• The Korean Journal of Ceramics
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• v.6 no.3
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• pp.318-321
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• 2000

Most compressive strengths commonly used in the construction field are in a range of 240 to 300 kgf/$\textrm{cm}^2$ at 28 days. To get this rage of strengths, however, high-flowing concrete requires cementitious binders more than 400 to 450 kg/$\textrm{cm}^2$ for preventing segregation and sedimentation of aggregates. This amount of cementitious binder generates a large emission of excessive hydration heat, which may consequently induce harmful cracks in concrete structure. In order to reduce excessive hydration heat, thus, this paper aims at fabricating a high-flowing concrete under the condition that cement content is kept as low as 350kg/$\textrm{cm}^3$ by using viscose agents. In a parametric study, effects of cement types such as a ternary blended cement and Type V on he physical characteristics of high-flowing concrete were evaluated. In addition, the influence of viscosity was also investigated by applying two different viscose agents, one in a range of 6,000 to 10,000 cps and the others of 10,000 to 14,000 cps. In terms of chemical admixtures used in concrete mixture, the superplasticizer was Sulfonated Melamine-Formaldehyde Condensate with about 30,000 of molecular weight, and main component of viscose agent was HPMC (Hydroxy Propyl Methyl Cellulose). Slump flow was fixed at 50cm with different dosages of superplasticizer in weight.

• Journal of the Korean Applied Science and Technology
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• v.18 no.4
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• pp.273-284
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• 2001

A series of microcapsule were synthesized by using several PCM(Phase Change Material) as a core material and gelatin/arabic gum, melamine/formaldehyde as a shell material. Coacervation technique and in situ polymerization were adopted in synthesizing microcapsules. In the microencapsulation by coacervation, tetradecane and octadecane were used as core materials. In the microencapsulation by situ polymerization tetradecane, pentadecane, hexadecane, heptadecane, octadecane, and nonadecane were used as core material. The synthesized microcapsule was examined to observe the shape of the microcapsule. The particle size analysis was performed by particle size analyzer. The thermal properties(e.g. melting point, heat of melting, crystallization temperature, heat of crystallization, differences between melting point and crystallization temperature) were obtained by DSC(Differential Scanning Calorimeter). The stirring rate effect was investigated during the microencapsulation. It was found that with increasing the stirring rate much smaller microcapule was produced. However, this did not necessarily lead to formation of spherical microcapsule.

• Journal of the Korean Wood Science and Technology
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• v.51 no.6
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• pp.470-480
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• 2023

This study aimed to develop a sound-absorbing composite using sugarcane bagasse (SB) and coffee silver skin (CS) as raw materials. The composite boards were manufactured by bonding the fibers with Melamine Urea-Formaldehyde adhesive, ensuring a consistent thickness of 30 mm. Various densities were employed, namely 380, 450, and 520 kg/m³. The samples were fabricated with different fiber ratios, including SB100%, SB75% with CS25%, and SB50% with CS50%. The sound absorption coefficient (SAC) and noise reduction coefficient (NRC) were measured using the impedance tube method within a frequency range of 63-6,300 Hz. The experimental results revealed that the mixing ratio of CS exerted a notable influence on enhancing the SAC, while the density of the composite board exhibited a significant impact on increasing both the SAC and NRC. Among the densities tested, the optimal value was observed at 520 kg/m³, yielding a SAC value of 0.65 at a frequency of 1,000 Hz and an NRC value of 0.55 for the SB50-CS50 composite plate. These findings underscore the importance of considering the CS mixing ratio and composite board density when aiming to optimize sound absorption properties.

• Journal of the Korean Wood Science and Technology
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• v.43 no.4
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• pp.528-537
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• 2015

To reuse the waste bone from restaurants or butcher houses, the possibility of using waste bone powder after cooking as a filler for wood adhesives used in manufacturing plywood was investigated. Radiata pine (Pinus radiata D. Don) plywoods were manufactured by using commonly used wood adhesives such as urea-melamine formaldehyde (UMF) resin, urea-formaldehyde (UF) resin, and phenol-formaldehyde (PF) resin and the prepared fillers from cattle bone powder, pig bone powder, and seashell powder. Plywood fabricated by using cattle bone powder, pig bone powder, and seashell powder showed weaker performance in dry and wet glue-joint shear strength and wood failure than those of the plywood with wheat flour. The result showed that it was hard to use only bone powder for the replacement of wheat flour. However, the filler mixed with wheat flour and bone powders showed equivalent dry bonding strength and better water resistance than the wheat flour, indicating that bone powders mixed with wheat flour might be used for the manufacture of plywood. When bone powders were mixed with wheat flour as adhesive fillers the shell powder showed the lowest bonding properties and there was no big difference between the cattle bone powder and the pig bone powder.

