• Proceedings of the IEEK Conference
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• 1999.11a
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• pp.360-363
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• 1999

Video data compression is a major key technology in the field of multimedia applications. Variable-length coding is the most popular data compression technique which has been used in many data compression standards, such as JPEG, MPEG and image data compression standards, etc. In this paper, we present memory efficient VLC decoder architecture for MPEG-2 application which can achieve small memory space and higher throughput. To reduce the memory size, we propose a new grouping, remainder generation method and merged lookup table (LUT) for variable length decoders (VLD's). In the MPEG-2, the discrete cosine transform (DCT) coefficient table zero and one are mapped onto one memory whose space requirement has been minimized by using efficient memory mapping strategy The proposed memory size is only 256 words in spite of mapping two DCT coefficient tables.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.5
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• pp.32-38
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• 2009

FTT(Fast Fourier Transform) processor is widely used in OFDM(Orthogonal Frequency Division Multiplesing) system. Because of the increased requirement of mobility and bandwidth in the OFDM system, they need large point FTT processor. Since the size of memory which stores the twiddle factor coefficients are proportional to the N of FFT size, we propose a new method by which we can reduce the size of the coefficient memory. In the proposed method, we exploit a counter and unsigned multiplier to generate the twiddle factor indices. To verify the proposed algorithm, we design TFCGs(Twiddle Factor Coefficient Generator) for 1024pint FFTs with R2SDF(Radix-2 Single-Path Delay Feedback), $R2^3SDF,\;R2^3SDF,\;R2^4SDF$ architectures. The size of ROM is reduced to 1/8N. In the case of $R2^4SDF$ architecture, the area and the power are reduced by 57.9%, 57.5% respectively.

• Steel and Composite Structures
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• v.36 no.6
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• pp.671-687
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• 2020

The aim of this research is to analyze buckling and bending behavior of a sandwich Reddy beam with porous core and composite face sheets reinforced by boron nitride nanotubes (BNNTs) and shape memory alloy (SMA) wires resting on Vlasov's foundation. To this end, first, displacement field's equations are written based on the higher-order shear deformation theory (HSDT). And also, to model the SMA wire properties, constitutive equation of Brinson is used. Then, by utilizing the principle of minimum potential energy, the governing equations are derived and also, Navier's analytical solution is applied to solve the governing equations of the sandwich beam. The effect of some important parameters such as SMA temperature, the volume fraction of SMA, the coefficient of porosity, different patterns of BNNTs and porous distributions on the behavior of buckling and bending of the sandwich beam are investigated. The obtained results show that when SMA wires are in martensite phase, the maximum deflection of the sandwich beam decreases and the critical buckling load increases significantly. Furthermore, the porosity coefficient plays an important role in the maximum deflection and the critical buckling load. It is concluded that increasing porosity coefficient, regardless of porous distribution, leads to an increase in the critical buckling load and a decrease in the maximum deflection of the sandwich beam.

• Structural Engineering and Mechanics
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• v.25 no.5
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• pp.597-611
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• 2007

Many works have been done in classical theory of thermoelasticity in materials with memory by researchers like Nunziato, Chen and Gurtine and many others. No work is located in generalized thermoelasticity regarding materials with memory till date. The present paper deals with the wave propagation in materials with memory in generalized thermoelasticity. Plane progressive waves and Rayleigh waves have been discussed in details. In the classical theory of heat conduction it was observed that heat propagates with infinite speed. This paradox has been removed in the present discussion. The set of governing equations has been developed in the present analysis. The results of wave velocity and attenuation coefficient corresponding to low and high frequency have been obtained. For thermal wave the results show appreciable differences with those in the usual thermoelasticity theory.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• Transactions on Electrical and Electronic Materials
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• v.6 no.6
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• pp.276-279
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• 2005

