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http://dx.doi.org/10.5658/WOOD.2017.45.3.360

Characteristics of Low Density Fiberboards for Insulation Material with Different Adhesives (I) - Thermal Insulation Performance and Physical Properties -  

Jang, Jae-Hyuk (Department of Forest Products, National Institute of Forest Science)
Lee, Min (Department of Forest Products, National Institute of Forest Science)
Kang, Eun-Chang (Department of Forest Products, National Institute of Forest Science)
Lee, Sang-Min (Department of Forest Products, National Institute of Forest Science)
Publication Information
Journal of the Korean Wood Science and Technology / v.45, no.3, 2017 , pp. 360-367 More about this Journal
Abstract
This study was carried out to compare the characteristics of low density fiberboards (LDFs) manufactured with different adhesive types such as melamine urea formaldehyde (MUF), phenol formalehyde (PF), emulsified MDI (eMDI) and latexes resins. As results, hard LDFs were successfully manufactured by MUF, PF and eMDI resins. Thermal conductivities of all LDFs were significantly lower than commercial medium density fiberboard. Especially, all LDFs showed comparable thermal insulation performance with extruded polystyrene foam (XPS). LDF manufactured with eMDI resins showed the highest physical properties such as thickness/length swelling by water absorption and bending strength.
Keywords
low density fiberboard; eMDI; latex; thermal insulation; thermal conductivity;
Citations & Related Records
Times Cited By KSCI : 7  (Citation Analysis)
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