• Journal of the Korean Wood Science and Technology
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• v.45 no.5
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• pp.580-587
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• 2017

Woodfiber insulation board can be considered as a one of the key material for low energy consumption, comfortable and safety construction of residential space because of its eco-friendly and high thermal insulation performance. This study was carried out to investigate the formaldehyde (HCHO) total volatile organic compounds (TVOC) emission properties and combustion shapes by flame test of low density fiberboards (LDFs) prepared with different adhesives. HCHO TVOC emission and combustion properties of LDFs prepared by melamine urea formaldehyde (MUF), phenol formaldehyde (PF), emulsified methylene diphenyl diisocyanate (eMDI) and latex resin adhesives were measured by desiccator method, 20 L chamber method, and flame test, respectively. As results, LDFs manufactured by MUF, eMDI and latex resin adhesives satisfied the Super $E_0$ grade of HCHO emission performance except PF resin. Furthermore, TVOC emission of all LDFs were satisfied the Korean indoor air quality standard (below $400{\mu}g/m^2{\cdot}h$). Especially, LDF with eMDI resin adhesive showed the lowest HCHO and TVOC emissivity, that $0.14mg/{\ell}$, $12{\mu}g/m^2{\cdot}h$, respectively. However, eMDI emitted the small amount ($3{\mu}g/m^2{\cdot}h$) of toluene in VOC components. In the flame test, LDF with MUF resin adhesives showed the most favorable shape after flame test compare to LDFs prepared other adhesives. Based on HCHO and TVOC emission, and combustion shapes, MUF resin adhesive may be recommended to prepare LDF for insulation purpose.

• Journal of the Korean Wood Science and Technology
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• v.45 no.3
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• pp.360-367
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• 2017

This study was carried out to compare the characteristics of low density fiberboards (LDFs) manufactured with different adhesive types such as melamine urea formaldehyde (MUF), phenol formalehyde (PF), emulsified MDI (eMDI) and latexes resins. As results, hard LDFs were successfully manufactured by MUF, PF and eMDI resins. Thermal conductivities of all LDFs were significantly lower than commercial medium density fiberboard. Especially, all LDFs showed comparable thermal insulation performance with extruded polystyrene foam (XPS). LDF manufactured with eMDI resins showed the highest physical properties such as thickness/length swelling by water absorption and bending strength.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.473-473
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• 2013

전자종이, 입을 수 있는 디스플레이, 플렉서블 터치 스크린, 투과성 면 등과 같은 차세대 플렉서블 투명 전자소자는 기계적으로 유연하고 광학적으로 투명하며 무게가 가벼운 특성을 지녀야 할 것으로 예상된다. 현재까지는Indium tin oxide (ITO), zinc tin oxide (ZTO), carbon nano tube (CNT)와 polyimide 계열의 물질들이flexible, wearable, and transparent electronics (FWTEs) 소자의 electrode, active channel, dielectric layers로 제안되어 활발히 연구되었다. 최근에는 높은 이동도(~200,000 cm2/Vs) 및 유연성(fracture strain of 30%), 투명도 (97.5% for monolayer)와 같은 특성을 갖는 그래핀에 대한 연구가 활발히 진행되고 있다. 그러나 그래핀을 차세대 플렉서블 투명 전자소자 구현에 적용하기 위해서는 플렉서블하고 투명한 절연체의 확보 및 그래핀의 진성(intrinsic) 특성 유지 등과 같은 문제점들을 해결해야 한다. 따라서, 본 연구팀에서는 그래핀 기반 플렉서블 투명 전자소자의 게이트 절연층으로 적합한 poly-4-vinylphenol/poly (melamineco-formaldehyde) (PVP/PMF) 물질을 제시하고 이에 대한 전기적 재료적 분석을 수행하였다. 특히 다양한 PVP와 PMF의 비율 및 가열(annealing 혹은 curing) 온도에서 형성된 PVP/PMF 층의 화학 및 전기적 특성을 FT-IR, I-V, 그리고 C-V 측정을 통해 확인하였다. PVP/PMF는 유기절연 물질의 하나로서 높은 유연성과 투명도를 갖고 있을 뿐만 아니라 그래핀에 적용 시 그래핀의 진성 특성을 확보할 수 있다. 이는 PVP/PMF에 존재하는 hydroxyl (-OH) 그룹과 그래핀 상에서 정공(hole)을 공급하는 것으로 알려져 있는 -OH 그룹들간의 cross-linking 메커니즘에 의한 것으로 예상된다. 마지막으로 최적화된 PVP/PMF (낮은 hysteresis 전압)를 게이트 절연층에 적용하여 polyethylene terephthalate (PET) 기판 및 연구원의 손가락 위에 95.8%의 투명도 및 0에 가까운 Dirac point를 갖는 그래핀 기반 플렉서블 투명 전자소자를 성공적으로 집적하였다.

