• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.4
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• pp.104-112
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• 2017

In the sand casting process, the flow of liquid metal affects the quality of casting products and their die life. To determine the optimal bush part design process, this study performed various analyses using commercial finite element analysis S/W. The simulation focused on the molten metal behaviors during the mold filling and solidification stages of sand casting. This study aims to develop methods to reduce the cost and increase the tool life of the continuous hot zinc plating roll.

• Carbon letters
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• v.5 no.4
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• pp.186-190
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• 2004

In this work, a nickel metal (Ni) electroplating on the activated carbon fiber (Ni/ACFs) surfaces was carried out to remove the toxic hydrogen chloride (HCl) gas. The surface properties of the treated ACFs were determined by using nitrogen adsorption isotherms at 77 K, SEM, and X-ray diffraction (XRD) measurements. HCl removal efficiency was confirmed by a gas-detecting tube technique. As a result, the nickel metal contents on the ACF surfaces were increased with increasing the plating time. And, it was found that the specific surface area or the micropore volume of the ACFs studied was slightly decreased as increasing the plating time. Whereas, it was revealed that the HCl removal efficiency containing nickel metal showed higher efficiency values than that of untreated ACFs. These results indicated that the presence of nickel metal on the ACF surfaces played an important role in improving the HCl removal over the Ni/ACFs, due to the catalytic reactions between nickel and chlorine.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.604-605
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• 2006

Recently the Marangoni convention is supposed to be an important phenomenon that significantly affects the solidification. For understanding the Marangoni convection mechanism, visualizing the convention phenomenon of molten tin with ultrasonic has been conducted. This paper reports developing a tracer material of micro metal balloon that is used in the molten system. We have succeeded in coating the surface of Shirasu-ballons with nickel by plating process. The obtained metal balloon is spherical and some characterizations were conducted.

• Resources Recycling
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• v.10 no.3
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• pp.23-28
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• 2001

Zinc ion could be recovered from metal plating wastewater with the spent iron oxide catalyst which was used in the plant of Styrene Monomer(SM) production. The zinc was recovered more than 98.7% at higher than pH 2.0. The saturation magnetization of the spent catalyst is enough high as 59.4 emu/g to apply in the solid-liquid separation after treating the wastewater. The mechanism of zinc recovery with the iron oxide catalyst could be a electro-chemical adsorption at pH 3.0~8.5, and a precipitation as $Zn(OH)_2$ at higher than pH 8.5.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.11
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• pp.1538-1544
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• 2014

In recent years, The electronic and energy industries demand low power consumption and high efficiency, so under their demands, the white goods industries which are represented for refrigerator and air conditioner system be implemented energy-saving power suppling structure with inverter control system. As inverter control system is different from step control type, when switching system is optimizing temperature control during short period, the inrush plus current can be flown in the circuit. In despite of these characteristics, there is no fuse which can be applied to this type until now. For this reason, we suggest the method of manufacturing protector in the high efficient inverter control system using the alumina-based ceramic radiated heat characteristics and metal films laminated plating. And through the evaluating electrical characteristics, we make a possible to utilize the method when designing overall fuses.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.123.1-123.1
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• 2017

Hybrid solar cells have intensively studied in recent years due to their advantages such as cost effectiveness and possibility of applications in flexible and transparent devices. It is critical to fabricate individual layer composed of organic and inorganic materials in the hybrid solar cell at low cost. Therefore, it is required to manufacture cheaply and enhance the photon-to-electricity conversion efficiency of each layer in the flexible solar cell industry. In this research, we fabricated pure Cu metal mesh electrode prepared by using electroplating and/or electroless plating on the Ni mold which was manufacture through photolithography, electroforming, and polishing process. Copper mesh was formed on the surface of nickel metal working master when pulsed electrolytic copper deposition were performed at various plating parameters such as plating time, current density, and so on. After electrodeposition at 2ASD for 5~30seconds, the line/pitch/thickness of copper mesh sheet was $1.8{\sim}2.0/298/0.5{\mu}m$.

• Corrosion Science and Technology
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• v.4 no.6
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• pp.222-225
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• 2005

The adhesion strength of metal plating on PC was studied. In this study, surface was treated by chemical agents or DBD(dielectric barrier discharge) plasma to imporve the adhesion. The surface roughness, contact angle, gloss of plating and adhesive strength were measured. Adhesion strengths of Ni plating on prepared PC by NaOH and KOH solution were $12.3kgf/cm^2$ and $7.5kgf/cm^2$, respectively. The highest adhesion strength was obtained in the plasma treated one, $27.8kgf/cm^2$.

• Transactions on Electrical and Electronic Materials
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• v.6 no.5
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• pp.225-228
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• 2005

In this work, we studied the optimized copper thickness in Cu ECP (Electrochemical Plating). In order to select an optimized Cu ECP thickness, we examined Cu ECP bulge (bump, hump or over-plating amount), Cu CMP dishing and electrical properties of via hole and line trench over dual damascene patterned wafers split into different ECP Cu thickness. In the aspect of bump and dishing, the bulge increased according as target plating thickness decreased. Dishing of edge was larger than center of wafer. Also in case of electrical property, metal line resistance distribution became broad gradually according as Cu ECP thickness decreased. In conclusion, at least $20\%$ reduced Cu ECP thickness from current baseline; $0.8\;{\mu}m$ and $1.0\;{\mu}m$ are suitable to be adopted as newly optimized Cu ECP thickness for local and intermediate layer.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.709-713
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• 1996

Mechanical solderless chip packaging with small gold bumps or metal balls has increased in the electronic devices. The preparation of conductive particles (5~7 $\mu\textrm{m}$ diamiter) by electroless nickel plating have been investigated. Generally, batch type electroless plating is applied to provide conductivity on the nonconductors. Since the surface areas of particles are much larger than the bulk substrate, accordingly the electroless plating bath becomes unstable. Thus, we applied the continuous dropping method for the preparation of conductive particles. The uniform coverage of deposited nickel on the particles was obtained by using ammonium acetate as a complexing agent, and surface coverage is further improved without coagulation of particles by the surface active agent treatment before enter the plating bath.

• Journal of the Korean institute of surface engineering
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• v.48 no.4
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• pp.149-157
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• 2015

We investigated the effects of the fabric structure or the kinds of plated metals on the electromagnetic interference shielding effectiveness (EMI SE) by means of electroless plating on polyester fabric. We found that the weight of deposited metal, EMI SE, and flexibility of the conductive fabric for EMI shield is affected by morphology of fabric and structure of fiber. The EMI SE of conductive fabric plated Ni/Cu/Ni by electroless plating method on draw textured yarn (DTY) polyester was in the practically useful range of above 70 dB over a wide frequency range of 10 MHz to 1.0 GHz at the surface resistivity of $0.05{\Omega}/{\square}$. Au or Ag plated conductive fabric by immersion plating method is not able to provide for a good EMI SE.