• Journal of Mechanical Science and Technology
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• 제17권10호
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• pp.1475-1484
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• 2003

The EDM processing characteristics of one of the nickel-based heat resistant alloys, Hastelloy- X, were investigated under the various EDM conditions and analyzed in terms of surface integrity. This alloy is commonly used as a material for the hot gas path component of gas turbines and it is difficult to machine by conventional machining methods. The primary EDM parameter which was varied in this study were the pulse-on time. Since the pulse-on time is one of the main factors that determines the intensity of the electrical discharge energy, it was expected that the machining ratio and the surface integrity of the specimens would be proportionally dependent on the pulse-on duration. However, experimental results showed that MRR (material removal rate) and EWR (electrode wear rate) behaved nonlinearly with respect to the pulse duration, whereas the morphological and metallurgical features showed rather a constant trend of change by the pulse duration. In addition the heat treating process affected the recast layer and HAZ to be recrystallized but softening occurred in recast layer only. A metallurgical evaluation of the microstructure for the altered material zone was also conducted.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.569-570
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• 2006

The conditioning process is very important process for the CMP (Chemical Mechaning Polishing). This process regenerates the roughness of the polishing pad during the CMP process, increases the MRR (Material Removal Rate) and gives us longer pad life so conditioning process is essential for the CMP, and conditioning process influences the polishing pad shape gradually. Conditining process is related to the Non-Uniformity. In This paper, Kinematic of the conditioning process and mathematic modeling of the pad wear is studied and result shows how the various parameters influence the pad shape and WIWNU[1]. Consequently through these parameter, optimal design of the conditioning process equipment is predicted.

• Journal of Electrochemical Science and Technology
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• 제11권4호
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• pp.346-351
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• 2020

The removal characteristics of copper (Cu) from electrochemical surface by voltage-activated reaction were reviewed to assess the applicability of electrochemical-mechanical polishing (ECMP) process in three types of electrolytes, such as HNO₃, KNO₃ and NaNO₃. Electrochemical surface conditions such as active, passive, transient and trans-passive states were monitored from its current-voltage (I-V) characteristic curves obtained by linear sweep voltammetry (LSV) method. In addition, the oxidation and reduction process of the Cu surface by repetitive input of positive and negative voltages were evaluated from the I-V curve obtained using the cyclic voltammetry (CV) method. Finally, the X-ray diffraction (XRD) patterns and energy dispersive spectroscopy (EDS) analyses were used to observe the structural surface states of a Cu electrode. The electrochemical analyses proposed in this study will help to accurately control the material removal rate (MRR) from the actual ECMP process because they are a good methodology for predicting optimal electrochemical process parameters such as current density, operating voltage, and operating time before performing the ECMP process.

• 한국정밀공학회지
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• 제29권3호
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• pp.289-294
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• 2012

There are several indicators to represent characteristics of chemical mechanical planarization (CMP) such as material removal rate (MRR), surface quality and removal uniformity on a wafer surface. Especially, the removal uniformity on the wafer edge is one of the most important issues since it gives a significant impact on the yield of chip production on a wafer. Non-uniform removal rate at the wafer edge (edge effect) is mainly induced by a non-uniform pressure from nonuniform pad curvature during CMP process, resulting in edge exclusion which means the region that cannot be made to a chip. For this reason, authors tried to minimize the edge exclusion by using an edge profile control (EPC) ring. The EPC ring is equipped on the polishing head with the wafer to protect a wafer from the edge effect. Experimental results showed that the EPC ring could dramatically minimize the edge exclusion of the wafer. This study shows a possibility to improve the yield of chip production without special design changes of the CMP equipment.