Influences of sustain pulse-width on electrical characteristics and luminous efficiency are experimentally investigated for surface discharge of AC-PDP. A square pulse with variable duty ratio and fixed rising time of 300 ns has been used in the experiment. It is found that the memory coefficient is significantly increased at the critical pulse-width. And the wall charges and wall voltages as well as capacitances are experimentally measured by Q- V analysis method along with the voltage margin relation, in terms of the sustain pulse-width in the range of $1{\mu}s$ to $5{\mu}s$ under driving frequency of 10 kHz to 180 kHz. And the luminous efficiency is also experimentally investigated in above range of sustain pulse-width with driving frequency of 10 kHz to 180 kHz. It is noted that the luminous efficiency for 10 kHz and 180 kHz are 1.29 1m/W and 0.68 1m/W respectively, since the power consumption for 10 kHz is much less than that for 180 kHz. It has been concluded that the optimal sustain pulse-width is in the range of $2.5 {\~}4.5{\mu}s$ under driving frequency range of 10 kHz and 60 kHz, and in the range of $1.5 {\~} 2.5{\mu}s$ under driving frequency range of 120 kHz and 180 kHz based on observation of memory coefficient, and wall voltage as well as luminous efficiency.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.1
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• pp.25-31
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• 2001

The theoretical modeling to predict the modulus of elasticity by the shape memory effect of dispersed particles in a metal matrix composite was studied. The modeling approach is based on the Eshelbys equivalent inclusion method and Mori-Tanakas mean field theory. The calculation was performed on the TiNi particle dispersed Al metal matrix composites(PDMMC) with varying volume fractions and prestrains of the particle. It was found that the prestrain has no effect on the Yonugs modulus of PDMMC but the volume fraction does affects it. This approach has an advantage of definite control of Youngs modulus in PDMMCs.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1998.04a
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• pp.353-358
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• 1998

In general, we have used the finite element method(FEM) to find natural frequencies of plates. In this method, however, it is necessary to use a large amount of computer memory and computation time because the FEM requires many degrees of freedom for finding natural frequencies of plates correctly. Therefore it was very difficult to analyze the free vibration of plates correctly on personal computer. For overcoming this disadvantage of the FEM, the authors have developed the finite element-transfer stiffness coefficient method(FE-TSCM) which is based on the concept of modeling techniques in the FEM and the transfer of the stiffness coefficient in the transfer stiffness coefficient method. In this paper, we formulate free vibration analysis algorithm of rectangular plates using the FE-TSCM. Some numerical examples of rectangular plates are proposed, and their results and computation times obtained by the FE-TSCM are compared with those by the FEM and the finite element-transfer matrix method in order to demonstrate the accuracy and efficiency of the FE-TSCM.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1997.10a
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• pp.190-195
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• 1997

Recently it is increased by degrees to construct complex or large lattice type structures such as bridges, towers, cranes, and structures that can be used for space technology. In general, in order to analyze, these structures we have used the finite element method(FEM). In this method, however, it is necessary to use a large amount of computer memory and computation time because the FEM requires many degrees of freedom for solving dynamic problems for these structures. For overcoming this problem, the authors have developed the transfer dynamic stiffness coefficient method(TDSCM). This method is based on the concepts of the transfer and the synthesis of the dynamic stiffness coefficient which is related to force and displacement vector at each node. In this paper, the authors formulate vibration analysis algorithm for a complex and large lattice type structure using the transfer of the dynamic stiffness coefficient. And the validity of TDSCM demonstrated through numerical computational and experimental results.

• Journal of Korea Society of Industrial Information Systems
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• v.16 no.3
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• pp.23-33
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• 2011

In this paper, the wavelet image coder, that can encode the bit-level information of wavelet coefficients, is proposed. The proposed coder is used the modified EZW algorithm and significant coefficient array that has bit level information of the wavelet coefficients to reduce the memory requirement in coding process. The significant coefficient array is two dimensional data structure that has bit level information of the wavelet coefficients. The proposed algorithm performs the coding of the significance coefficients and coding of bit level information of wavelet coefficients at a time by using the significant coefficient array. Experimental results show a better or similar performance of the proposed method when compared with conventional embedded wavelet coding algorithm. Especially, the proposed algorithm performs stably without image distortion at various bit rates with minimum memory usage by using the significant coefficient array.