• Title/Summary/Keyword: metalorganic deposition

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High indium incorporation in the growth of InGaAs on (100) GaAs by precursor alternating metalorganic chemical vapor deposition (Precursor alternating metalorganic chemical vapor deposition에 의한 (100) GaAs 기판위로의 InGaAs 성장시의 높은 indium 유입)

  • 정동근
    • Journal of the Korean Vacuum Society
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    • v.5 no.4
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    • pp.354-358
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    • 1996
  • High indium incorporation was observed in InGaAs growth by precursor alternating metalorganic chemical vapor deposition (PAMOCVD). A possible mechanism of high indium incorporation into the crystal in PAMOCVD was proposed by considering the decomposition products of gallium and indium precursors, and thus the different adsorption behavior of the decomposed precursor molecules.

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Deposition of Piezoelectric PZT(53/47) Film by Metalorganic Decomposition for Micro electro mechanical Device (Microelectromechnical system 소자 제작을 위한 유기금속분해법에 의한 압전성 PZT(53/47)박막의 증착)

  • 윤영수;정형진;신영화
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.6
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    • pp.458-464
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    • 1998
  • This paper gives characterization of substrate and PZT(53/47) thin film deposited by metalorganic decomposition, which is concerned in deposition process and device fabrication process, to fabricate micro electro mechanical system (MEMS) device with piezoelectric material. The PZT thin films deposited by MOD at 700^{\circ}C$ for 30 minutes had a polycrystallinity, that is, no substrate dependence, while different interface were developed depending on the bottom electrodes. Such a structural variation could influence on not only the properties of the PZT film but also etching process for fabricating MEMS devices. Therefore the electrode structure is a very important factor in the deposition of the PZT film during etching process by HF acid for MEMS device with piezoelectric material. Piezoelectric coefficients of the PZT films on the different substrates were 40 and 80 pm/V at an applied voltage of 4V. Based in these results, it was possible for deposition of the PZT film by MOD to apply MEMS device fabrication process based on piezoelectricity after selection of proper bottom electrode.

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Characterization of SrRuO3 Conducting Thin Films Grown on p-Si (100) Substrates by Metalorganic Chemical Vapor Deposition

  • Cuong Nguyen Duy;Yoon, Soon-Gil
    • Transactions on Electrical and Electronic Materials
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    • v.6 no.1
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    • pp.14-17
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    • 2005
  • The SrRuO_{3}$ films for application of the bottom electrode were deposited on p-Si (001) substrates by metalorganic chemical vapor deposition (MOCVD). The films are characterized by various deposition parameters. The optimum deposition condition for SRO films is the deposition temperature of $500{\circ}C$, Sr/Ru input mol ratio of 1.0, and a flow rate of precursors of 15 ml/h. The films deposited by an optimum condition exhibited a single phase of SrRuO_{3}$, an rms roughness of 8 nm, and a resistivity of approximately $900{\mu}{\Omega}{\cdot}cm$. The high resistivity of the films for application of a bottom electrode should be improved through a characterization of an interface.

Onset on the Rate Limiting Factors of InP Film Deposition in Horizontal MOCVD Reactor (수평형 MOCVD 반응기 내의 InP 필름성장 제어인자에 대한 영향 평가)

  • Im, Ik-Tae;Sugiyama, Masakazu;Nakano, Yoshiyaki;Shimogaki, Yukihiro
    • Proceedings of the KSME Conference
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    • 2003.11a
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    • pp.73-78
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    • 2003
  • The InP thin films grown by metalorganic chemical vapor deposition (MOCVD) are widely used to optoelectronic devices such as laser diodes, wave-guides and optical modulators. Effects of various parameters controlling film growth rate such as gas-phase reaction rate constant, surface reaction rate constant and mass diffusivity are numerically investigated. Results show that at the upstream region where film growth rate increases with the flow direction, diffusion including thermal diffusion plays an important role. At the downstream region where the growth rate decreases with flow direction, film deposition mechanism is revealed as a mass-transport limited. Mass transport characteristics are also studied using systematic analyses.

