Transactions of the Korean hydrogen and new energy society (한국수소및신에너지학회논문집)

The Korean Hydrogen and New Energy Society (한국수소및신에너지학회)
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The Effect of Acid Treatment Time for Ni Plating on the Joint of α-Al2O3 and Ni Metal

α-Al2O3와 Ni 금속 접합을 위한 Ni 무전해 도금시 산처리의 영향

  • YI, EUNJEONG (Electronic Materials Convergence Division, Korea Institute of Ceramic Engineering & Technology) ;
  • AN, YONGTAE (Electronic Materials Convergence Division, Korea Institute of Ceramic Engineering & Technology) ;
  • CHOI, BYUNGHYUN (Electronic Materials Convergence Division, Korea Institute of Ceramic Engineering & Technology) ;
  • JI, MIJUNG (Electronic Materials Convergence Division, Korea Institute of Ceramic Engineering & Technology) ;
  • HWANG, HAEJIN (School of Materials Science and Engineering Inha University)
  • 이은정 (한국세라믹기술원 에너지환경소재본부) ;
  • 안용태 (한국세라믹기술원 에너지환경소재본부) ;
  • 최병현 (한국세라믹기술원 에너지환경소재본부) ;
  • 지미정 (한국세라믹기술원 에너지환경소재본부) ;
  • 황해진 (인하대학교 신소재공학과)
  • Received : 2016.05.14
  • Accepted : 2016.06.30
  • Published : 2016.06.30
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Abstract

In Na-base Battery for ESS, ${\alpha}-Al_2O_3$ and metal bonding was used to prevent direct reaction between electrolyte and electrode. The hard metal was metalized at $1600^{\circ}C$ in a flowing hydrogen gas for high bonding strength. In this study, instead of hard metal metalizing, Ni was plated on ${\alpha}-Al_2O_3$ by electroless Ni plating technique and then bonded with metal. To enhance the bonding strength, surface of ${\alpha}-Al_2O_3$ was treated with $H_3PO_4$. The effects of strength and leakage of joining as a function of acid treatment time on ${\alpha}-Al_2O_3$ are described.

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References

  1. J.H. Hwang, S.M. Bae, M. K. Kim, "Large Scale Power Storage NaS battery", CERAMIST, Vol. 15, No. 2, 2012, p. 45-52
  2. C. Dustmann, "Advances in ZEBRA batteris", J. Power Sources, Vol. 127, 2004 p. 85-92. https://doi.org/10.1016/j.jpowsour.2003.09.039
  3. H. S. Kim, S. M. Lee, "R&D Status of Na/NiCl2 Battery" J. Korean Electrochemical Society, Vol. 15, No. 3, 2012, p. 124-134. https://doi.org/10.5229/JKES.2012.15.3.124
  4. Y.M Hyun, S.Y.Yu, J.Y. Yoon, B.Y. Kim, S.J. Kim, S.H. Tahk,H.S. Kim, "Effect of Heat Treatment on the Adhesive Strength of Electoless Nickel Deposits", J. Korean Institute of Surface Engineering Vol. 44, No. 6, 2011, p. 246-249. https://doi.org/10.5695/JKISE.2011.44.6.246
  5. Y.K. Cho, K.Y. Ahn, Y.S. Park, "A study on adhesion strength of electroless plated deposits on Alumina substrate", J. The Korean Institute of Surface Engineering, Vol. 24, No. 4, 1991. p. 187-195.
  6. S. Afroukhteh, C. Dehghaniann, M. Emamy, "Preparation of electroless Ni-P composite coatings containing nano-scattered alumina in presence of polymeric surfactant", Progress in Natural Science Vol. 22, No. 4, 2012, p. 318-325. https://doi.org/10.1016/j.pnsc.2012.06.006
  7. R.L.Deuis, C. Subramanian, J.M. Yellup, K.N. Strafford, P. Arora, "Study of electroless nickel plating of ceramic particles", Scripta metallurgica et materialia, Vol. 33, No. 8, 1995, p. 1217-1224. https://doi.org/10.1016/0956-716X(95)00353-W
  8. Y.K. Cho, K.Y. Ahn, Y.S. Park, "A study on adhesion strength of electroless plated deposits on Alumina substrate", J. The Korean Institute of Surface Engineering, Vol. 24, No. 4, 1991, p. 187-195.
  9. C,M.Lee, J. M. Jeon, J. Y. Hur, H. K. Lee, "Effect of Complexing Agents on Adhesion Strength between Electroless Copper Film and Ta Diffusion Barrier", J. The Korean Institute of Surface Engineering, Vol. 47, No. 4, 2014, p. 162-167. https://doi.org/10.5695/JKISE.2014.47.4.162
  10. M. K. Jang, K. D. Kim, H. K. Kwon, "Determination of Ni Coating Thickness for the Improvement of Solder Joint Reliability", J. the Korea Entertainment Industry Association, Vol. 7, No. 4, 2013, p. 317-322. https://doi.org/10.21184/jkeia.2013.12.7.4.317