• IMMUNE NETWORK
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• v.5 no.4
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• pp.205-214
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• 2005

Background: We examined global gene expression profiles of peripheral blood mononuclear cells (PBMCs) in patients with ulcerative colitis (DC), and tested whether the identified genes with the altered expression might be associated with susceptibility to UC. Methods: PBMCs from 8 UC and 8 normal healthy (NH) volunteers were collected, and total RNAs were subjected to the human 8.0K cDNA chip for the micro array analysis. Real time-PCR (RT-PCR) was performed to verify the results of micro array. One hundred forty UC patients and 300 NH controls were recruited for single nucleotide polymorphism (SNP) analysis. Results: Twenty-five immune function-related genes with over 2-fold expression were identified. Of these genes, two chemokines, namely, CXCL1 and CCL20, were selected because of their potential importance in the evocation of host innate and adaptive immunity. Four SNPs were identified in the promoter and coding regions of CXCL1, while there was no significant difference between all patients with UC and controls in their polymorphisms, except minor association at g.57A>G (rs2071425, p=0.02). On the other hand, among three novel and one known SNPs identified in the promoter region of CCL20, g. -1,706 G>A (p=0.000000055), g. -1,458 G>A (p=0.0048), and g. -962C>A (p=0.0006) were found to be significantly associated with the susceptibility of Uc. Conclusion: Altered gene expression in mononuclear cells may contribute to IBD pathogenesis. Although the findings need to be confirmed in other populations with larger numbers of patients, the current results demonstrated that polymorphisms in the promoter region of CCL20 are positively associated with the development of Uc.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.6
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• pp.105-113
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• 2013

In this paper a micro solar energy harvesting system with MPPT(Maximum Power Point Tracking) control using a miniature PV(photovoltaic) cell of which the output is less than 0.5V is proposed. The MPPT control is implemented using linear relationship between the open-circuit voltage of a PV cell and its MPP(Maximum Power Point) voltage such that a pilot PV cell can track the MPP of the main PV cell in real time. The proposed circuit is designed in 0.18um CMOS process. The designed chip area is $900um{\times}1370um$ including a load charge pump and pads. Measured results show that the designed system can track the MPP voltage changes with variations of light intensity. The designed circuit with MPPT control delivers MPP voltages to load even though the load is heavy such that it can supply more power when the MPPT control is applied. The proposed circuit does not require any precharged battery resulting in more suitability for miniaturized self-powered systems compared to the existing works.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2014.10a
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• pp.581-584
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• 2014

In this paper, a micro-scale photovoltaic(PV) energy harvesting system is proposed where an MPPT(Maximum Power Point Tracking) control is implemented using an energy distribution technique. Miniature PV cells output very low energy and low voltages, and thus, they cannot be used to directly power the MPPT controller. In the proposed system, a start-up circuit boosts an internal Vcp, and the boosted Vcp is used to operate the internal MPPT control block. When the Vcp reaches a predefined value, a detector circuit makes the start-up block turn off and provide a power converter with the energy from the PV cell. When the Vcp decreases such that the MPPT controller can not be operated, the energy transferred to the power converter is blocked and the start-up circuit is reactivated. In this way, the MPPT function is achieved by alternately operating the start-up circuit and the power converter using the energy distribution technique, and the harvested energy is transferred to a load through a PMU(Power Management Unit). The proposed circuit is designed in a 0.35um CMOS process and its functionality has been verified through extensive simulations. The designed chip area including pads is $1430um{\times}1110um$.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.71-79
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• 2021

In this study, we have successfully fabricated the Sn-Ni paste and evaluated the bonding properties for high-temperature endurable EV (Electric Vehicle) power module applications. From evaluating of the micro-structural changes in the TLPS (Transient Liquid Phase Sintering) joints with Sn and Ni contents in the Sn-Ni pastes, a lack of Ni powders and Ni particle agglomerations by Ni surplus were observed in the Sn-20Ni and Sn-50Ni joints (in wt.%), respectively. In contrast, relatively dense microstructures are observed in the Sn-30Ni and Sn-40Ni TLPS joints. From differential scanning calorimetry (DSC) thermal analysis results of the fabricated Sn-Ni paste and TLPS bonded joints, we confirmed that the complete reactions of Sn with Ni to form Ni-Sn intermetallic compounds (IMCs) at bonding temperatures occurred, and there is no remaining Sn in the joints after TLPS bonding. In addition, the interfacial reactions and IMC phase changes of the Sn-30Ni joints under various bonding temperatures were reported, and their mechanical shear strength were investigated. The TLPS bonded joints were mainly composed of residual Ni particles and Ni₃Sn₄ intermetallic phase. The average shear strength tended to increase with increasing bonding temperature. Our results indicated a high shear strength value of approximately 30 MPa at a bonding temperature of 270 ℃ and a bonding time of 30 min.