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Deposition of $CeO_2$ buffer layer for YBCO coated conductors on biaxially textured Ni substrate by MOCVD technique (양축 정렬된 Ni기판 위에 MOCVD법에 의한 YBCO 초전도 선재용 $CeO_2$ 완충층의 증착)

  • 김호진;주진호;전병혁;정충환;박순동;박해웅;홍계원;김찬중
    • Progress in Superconductivity and Cryogenics
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    • v.4 no.2
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    • pp.21-26
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    • 2002
  • Textured CeO2 buffer layers for YBCO coated conductors were deposited on biaxially textured Ni substrate by metalorganic chemical vapor deposition (MOCVD). The degree of texture of deposited $CeO_2$ films was strong1y dependent on the deposition temperature (Td) and oxygen Partial Pressure(PO2). ($\ell$00) textured $CeO_2$ films were well deposited at T=500~52$0^{\circ}C$. PO2=0.90~3.33 Torr. The surface morphology showed that the films consisted of columnar CeO2 films grown from the Ni substrates. The root mean square roughness of CeO$_2$ films estimated by atomic force microscopy(AFM) increased as the deposition temperature(Td) increa- sed. The growth rate of the $CeO_2$ films deposited at T=52$0^{\circ}C$ and PO2=2.30 Torr was 150~200 nm/min that was much faster than that of other Physical deposition methods.

Characteristics of (Ba,Sr)RuO$_3$Bottom Electrodes by Liquid Delivery Metalorganic Chemical Vapor Deposition (액체 운반 유기 금속 화학 기상 증착법에 의한 $(Ba,Sr)RuO_3$ 하부전극의 특성)

  • Choe, Eun-Seok;Yun, Sun-Gil
    • Korean Journal of Materials Research
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    • v.11 no.11
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    • pp.997-1000
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    • 2001
  • Conducting perovskite oxide, $(Ba,Sr)RuO_3(BSR)$, which has many advantages for $(Ba,Sr)TiO_3(BST)$ due to their similarity in crystal structure, lattice constant and chemical composition, was prepared on n-type Si (100) by liquid delivery metalorganic chemical vapor deposition(LDMOCVD). The deposition characteristics of BSR were controlled by gas-phase mass-transfer in the experiment. The BSR films deposited at 50$0^{\circ}C$ and oxygen flow rate of 100 sccm(standard cc/min) showed an average roughness of 22 $\AA$and resistivity of 810 $\mu$$\Omega$-cm. The roughness of BSR films with oxygen flow rate showed a close relationship with the resistivity of films. BSR (110) peak shifted toward lower Bragg angle with increase of x in the$(Ba_x,Sr_{1-x})TiO_3$. The resistivity of BSR films increased from 810 to 924 $\mu$$\Omega$-cm with increase of Ba content(x).

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Metalorganic Chemical Vapor Deposition of $Ga_2O_3$ Thin Films Using Dimethylgallium Isopropoxide and $O_2$

  • U, Jeong-Jun;Park, Yeong-Su;Lee, Hui-Ju;Jeon, Du-Jin;Kim, Geon-Hui;Kim, Yun-Su
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.195-195
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    • 2010
  • $Ga_2O_3$ thin films have been grown on Si(001) substrates by metalorganic chemical vapor deposition (MOCVD) using dimethylgallium isopropoxide ($Me_2GaO^iPr$, DMGIP) with oxygen as the reactant gas. Suitability of the precursor for CVD was confirmed by thermogravimetric analysis (TGA) and vapor pressure measurement. Deposition was carried out in the substrate temperature range $450-650^{\circ}C$. Spectroscopic ellipsometry, X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS) and Rutherford back-scattering spectroscopy (RBS) were used to determine the thickness, crystallinity, and composition and stoichiometry of the films, respectively. From the slope of the Arrhenius plot in the temperature range $500-550^{\circ}C$, the activation energy of deposition was found to be $225.5\;kJ\;mol^{-1}$. As-deposited films were amorphous, but the monoclinic $\beta-Ga_2O_3$ phase was revealed after annealing the films in air at $1050^{\circ}C$. The XPS and RBS analyses indicate that the $Ga_2O_3$ films obtained by using DMGIP were found to be almost stoichiometric.

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Dielectric properties of Pr$_2$O$_3$ high-k films grown by metalorganic chemical vapor deposition on silicon

  • Nigro, Raffaella-Lo;Vito Raineri;Corrado Bongiomo
    • Electrical & Electronic Materials
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    • v.16 no.9
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    • pp.65.2-65
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    • 2003
  • Praseodymium oxid ($Pr_2$$O_3$) thin films have been deposited on Si(100) substrates by metalorganic chemical vapor deposition using praseodymium tris-2,2,6,6-tetramethyl-3,5-heptandionate as source material. Film structural, morphological, and compositional characterizations have been carried out. Dielectric properties have been studied as well by capacitance-voltage and current-voltage measurements on metal-oxide-semiconductor capacitors of several areas. The $Pr_2$$O_3$ films have shown a dielectric constant = 23-25 and a leakage current density of $8.8{\times}10$-e $A/\textrm{mm}^2$ at +1 V.

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