• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.10
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• pp.112-118
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• 2021

In this study, an inspection method using a color image is proposed to conduct a real-time inspection of covalent organic framework (COF) films to detect defects, if any. The COF film consists of an upper pattern SR and a lower PI. The proposed system detects the defects of more than 20 ㎛ on the SR surface owing to the characteristics of the pattern, whereas on the PI surface, it detects defects of more than 4 ㎛ by utilizing a micro-optical system. In the existing system, it is difficult for the operator to conduct a full inspection through a high-performance microscope. The proposed inspection algorithm performs the inspection by separating each color component using the color contrast of the pattern on the SR side, and on the PI surface it inspects the bonding state of the mounted chip. As a result, it is possible to confirm the exact location of the defects through the SR and PI surface inspections in the implemented inspection.

• Polymer(Korea)
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• v.34 no.5
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• pp.450-453
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• 2010

The electrical/optical properties and surface structures of polypyrrole (PPy) thin films, which were prepared by liquid phase polymerization (LPP) and vapor phase polymerization (VPP) of pyrrole using FTS as an initiatior are compared. The PPy thin film prepared by VPP showed superior surface resistance characteristics as compared with that prepared by LPP. We investigated the relation between surface morphology of PPy film and surface resistance by surface characteristic analysis. The surface of PPy thin film prepared by VPP was smoother than that prepared by LPP. Micro-patterned PPy thin film could be prepared effectively using VPP-combined ink-jet printing and soft lithography.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.4
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• pp.134-140
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• 2009

The feasibility of electrochemical drilling and milling on stainless steel are investigated using tungsten microelectrode with $10{\mu}m$ in diameter. For the development of environmentally friendly and safe electrochemical process, citric acid solution is used as electrolyte. A few hundred nanoseconds duration pulses are applied between the microelectrode and work material for dissolution localization. Tool fracture by Joule heating, micro welding, capillary phenomenon, tool wandering by the generated bubbles are observed and their effects on micro ECM are discussed. Occasionally, complex textures including micro pitting corrosion marks appeared on the hole inner surface. Metal growth is also observed under the weak electric conditions and it hinders further dissolutions for workpiece penetration. By adjusting appropriate pulse and chemical conditions, micro holes of $37{\mu}m$ in diameter with $100{\mu}m$ in depth and 26Jim in diameter with $50{\mu}m$ in depth are drilled on stainless steel 304. Also, micro grooves with $18{\mu}m$ width and complex micro hand pattern are machined by electrochemical milling.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.113-113
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• 2011

알루미늄 박막 커패시터 제작을 위해 선택적인 알루미늄 etching과 anodizing을 이용한 유전체($Al_2O_3$) 형성, 전극층 형성을 위한 무전해 Ni-P 도금을 진행하였다. $5{\mu}m$ patterns/$10{\mu}m$ space를 가지는 dot patterns을 알루미늄 기판에 patterning하고, 이를 각각의 전류밀도 조건에서 etching한 후, barrier type anodizing을 진행하였다. 유전체에 전극층은 무전해 Ni-P 도금을 통해 형성하였으며, 이렇게 제작된 알루미늄 박막 커패시터 특성을 평가하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.76-76
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• 2007

Several kinds of photo-chromic polymers containing push-pull structure were synthesized and investigated on optical patterning by photo-induced surface relief gratings (SRG) technique. The azobenzene segment was introduced as a functional group for a photo-triggered tran-cis isomerization. Consequently, we have fabricated micro-size regular pattern by one-step process without photo-mask.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.1
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• pp.129-137
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• 2000

In this paper, a new method of noncontact measurement has been developed for a 3 dimensional topography in semiconductor wafer, implementing a new optical probe based on the precision defocus measurement. The developed technique consists of the new optical probe, precision stages, and the measurement/control system. The basic principle of the technique is to use the reflected slit beam from the specimen surface, and to measure the deviation of the specimen surface. The defocusing distance can be measured by the reflected slit beam, where the defocused image is measured by the proposed optical probe, giving very high resolution. The distance measuring formula has been proposed for the developed probe, using the laws of geometric optics. The precision calibration technique has been applied, giving about 10 nanometer resolution and 72 nanometer of four sigma uncertainty. In order to quantitize the micro pattern in the specimen surface, some efficient analysis algorithms have been developed to analyse the 3D topography pattern and some parameters of the surface. The developed system has been successfully applied to measure the wafer surface, demonstrating the line scanning feature and excellent 3 dimensional measurement capability.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.11
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• pp.186-194
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• 2004

