• The KSFM Journal of Fluid Machinery
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• v.18 no.6
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• pp.27-30
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• 2015

In this study, we attempted to harvest energy using water droplet based on Reverse Electro Wetting On Dielectric (REWOD) phenomenon between water droplet and dielectric surface without external bias. REWOD device can be fabricated via simple coating process, which is highly economic and easy. We believe that our system is well-suited for IoT(Internet of Things) embedded electronics that require low but consistent electricity. Moreover, our device can be integrated with window to generate electricity upon raindrops.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.11
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• pp.3072-3083
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• 1995

The numerical simulation on the three-dimensional natural convection heat transfer in the enclosure with heat generating chip is performed, and the effects of convective heat loss and vents are also examined. The effects of the Rayleigh number and outer Nusselt number (Nu$_{0}$) on the maximum chip temperature and the fractions of heat loss from the hot surfaces are investigated. The results show that conduction through the substrate is dominant in heat dissipation. With the increase of Rayleigh number, heat dissipation through the chip surfaces increases and heat loss through the substrate decreases. Maximum dimensionless temperature with vents is found to decrease about 40% compared to the one without vents at Nu$_{0}$=0.l. It is also shown that effects of size and location of the vents are negligible.ble.

• International Journal of Air-Conditioning and Refrigeration
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• v.13 no.3
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• pp.158-166
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• 2005

The present study investigated experimentally and numerically the enhancement of absorption performance due to the waviness of falling film in the vertical absorber tube. The momentum, energy and mass diffusion equations were utilized to find out temperature and concentration profiles at both the interfaces of liquid solution and refrigerant vapor and the wall. Flow visualization was performed to find out the wetting characteristics of the falling film. The maximum heat transfer coefficient was obtained for the wavy flow using spring as an insert device through both numerical and experimental studies. Based on the numerical and experimental results, the maximum absorption rate was found for the wavy-flow using spring as the insert device. The differences between experimental and analytical results ranged from $5.0\;to\;25\%\;when\;Re_j>100$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.12
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• pp.1084-1090
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• 1998

As device sizes are scaled down to submicron dimensions, planarization technology becomes increasingly important for both device fabrication and formation of multilevel interconnects. Chemical mechanical polishing (CMP) has emerged recently as a new processing technique for achieving a high degree of planarization for submicron VLSI applications. The polishing process has many variables, and most of which are not well understood. The factors determine the planarization performance are slurry and pad type, insert material, conditioning technique, and choice of polishing tool. Circuit density, pattern size, and wiring layout also affect the performance of a CMP planarization process. This paper presents the results of studies on CMP process window characterization for 0.35 micron process with 5 metal layers.

• Journal of the Korean Society of Combustion
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• v.22 no.1
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• pp.23-31
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• 2017

Large-scale fuel tanks emit massive amount of hardly-combustible VOC mixtures which are light hydrocarbon species in dilution with nitrogen and carbon dioxide. We have developed a lab-scale burner to combust those VOC mixtures by use of a turbulent partially-premixed flame as a pilot flame. For a higher HC treatment ratio, the mixture gases were reformed by a rotating arc plasma device. The results showed that the nitrogen mole fraction and the injecting speed of the VOC mixture influence on the performance of the burner. It was also found that the size of the pilot flame and the power supplied to the plasma device determine the overall HC treatment ratio and the concentrations of CO and NOx in the exhaust gas.

• Journal of the Korean Society of Safety
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• v.29 no.1
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• pp.41-46
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• 2014

The design of a 7 degree of freedom motion capture device(MCD) has been presented. The newly designed MCD overcomes the shortcomings of the existing CADEN-7 exoskeleton robot by implementing various ergonomic design. To improve ease of operation, light-weight high-strength materials such as carbon pipes and engineering plastics were used to reduce weight of the MCD and arm-length adjustment mechanism was also added. The MCD showed consistent measurement results in designed experiments involving change of arm posture from nominal configuration to either elbow-side or arm-front configurations. Furthermore, captured motion in more natural tennis swing appeared to agree well with visual observations made.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.325-326
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• 2006

In this study, in order to develop piezoelectric device for multilayer piezoelectric ultrasonic motor, low temperature sintering $Pb(Mn_{1/3}Nb_{2/3})_{0.02}(Ni_{1/3}Nb_{2/3})_{0.12}(Zr_{0.48}Ti_{0.52})_{0.86}O_3$ system ceramics were fabricated according to the variations of forming pressure of casting sheet. At the 300[$kgf/cm^2$] forming pressure, the maximum density of 7.8[$g/cm^3$] was obtained. At the 350[$kgf/cm^2$] forming pressure, the maximum values of effective electromechanical coupling factor $k_{cff}\;=\;0.24$ and mechanical quality factor Qm=628 were obtained.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.299-304
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• 2005

This paper describes the conceptual of device attached to rotary type sliding door system satisfying customer's reguirements. The TRIZ (Russian theory of Inventive Problem Solving) and Axiomatic Design methods are used for generating new ideas at the conceptual design stage efficiently. The ideas will be implemented in real products.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.7
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• pp.22-29
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• 2004

As a result of high integration of semiconductor device, the global planarization of multi-layer structures is necessary. So the chemical mechanical polishing(CMP) is widely applied to manufacturing the dielectric layer and metal line in the semiconductor device. CMP process is under influence of polisher, pad, slurry, and process itself, etc. In comparison with the general CMP which uses the slurry including abrasives, fixed abrasive pad takes advantage of planarity, resulting from decreasing pattern selectivity and defects such as dishing & erosion due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of fixed abrasive pad using hydrophilic polymers with swelling characteristic in water and explains the self-conditioning phenomenon. And the tungsten CMP using fixed abrasive pad achieved the good conclusion in terms of the removal rate, non-uniformity, surface roughness, material selectivity, micro-scratch free contemporary with the pad life-time.

• Journal of Sensor Science and Technology
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• v.31 no.2
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• pp.71-78
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• 2022

Wearable devices have the potential to revolutionize future medical diagnostics and personal healthcare. The integration of biosensors into scalable form factors allow continuous and noninvasive monitoring of key biomarkers and various physiological indicators. However, conventional wearable devices have critical limitations owing to their rigid and obtrusive interfaces. Recent developments in functional biocompatible materials, micro/nanofabrication methods, multimodal sensor mechanisms, and device integration technologies have provided the foundation for novel skin-interfaced bioelectronics for advanced and user-friendly wearable devices. Nonetheless, it is a great challenge to satisfy a wide range of design parameters in fabricating an authentic skin-interfaced device while maintaining its edge over conventional devices. This review highlights recent advances in skin-compatible materials, biosensor performance, and energy-harvesting methods that shed light on the future of wearable devices for digital health and personalized medicine.