• 대한기계학회논문집A
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• 제26권8호
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• pp.1480-1486
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• 2002

In this study, the cross-coupling control (CCC) with three new features is proposed to maintain contour precision in high-speed nonlinear contour machining. One is an improved contour error model that provides almost exact calculation of the errors. Another is the utilization of variable controller gains based on the instantaneous curvature of the contour and the variable command. For this scheme, a stability is analyzed. As a result, the stability region is obtained, and the variable gains are decided within that region. The other scheme in the proposed CCC is a real-time feedrate adaptation module to regulate cutting force fur better surface finish through regulation of material removal rate (MRR). The simulation results show that the proposed CCC system can provide better precision than the existing method particularly in high-speed machining of nonlinear contours.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2001년도 추계학술대회(한국공작기계학회)
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• pp.8-13
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• 2001

In the turning process, the feed is usually selected by a machining operator considering workpiece, cutting tool and depth of cut. Even if this selection can avoid power saturation or tool breakage, it is usually conservative compared to the capacity of the machine tools and can reduce the productivity significantly. This paper proposes a selection method of the feed and the reference cutting force based on MRR(material removal rate), maximum spindle power and specific energy. In order to estimate and control cutting force accurately in transient and steady state, this study utilizes a synthesized cutting force estimation method and a Fuzzy controller. The experimental results present that these systems can be useful for the FMS(flexible manufacturing system) and unmanned automation system.

• 대한기계학회논문집A
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• 제26권9호
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• pp.1888-1896
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• 2002

This study presents a new type of CNC interpolator that is capable of generating cutter paths for ball-end milling of NURBS surfaces. The proposed surface interpolator comprises real-time algorithms for cutter contact (CC) path scheduling and CC path interpolator. Especially in this study, a new interpolator module to regulate cutting forces is developed. This propose algorithm utilizes variable-feedrate commands along the CC path according to the curvature of machined surfaces during the interpolation process. Additionally, it proposes an OpenGL graphic library for computer graphics and animation of interpolated tool-position display. The proposed interpolator is evaluated and compared with the existing method based on constant feedrates through computer simulations.

• 대한기계학회논문집A
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• 제26권7호
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• pp.1446-1452
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• 2002

In the turning process, the feed is usually selected by a machining operator considering workpiece, cutting tool and depth of cut. Even if this selection can avoid power saturation or tool breakage, it is usually conservative compared to the capacity of the machine tools and can reduce the productivity significantly. This paper proposes a selection method of the feed and the reference cutting force based on MRR(material removal rate), maximum spindle power and specific energy. In order to estimate and control cutting force accurately in transient and steady state, this study utilizes a synthesized cutting force estimation method and a Fuzzy controller. The experimental results show that these systems can be useful for the unmanned turning process.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2000년도 추계학술대회논문집 - 한국공작기계학회
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• pp.8-13
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• 2000

In this paper, a new adaptive cross-coupling control (CCC) method with an improved contour error model is proposed to maintain contouring precision in high-speed nonlinear contour machining. The proposed method utilizes variable controller gains based on the instantaneous curvature of a contour and the feedrate command. In addition, a real-time federate adaptation scheme is included in the proposed CCC to regulate cutting force. The proposed method is evaluated and compared with the conventional CCC for nonlinear contouring motion through computer simulations. The simulation results show that the proposed CCC improves the contouring accuracy and regulates cutting force more effectively than the existing method.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.58-58
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• 2009

Uniformity related issues in chemical mechanical polishing (CMP) are within wafer non-uniformity (WIWNU), wafer to wafer non-uniformity (WTWNU), planarity and dishing/erosion. Here, the WIWNU that originates from spatial distribution of independent variables such as temperature, sliding distance, down force and material removal rate (MRR) during CMP, relies to spatial dependency. Among various sources of spatial irregularity, hardness and modulus of pad and surface roughness in sources for pad uniformity are great, especially. So, we investigated the spatial variation of pad surface characteristics using pad measuring system (PMS) and roughness measuring system. Reduced peak height ($R_{pk}$) of roughness parameter shows a strong correlation with the removal rate, and the distribution of relative sliding distance onwafer during polishing has an effect on the variation of $R_{pk}$ and WIWNU. Also, the results of pad wear profile thorough developed pad profiler well coincides with the kinematical simulation of conditioning, and it can contribute for the enhancement of WIWNU in CMP process.