• Korean Journal of Materials Research
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• v.16 no.5
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• pp.302-307
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• 2006

The formation and processing of organic insulators on the device performance have been studied in the fabrication of organic thin film transistors (OTFTs). The series of polyvinyls, poly-4-vinyl phenol(PVP) and polyvinyltoluene (PVT), were used as solutes and propylene glycol monomethyl ether acetate(PGMEA) as a solvent in the formation of organic insulators. The cross-linking of organic insulators was also attempted by adding the thermosetting material, poly (melamine-co-formaldehyde) as a hardener in the compound. The electrical characteristics measured in the metal-insulator-metal (MIM) structures showed that insulating properties of PVP layers were generally superior to those of PVT layers. Among the layers of PVP series: PVP(10 wt%) copolymer, 5 wt% cross-linked PVP(10 wt%), PVP(20 wt%) copolymer, 5 wt% cross-linked PVP(20 wt%) and 10 wt% cross-linked PVP(20 wt%), the 10 wt% cross-linked PVP(20 wt%) layer showed the lowest leakage current characteristics. Finally, inverted staggered OTFTs using the PVP(20 wt%) copolymer, 5 wt% cross-linked PVP(20 wt%) and 10 wt% cross-linked PVP(20 wt%) as gate insulators were fabricated on the polyether sulphone (PES) substrates. In our experiments, we could obtain the maximum field effect mobility of 0.31 $cm^2/Vs$ in the device from 5 wt% cross-linked PVP(20 wt%) and the highest on/off current ratio of $1.92{\times}10^5$ in the device from 10 wt% cross-linked PVP(20 wt%).

• Journal of the Semiconductor & Display Technology
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• v.5 no.1 s.14
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• pp.39-43
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• 2006

The polyvinyl series organic films as gate insulators of thin film transistor(TFT) have been processed and characterized on the polyether sulphone (PES) substrates . The poly-4-vinyl phenol(PVP) and polyvinyl toluene (PVT) were used as solutes and propylene glycol monomethyl ether acetate(PGMEA) as a solvent in the formation of organic insulators. The cross-linking of organic insulators was also attempted by adding the thermosetting material, poly (melamine-co-formaldehyde) as a hardener in the compound. The electrical characteristics measured in the metal-insulator-metal (MIM) structures showed that insulating properties of PVP layers were generally superior to those of PVT layers. Among the layers of PVP series; copolymer PVP(10 wt%), 5wt% cross-linked PVP(10 wt%), copolymer PVP(20 wt%), 5 wt% cross-linked PVP(20 wt%) and 10 wt% cross-linked PVP(20 wt%), the 10 wt% cross-linked PVP(20 wt%) layer showed the lowest leakage current of 1.2 pA at ${\pm}10V$. The ms value of surface roughness and the capcitance per unit area are 2.41 and $1.76nF/cm^2$ in the case of 10 wt% cross-linked PVP(20 wt%) layer, respectively.

• Journal of the Korean Society of Clothing and Textiles
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• v.13 no.4
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• pp.357-369
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• 1989

The purpose of this study was to investigate the effects of treatment temperature and time on the, of easy-care and strength properties of the wet fixation processed rayon fabrics. Viscose rayon fabrics were treated with mixed resins of melamine formaldehyde (MF) and DMDHEU by one bath and two bath wet fixation processes. The MF/DMDHEU mixed resin concentrations were 50/100, 50/150, 100/100 and 100/150(g/1). Magnasium chloride was used as a catalyst. The wet fixation conditions were 24hrs at room temperature,20 mins at $75^{\circ}C$ and 5 mins at $105^{\circ}C$ Wet fixation processed fabrics did not show the difference in the resin add-one, DP ratings and wrinkle recovery angles by the different treatment temperatures and times. DP ratings were in the order of $105^{\circ}C>75^{\circ}C>room$ temp, in one bath and two bath wet fixation. Breaking and tearing strength of one bath processed fabrics showed in the order of $75^{\circ}C>room\;temp>105^{\circ}C$ The breaking strength of two bath processed fabrics showed in the order of $105^{\circ}C>75^{\circ}C>room$ temp. Tearing strength showed in the order of $75^{\circ}c>105^{\circ}C>room$ temp. Abrasion resistances were in the order of $75^{\circ}C>105^{\circ}C>room$ temp. in one bath and two bath processes.