Abstract
In this study, an inspection method using a color image is proposed to conduct a real-time inspection of covalent organic framework (COF) films to detect defects, if any. The COF film consists of an upper pattern SR and a lower PI. The proposed system detects the defects of more than 20 ㎛ on the SR surface owing to the characteristics of the pattern, whereas on the PI surface, it detects defects of more than 4 ㎛ by utilizing a micro-optical system. In the existing system, it is difficult for the operator to conduct a full inspection through a high-performance microscope. The proposed inspection algorithm performs the inspection by separating each color component using the color contrast of the pattern on the SR side, and on the PI surface it inspects the bonding state of the mounted chip. As a result, it is possible to confirm the exact location of the defects through the SR and PI surface inspections in the implemented inspection.