In this research, microfabrication technique using localized electrochemical deposition (LECD) with ultra short pulses is presented. Electric field is localized near the tool tip end region by applying a few hundreds of nano second pulses. Pt-Ir tip is used as a counter electrode and copper is deposited on the copper substrate in 0.5 M CuSO$_4$ and 0.5 M H$_2$SO$_4$ electrolyte. The effectiveness of this technique is verified by comparison with LECD using DC voltage. The deposition characteristics such as size, shape, surface, and structural density according to applied voltage and pulse duration are investigated. The proper condition is selected from the results of the experiments. Micro columns less than 10 $\mu$m in diameter are fabricated using this technique. The real 3D micro structures such as micro pattern and micro spring can be fabricated by this method. It is suggested that presented method can be used as an easy and inexpensive method for fabrication of microstructure with complex shape.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.7
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• pp.991-996
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• 2002

This paper presents the fabrication method of a micro-riblet film (MRF) using MEMS technology and the experimental results of the drag reduction of an airfoil with MRFs. Riblets having grooved surface in the streamwise direction has been proven as an effective passive control technique of the drag reduction. A V-grooved pattern on (100) silicon wafer is etched with anisotropic bulk micromachining. The MRF is completed by replicating the V-grooved pattern with polydimethylsiloxane (PDMS). Experiments were performed by measuring a velocity field behind the trailing edge of a NACA 0012 airfoil with and without MRFs in a closed-type subsonic wind tunnel using particle image velocimetry (PlV) technique. The MRF provides about 3.8 % drag reduction compared to the drag on a smooth airfoil when the freestream velocity of wind tunnel is 3.3 m/s.

• Korean Journal of Materials Research
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• v.30 no.7
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• pp.327-332
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• 2020

Laser induced surface activation (LISA) technology requires refined selection of process variables to fabricate conductive microcircuits on a general polymer material. Among the process variables, laser mode is one of the crucial factors to make a reliable conductor pattern. Here we compare the continuous wave (CW) laser mode with the pulse wave (PW) laser mode through determination of the surface roughness and circuit accuracy. In the CW laser mode, the surface roughness is pronounced during the implementation of the conductive circuit, which results in uneven plating. In the PW laser mode, the surface is relatively smooth and uniform, and the formed conductive circuit layer has few defects with excellent adhesion to the polymer material. As a result of a change of laser mode from CW to PW, the value of Ra of the polymer material decreases from 0.6 ㎛ to 0.2 ㎛; the value of Ra after the plating process decreases from 0.8 ㎛ to 0.4 ㎛, and a tight bonding force between the polymer source material and the conductive copper plating layer is achieved. In conclusion, this study shows that the PW laser process yields an excellent conductive circuit on a polymeric material.

• Korean Journal of Optics and Photonics
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• v.21 no.2
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• pp.61-68
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• 2010

Optical simulation methods were applied to the edge-lit LED backlight for LCD TV applications in order to optimize the optical structure of the light guide plate(LGP), and thus to improve the uniformity properties by removing the bright spots caused by LED's. The edge-lit LED backlight consisted of three white LED's with a lamp cover, a light guide plate, and a reflection film. When there was no pattern on the entrance side surface of the LGP, the illuminance uniformity was sensitively dependent on the distance d between the LED and the entrance surface. The illuminance uniformity increased with d but its increasing rate slowed down when d was beyond ~ 1.5 mm. When micro-patterns such as a lenticular lens array (LLA) or a serration pattern were formed on the entrance surface, the illuminance uniformity was improved substantially even for the case of very small d. At the same simulation condition, the lightguide with serration pattern showed a better uniformity than that with LLA pattern. Additional improvement could be achieved by changing the refractive index of the micro-patterns. These results suggest that using micro-patterns is a very effective way to reduce the bright spots due to their refracting function for the concentrated incident rays onto the LGP.