• ETRI Journal
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• v.38 no.4
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• pp.665-674
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• 2016

We designed and fabricated a semiconductor optical amplifier-integrated dual-mode laser (SOA-DML) as a compact and widely tunable continuous-wave terahertz (CW THz) beat source, and a pin-photodiode (pin-PD) integrated with a log-periodic planar antenna as a CW THz emitter. The SOA-DML chip consists of two distributed feedback lasers, a phase section for a tunable beat source, an amplifier, and a tapered spot-size converter for high output power and fiber-coupling efficiency. The SOA-DML module exhibits an output power of more than 15 dBm and clear four-wave mixing throughout the entire tuning range. Using integrated micro-heaters, we were able to tune the optical beat frequency from 380 GHz to 1,120 GHz. In addition, the effect of benzocyclobutene polymer in the antenna design of a pin-PD was considered. Furthermore, a dual active photodiode (PD) for high output power was designed, resulting in a 1.7-fold increase in efficiency compared with a single active PD at 220 GHz. Finally, herein we successfully show the feasibility of the CW THz system by demonstrating THz frequency-domain spectroscopy of an ${\alpha}$-lactose pellet using the modularized SOA-DML and a PD emitter.

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.956-959
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• 2004

Recently the monitoring system of tool setting in high speed precision machining center is required for manufacturing products that have highly complex and small shape, high precision and high function. It is very important to reduce time to setup tool in order to improve the machining precision and the productivity and to protect the breakage of cutting tool as the shape of product is smaller and more complex. Generally, the combination of errors that geometrical clamping error of fixing tool at the spindle of machining tool and the asynchronized error of driving mechanism causes that the run-out of tool reaches to 3$^{\sim}$20 times of the thickness of cutting chip. And also the run-out is occurred by the misalignment between axis of tool shank and axis of spindle and spindle bearing in high speed rotation. Generally, high speed machining is considered when the rotating speed is more than 8,000 rpm. At that time, the life time of tool is reduced to about 50% and the roughness of machining surface is worse as the run-out is increased to 10 micron. The life time of tool could be increased by making monitoring of tool-setup easy, quick and precise in high speed machining tool. This means the consumption of tool is much more reduced. And also it reduces the manufacturing cost and increases the productivity by reducing the tool-setup time of operator. In this study, in order to establish the concept of tool-setup monitoring the measuring method of the geometrical error of tool system is studied when the spindle is stopped. And also the measuring method of run-out, dynamic error of tool system, is studied when the spindle is rotated in 8,000${\sim}$60,000 rpm. The dynamic phenomena of tool-setup are analyzed by implementing the monitoring system of rotating tool system and the non-contact measuring system of micro displacement in high speed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.1066-1069
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• 2004

Recently the monitoring system of tool setup in high speed precision machining tool is required for manufacturing products that have highly complex and small shape, high precision and high function. It is very important to reduce time to setup tool in order to improve the machining precision and productivity and to protect the breakage of cutting tool as the shape of product is smaller and more complex. Generally, the combination of errors that geometrical clamping error of fixing tool at the spindle of machining center and the asynchronized error of driving mechanism causes that the run-out of tool reaches to 3∼20 times of the thickness of cutting chip. And also the run-out is occurred by the misalignment between axis of tool shank and axis of spindle and spindle bearing in high speed rotation. Generally, high speed machining is considered when the rotating speed is more than 8,000 rpm. At that time, the life time of tool is reduced to about 50％ and the roughness of machining surface is worse as the run-out is increased to 10 micron. The life time of tool could be increased by making monitoring of tool-setting easy, quick and precise in high speed machining center. This means the consumption of tool is much more reduced. And also it reduces the manufacturing cost and increases the productivity by reducing the tool-setup time of operator. In this study, in order to establish the concept of tool-setting monitoring the measuring method of the geometrical error of tool system is studied when the spindle is stopped. And also the measuring method of run-out, dynamic error of tool system, is studied when the spindle is rotated in 8,000 ∼ 60,000 rpm. The dynamic phenomena of tool-setup is analyzed by implementing the monitoring system of rotating tool system and the noncontact measuring system of micro displacement in high speed.

• Proceedings of KOSOMES biannual meeting
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• 2005.11a
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• pp.197-202
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• 2005

Generally, a semiconductor chip measured with a few micro units is captured by line scan camera for higher inspection accuracy. However, the faulty inspection requires an exact boundary detection algorithm because it is very sensitive to scan speed and lighting conditions. In this paper we propose boundary detection using subpixel edge detection method in order to increase the accuracy of bump faulty detection on chips. The bump edge is detected by first derivative to four directions from bump center point and the exact edge positions are searched by the subpixel method. Also, the exact bump boundary to calculate the actual bump size is computed by LSM(Least Squares Method) to minimize errors since the bump size is varied such as bump protrusion, bump bridge, and bump discoloration. Experimental results exhibit that the proposed algorithm shows large improvement comparable to the other conventional boundary detection algorithms.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.39 no.1
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• pp.7-15
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• 2002

This paper is concerned with remote environment monitoring & control for the breeding house as scattering far and wide. The environment data is detected in the breeding house that is collected to one processor. It's adapted to the PSTN(public switch tele-phone network) and multi-processing for exchange the environment data and the control data in between the manager and a breeding house by micro-processor. We have designed the algorithm of the communication sequence through the experimental research. This system is composed of sensor interface, FSK communications, LED display, data latch and MCS-51 single-chip. The S/W is composed with data acquisition by multi-processing, data communication and interrupt. And this paper is Proposed the DB structure algorithm concern to a mount scale using web design. The subject is a performance of effective management for the breeding house.