. Moreover, some of ginsenosides (eg, Rh2 and Rg3) have been developed into nutraceuticals. However, the utilization of ginsenosides in clinic is restrictive due to poor permeability in cells and low bioavailability in human body. Obviously, the dammarane skeleton and glycosyls of ginsenosides are responsible for these limitations. Therefore, improving the oral bioavailability of ginsenosides has become a pressing issue. Here, based on the structures of ginsenosides, we summarized the understanding of the factors affecting the oral bioavailability of ginsenosides, introduced the methods to enhance the oral bioavailability and proposed the future perspectives on improving the oral bioavailability of ginsenosides.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• 한국재료학회지
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• 제8권10호
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• pp.918-924
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• 1998

본 연구는 티타늄과 활성탄소 원료분말을 반응밀링법에 의해 합성시, 밀링시간에 따른 Ti-TiC 복합재료의 미세조직과 기계적 성질에 미치는 TiC vol.% 및 열간압축성형온도의 영향에 관해 조사하였다. 티타늄과 활성 탄소 원료분말을 300시간 밀링 후 $5\mu\textrm{m}$이하의 미세한 구형의 Ti-TiC복합분말을 생성시킬 수 있었다. 반응밀링된 분말을 $1000^{\circ}C$이상에서 1시간동안 진공열간압축성형한 경우 이론밀도의 98%에 가까운 우수한 성형체를 얻었으며, TiC입자가 티타늄 기지 전반에 걸쳐 고르게 분산되어 Ti-TiC 복합재료의 기계적 특성을 향상시켰다. Ti-TiC복합재료의 고온안정성을 고찰하기 위해 $600^{\circ}C$등온열처리한 결과 80시간까지는 경도의 큰 변화없이 열적으로 안정하였다. Ti-20vol%TiC 복합재료를 $700^{\circ}C$에서 고온압축시험을 한 경우 330MPa의 높은 항복강도값을 나타내었다.

• 한국재료학회지
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• 제20권6호
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• pp.312-318
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• 2010

Multilayer Poly methyl methacrylate (PMMA)/ Poly vinyl alcohol (PVA) bone plates were fabricated using electrospinning and in vitro investigations were carried out for pre-clinical biocompatibility studies. The initial cellular cytotoxicity of the methacrylate (PMMA)/ Poly vinyl alcohol (PVA) bone plates was measured by MTT (3-(4,5-dimethylthiazol-2-yl)-2,5-diphenyltetrazolium bromide) assay using fibroblast-like L-929 cells. Cellular adhesion and differentiation studies were carried out using osteoblast-like MG-63 cells. As simulated body fluid (SBF) contains the same ionic concentration of body fluid and any bioactive material tends to deposit bone-like apatite on the samples surfaces into the SBF, in vitro bioactivity of the multilayer bone plates were investigated using SBF. We also studied the internal organization and tensile strength of the multilayer PMMA/PVA bone plates using micro-computed topography (${\mu}$-CT) and universal testing instrument (UTI, Korea) respectively. The cellular cytotoxicity study with MTT confirmed that the cellular viability was 78 to 90% which indicates good cyto-compatibility. Scanning electron microscopic findings revealed a good attachment and adhesion phenomenon of MG-63 cells onto the surfaces of the samples. Cellular differentiation studies also showed that osteogenic differentiation was switched on in a timely manner and affirmed along with that of the control group. Bone-like apatite formation on the surfaces was confirmed within 14 days of SBF incubation. Initial organizations of the multilayer PMMA/PVA bone plates were characterized as dense and uniform. The tensile strength of the post-pressing electronspun mat was higher than that of the pre-electronspun mat. These results suggest that a multilayer PMMA/PVA bone plate system is biocompatible, bioactive and a very good alternative bone plate system.

• 한국재료학회지
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• 제26권12호
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• pp.751-756
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• 2016

Graphite was diffusion-bonded by hot-pressing to W-25Re alloy using a Ti interlayer. For the joining, a uniaxial pressure of 25 MPa was applied at $1600^{\circ}C$ for 2 hrs in an argon atmosphere with a heating rate of $10^{\circ}C\;min^{-1}$. The interfacial microstructure and elemental distribution of the W-25Re/Ti/Graphite joints were analyzed by scanning electron microscopy (SEM). Hot-pressed joints appeared to form a stable interlayer without any micro-cracking, pores, or defects. To investigate the high-temperature stability of the W-25Re/Ti/Graphite joint, an oxy-acetylene torch test was conducted for 30 seconds with oxygen and acetylene at a 1.3:1 ratio. Cross-sectional analysis of the joint was performed to compare the thickness of the oxide layer and its chemical composition. The thickness of W-25Re changed from 250 to $20{\mu}m$. In the elemental analysis, a high fraction of rhenium was detected at the surface oxidation layer of W-25Re, while the W-25Re matrix was found to maintain the initial weight ratio. Tungsten was first reacted with oxygen at a torch temperature over $2500^{\circ}C$ to form a tungsten oxide layer on the surface of W-25Re. Then, the remaining rhenium was subsequently reacted with oxygen to form rhenium oxide. The interfacial microstructure of the Ti-containing interlayer was stable after the torch test at a temperature over $2500^{\circ}C$.

• Composites Research
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• 제18권3호
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• pp.21-30
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• 2005

고온진공간압 성형기술 및 포일-섬유-포일 방식을 이용하여 티타늄금속기 복합재료를 개발하였다. 이와 관련하여 강화공정 전후의 비균질 미시조직의 변화를 관측하였으며 공정 진행에 따른 충진거동도 함께 비교분석하였다. 결과에서 알 수 있듯이 강화공정 동안 섬유의 분포 형태에 따라 등축 $\alpha$, transformed $\beta$ 및$ Widmanst\ddot{a}tten$ $\alpha$ 등 상당한 미시조직의 변화가 확인되었다. 공정 진행에 따른 미시조직의 변화는 따라서 변형에 대한 기지재료의 불균일 정도와 관련한 결정립성장 및 재결정과 같은 변형기구들로 설명할 수 있었다. 이와 같은 변형기구 해석을 바탕으로 공정에 따른 기공의 충진 정도와 조직의 변화를 예측하기 위한 미시역학적 구성방정식이 개발되었으며, 또한 유한요소 해석을 통해 실공정 과정을 보다 정밀하게 예측할 수 있었다.

• 한국분말재료학회지
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• 제27권4호
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• pp.311-317
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• 2020

In this study, the effects of Co content on the microstructure and Charpy impact properties of Fe-Cr-W ferritic/martensitic oxide dispersion strengthened (F/M ODS) steels are investigated. F/M ODS steels with 0-5 wt% Co are fabricated by mechanical alloying, followed by hot isostatic pressing, hot-rolling, and normalizing/tempering heat treatment. All the steels commonly exhibit two-phase microstructures consisting of ferrite and tempered martensite. The volume fraction of ferrite increases with the increase in the Co content, since the Co element considerably lowers the hardenability of the F/M ODS steel. Despite the lowest volume fraction of tempered martensite, the F/M ODS steel with 5 wt% Co shows the highest micro-Vickers hardness, owing to the solid solution-hardening effect of the alloyed Co. The high hardness of the steel improves the resistance to fracture initiation, thereby resulting in the enhanced fracture initiation energy in a Charpy impact test at - 40℃. Furthermore, the addition of Co suppresses the formation of coarse oxide inclusions in the F/M ODS steel, while simultaneously providing a high resistance to fracture propagation. Owing to these combined effects of Co, the Charpy impact energy of the F/M ODS steel increases gradually with the increase in the Co content.