Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Electrolysis for NiW Functional Alloy Plating

NiW 기능성 합금도금을 위한 전해

  • Jeong, Goo-Jin (Green Energy System Center, Kumoh National Institute of Technology) ;
  • Lee, Churl-Kyoung (School of Advanced Materials & System Eng., Kumoh National Institute of Technology)
  • 정구진 (금오공과대학교 그린에너지인력양성센터) ;
  • 이철경 (금오공과대학교 신소재시스템공학부)
  • Received : 2011.01.04
  • Accepted : 2011.02.27
  • Published : 2011.02.28
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Abstract

A NiW functional alloy plating was investigated as variables of metal ion concentration, complexing agent, temperature, pH and applied current density. Even if numerous studies on reaction mechanism of NiW induced codeposition were carried out during couples of decade, it has not been acceptable reaction mechanism. This study was focused on the effect of the plating variables on the alloy composition in the NiW alloy plating. Applied current density could control mainly the alloy composition rather than other plating variables. It has also been confirmed that the functional alloy plating such as layered or gradient plating was possible by controlling applied current density.

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References

  1. M. L. Holt, L. E. Vaaler, Trans. Electrochem. Soc., 82 (1942) 193. https://doi.org/10.1149/1.3071407
  2. A. Brenner, P. Burkhead, E. Seegmiller, J. Res. Natl. Bur. Stand., 39 (1947) 351. https://doi.org/10.6028/jres.039.023
  3. M. L. Holt, L. E. Vaaler, J. Electrochem. Soc., 94 (1948) 50. https://doi.org/10.1149/1.2773824
  4. M. Kawane, J. Electrochem. Soc., Japan, 17 (1949) 231.
  5. R. F. McElwee, M. L. Holt, J. Electrochem. Soc., 99 (1952) 48. https://doi.org/10.1149/1.2779664
  6. T. Ishida, S. Yoshioka, K. Mizuno, T. Kudo, Japanese Patent, 6064 (1958).
  7. J. S. Sallo, R. D. Fisher, J. Electrochem. Soc., 107 (1960) 277. https://doi.org/10.1149/1.2427678
  8. B. S. R. Sastry, Met. Finish., 63(10) (1965) 86.
  9. T. Omi, H. Yamamoto, H. L. Glass, J. Electrochem. Soc., 119(2) (1972) 168. https://doi.org/10.1149/1.2404154
  10. G. A. Croopnick, D. M. Scruggs, U.S. Patent, 4,529,668 (1985).
  11. Y. Nishi, Y. Mogi, K. Oguri, T. Watanabe, J. Mater. Sci. Lett., 14 (1995) 1. https://doi.org/10.1007/BF02565266
  12. T. Omi, M. Okuda, Denki Gakaku, 60-6 (1992) 550.