• 한국레이저가공학회지
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• 제2권3호
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• pp.52-61
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• 1999

The laser induced forward transfer(LIFT) technique employs a pulsed laser to transfer parts of a thin metal film from an optically transparent target onto an arbitrary substrate in close proximity to the metal film on the target. In this work, a two-step method, the combination of LIFT process, in which a Au film deposited on the $Al_2$O$_3$ substrate by Nd:YAG laser and subsequent Au electroless metal plating on the by LIFT process generated Au seed, was presented. The influence of laser parameters, wavelength, laser power, film thickness and overlap ratio of pulse tracks, on the shapes of deposit and conductor line after electroless plating is experimentally studied. As a results, the threshold power densities for ablation, deposition and metallization were determined and comparison of threshold value between the wave length 1064nm and the second harmonic generated 532nm. In odor to determine a possible application in the electronic industry, a smallest conduct spot size, line width and isolated line space were generated.

• 한국표면공학회지
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• 제15권1호
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• pp.24-38
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• 1982

The Objective of this study is to analyze structural and operational aspects of the govern-ment, its associations, industries and academic associations related to metal-plating industry, and thereby recommend ways of promotion of subsector, which is yet to be developed. Stages for the implementation are proposed as follows. 1) Stage One: Preparation for formation of proper atmosphere. ⅰ) Clearance of unlicenced metal-plating factories. ⅱ) Strengthening of functions of the association. ⅲ) Provision of incentives through the tax system. 2) Stage-Two : Modernization and maturity ⅰ) Introduction of system for indicating quality of products. ⅱ) Implementation of joint and cooperative-based programs ⅲ) Technical advancement of the closed system and anti-pollution treatment. 3) Stage Three : Settlement ⅰ) Systematic use of statistics and information. ⅱ) Standardization of quality of the products.

• 한국수소및신에너지학회논문집
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• 제27권3호
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• pp.306-310
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• 2016

In Na-base Battery for ESS, ${\alpha}-Al_2O_3$ and metal bonding was used to prevent direct reaction between electrolyte and electrode. The hard metal was metalized at $1600^{\circ}C$ in a flowing hydrogen gas for high bonding strength. In this study, instead of hard metal metalizing, Ni was plated on ${\alpha}-Al_2O_3$ by electroless Ni plating technique and then bonded with metal. To enhance the bonding strength, surface of ${\alpha}-Al_2O_3$ was treated with $H_3PO_4$. The effects of strength and leakage of joining as a function of acid treatment time on ${\alpha}-Al_2O_3$ are described.

• 한국표면공학회지
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• 제44권1호
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• pp.1-6
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• 2011

A NiW functional alloy plating was investigated as variables of metal ion concentration, complexing agent, temperature, pH and applied current density. Even if numerous studies on reaction mechanism of NiW induced codeposition were carried out during couples of decade, it has not been acceptable reaction mechanism. This study was focused on the effect of the plating variables on the alloy composition in the NiW alloy plating. Applied current density could control mainly the alloy composition rather than other plating variables. It has also been confirmed that the functional alloy plating such as layered or gradient plating was possible by controlling applied current density.

• Membrane and Water Treatment
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• 제11권3호
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• pp.201-206
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• 2020

Electrodialysis (ED) is used in wastewater treatment, during the processing and recovery of beneficial materials, to produce usable water. In this study, sulfate and chlorine ions, which are the anions majorly used for electroplating, were studied as factors affecting the recovery of copper, nickel and water from wastewater by electrodialysis. Although the removal rates of copper and nickel ions were slightly higher with the use of chlorine ions than of sulfate ions, the removal efficiencies were above 99.9% under all experimental conditions. The metal ions of the plating wastewater flowed through the ion exchange membrane of the diluate tank and the concentrate tank while all the water moved together due to electro-osmosis. The migration of water from the diluate tank to the concentrate tank was higher in the presence of a monovalent chloride ion compared to that of a divalent sulfate ion. When sulfate was the anion used, the recoveries of copper and nickel increased by about 25% and 30%, respectively, as compared to the chloride ion. Therefore, when divalent ions such as sulfate are present in the electrodialysis, it is possible to reduce the movement amount of water and highly concentrate the copper and nickel in the plating wastewater.

• 한국표면공학회지
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• 제15권1호
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• pp.1-10
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• 1982

Electroless plating is the continious formation of metallic coatings from metal ions by che-mical reduction without the use of electrical current. This is, however, more expansive than the conventional electroplating but is often used because of certain adventage. Here, general description of past research on electroless nickel plating, especially about the merits of each research was given. Part(Ⅰ) is for the conposition of solution, pretreatment and facilities of electroless nickel plating.

• Journal of Electrochemical Science and Technology
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• 제4권2호
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• pp.57-60
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• 2013

Nickel is a good electrocatalytic metal and nickel electrodes find many applications in different electrochemical fields. The nickel plated electrodes were prepared by electro-deposition technique on mild steel surface modified with in-situ deposition of nickel titanate. The SEM images shows that the nickel plating on nickel titanate modified mild steel shows better adherence than the nickel plating on bare mild steel surfaces. The extent of polarization of the nickel plating on mild steel with nickel titanate was lower than that of nickel plating on mild steel. The incorporation of nickel titanate on mild steel surface before nickel plating enhances physical, chemical and electrochemical properties of the plating film.

• Journal of Ceramic Processing Research
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• 제19권6호
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• pp.455-460
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• 2018

Chromium plating is a common surface treatment technique extensively applied in industry due its excellent properties which include substantial hardness, abrasion resistance, corrosion resistance, surface color, and luster. In this study, the effect of PTFE on corrosion behavior of Cr-P plating, low carbon steel substrates are electroplated in Cr(III) baths without and with PTFE. Trivalent chromium carbon plating was electroplated from trivalent chromium sulfate-based baths with different PTFE dispersion contents. The study focused on the microstructure, PTFE content, roughness, and corrosion resistance of the Cr-P-PTFE composite plating. Scanning electron microscopy and atomic force microscopy images showed a smoother plating and a decrease in the surface roughness of the electrodeposited. The results demonstrate that PTFE eliminates the cracks within plating by reducing internal stress. Therefore, the corrosion resistance of Cr-P-PTFE composite platings were better than that of Cr-P alloy platings.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.444-445
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• 2009

The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on $0.2\sim0.6\;{\Omega}{\cdot}cm$, $20\;\times\;20\;mm^2$, CZ(Czochralski) wafer.

• 한국정밀공학회지
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• 제29권1호
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• pp.41-47
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• 2012

The LDS(Laser Direct Structuring) is one of the new direct writing methods to fabricate conductive patterns by energy beam. It uses thermoplastic polymers with an additive compound that serves as plating seed after the activation by laser. The advantages of LDS include the miniaturization of electrical components, design flexibility, and a reduced number of production steps. The purpose of this study is to investigate the fundamental mechanism for LDS and the characteristics of conductive patterns by laser parameters. These results were studied by SEM, EDX, and XPS analysis. We have used a 20W pulse-modulated fiber laser and copper electroless plating to fabricate conductive patterns on polymer. The result showed that electroless copper plating seed caused the laser cracking of additive compound. In particular, the additive compound contained in copper metal oxides atoms will be changed to copper metal elements. Also, the characteristics of conductive patterns were dependent on laser parameter, especially laser fluence.